GB939394A - Improved metal-supported electric circuit arrays - Google Patents

Improved metal-supported electric circuit arrays

Info

Publication number
GB939394A
GB939394A GB4219361A GB4219361A GB939394A GB 939394 A GB939394 A GB 939394A GB 4219361 A GB4219361 A GB 4219361A GB 4219361 A GB4219361 A GB 4219361A GB 939394 A GB939394 A GB 939394A
Authority
GB
United Kingdom
Prior art keywords
coating
oxide
panel
aluminium
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4219361A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electralab Printed Electronics Corp
Original Assignee
Electralab Printed Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electralab Printed Electronics Corp filed Critical Electralab Printed Electronics Corp
Publication of GB939394A publication Critical patent/GB939394A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

939,394. Printed circuits. ELECTRALAB PRINTED ELECTRONICS CORPORATION. Nov. 24, 1961 [Nov. 25, 1960], No. 42193/61. Class 37. [Also in Group XXXVII] A printed circuit panel comprises a conductive support carrying conductors insulated from the support by metal oxide. In the arrangement shown in Figs. 1 and 3, an aluminium panel 12 has a layer 14 of aluminium oxide which extends over one edge of the panel and through apertures in it which are thus lined with the oxide. Conductors 16 are connected through the apertures to duplicate conductors beneath the panel. The oxide lining of the apertures may be omitted in order to connect the conductors to an earth formed by the aluminium panel. In one method of manufacturing the device the sheet of aluminium is first drilled to provide the connecting holes 18 (Fig. 2) masked except where an oxide coating is desired and made the anode in an electro-chemical oxide forming bath to provide coating 4. Hole 20 is then ground through to provide the chassis connection. Next the circuitry is formed and this may be done by coating all the surface of the device with a resin preferably an epoxy adhesive 24 which may be cured and coating the surfaces of the adhesive with a thin conductive coating 26. A negative pattern electroplating resist is then deposited on both sides of the panel and the conductor metal for example copper, nickel, gold, silver, tin-lead solder or rhodium is electroplated using a thin conducting coating as the common earth connection. Finally, the plating resist is removed and the exposed conductive film and adhesive are stripped. In modifications the adhesive step is omitted when sufficient coating can be obtained without it and the conductive coating may be applied as an ink or paint which is bonded by firing. The conductive pattern may also be applied directly as a positive by direct or offset printing, stencilling, screen spraying, embossing or brushing and the whole may be fired to compact into the applied pattern. In the rotary switch shown in Fig. 8, contacts 46, 48 are insulated from the switch body 40 by oxide layer 44 which may be built up as at 49, 50 to provide a flush contact surface. The Specification also refers to the use of stainless steel with a magnesium or other oxide coating or magnesium or tantalum sheets with coatings of their own oxides.
GB4219361A 1960-11-25 1961-11-24 Improved metal-supported electric circuit arrays Expired GB939394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7161860A 1960-11-25 1960-11-25

Publications (1)

Publication Number Publication Date
GB939394A true GB939394A (en) 1963-10-16

Family

ID=22102479

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4219361A Expired GB939394A (en) 1960-11-25 1961-11-24 Improved metal-supported electric circuit arrays

Country Status (1)

Country Link
GB (1) GB939394A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4876058A (en) * 1971-11-11 1973-10-13
JPS5015070A (en) * 1973-06-14 1975-02-17
JPS5035666A (en) * 1973-08-07 1975-04-04
JPS5028794B1 (en) * 1969-06-06 1975-09-18
FR2435883A1 (en) * 1978-06-29 1980-04-04 Materiel Telephonique HYBRID INTEGRATED CIRCUIT AND ITS MANUFACTURING PROCESS
EP0044138A2 (en) * 1980-07-10 1982-01-20 Northern Telecom Limited Electrical circuit on porcelain coated metal substrate
US4390586A (en) * 1959-04-08 1983-06-28 Lemelson Jerome H Electrical device of semi-conducting material with non-conducting areas
US4831278A (en) * 1984-09-28 1989-05-16 Yazaki Corporation Wire harness for automobile
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390586A (en) * 1959-04-08 1983-06-28 Lemelson Jerome H Electrical device of semi-conducting material with non-conducting areas
JPS5028794B1 (en) * 1969-06-06 1975-09-18
JPS4876058A (en) * 1971-11-11 1973-10-13
JPS5015070A (en) * 1973-06-14 1975-02-17
JPS5035666A (en) * 1973-08-07 1975-04-04
FR2435883A1 (en) * 1978-06-29 1980-04-04 Materiel Telephonique HYBRID INTEGRATED CIRCUIT AND ITS MANUFACTURING PROCESS
US4294009A (en) 1978-06-29 1981-10-13 Le Material Telephonique Method of manufacturing a hybrid integrated circuit
EP0044138A2 (en) * 1980-07-10 1982-01-20 Northern Telecom Limited Electrical circuit on porcelain coated metal substrate
EP0044138A3 (en) * 1980-07-10 1983-04-20 Northern Telecom Limited Electrical circuit on porcelain coated metal substrate
US4831278A (en) * 1984-09-28 1989-05-16 Yazaki Corporation Wire harness for automobile
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
US8441796B2 (en) 2005-01-15 2013-05-14 Keronite International Limited Electrical power substrate

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