GB1254281A - Printed circuits - Google Patents

Printed circuits

Info

Publication number
GB1254281A
GB1254281A GB2440168A GB2440168A GB1254281A GB 1254281 A GB1254281 A GB 1254281A GB 2440168 A GB2440168 A GB 2440168A GB 2440168 A GB2440168 A GB 2440168A GB 1254281 A GB1254281 A GB 1254281A
Authority
GB
United Kingdom
Prior art keywords
insulating material
conductors
copper
layer
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2440168A
Inventor
Kenneth Leyland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB2440168A priority Critical patent/GB1254281A/en
Priority to BE733380D priority patent/BE733380A/xx
Priority to ES367823A priority patent/ES367823A1/en
Priority to DE19691925745 priority patent/DE1925745C/en
Priority to FR6916801A priority patent/FR2009162A1/fr
Publication of GB1254281A publication Critical patent/GB1254281A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1,254,281. Printed circuits. JOSEPH LUCAS (INDUSTRIES) Ltd. 14 May, 1969 [22 May, 1968], No. 24401/68. Heading H1R. In the manufacture of a flexible printed circuit a sheet of conductive foil, e.g. copper, is coated on one side with a layer of insulating material, e.g. PVC, which is then set or cured, the foil is formed into a pattern of conductors by an etch-resist process, a layer of insulating material, e.g. PVC, is printed on to the conductors so that the conductors are exposed at predetermined points, and the printed layer is set or cured. The insulating material may contain additives and the copper conductor may be provided with a coating of dendritic copper oxide to enhance bonding of the insulating material to the copper foil.
GB2440168A 1968-05-22 1968-05-22 Printed circuits Expired GB1254281A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB2440168A GB1254281A (en) 1968-05-22 1968-05-22 Printed circuits
BE733380D BE733380A (en) 1968-05-22 1969-05-21
ES367823A ES367823A1 (en) 1968-05-22 1969-05-21 Printed circuits
DE19691925745 DE1925745C (en) 1968-05-22 1969-05-21 Method of making a flexible printed circuit board
FR6916801A FR2009162A1 (en) 1968-05-22 1969-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2440168A GB1254281A (en) 1968-05-22 1968-05-22 Printed circuits

Publications (1)

Publication Number Publication Date
GB1254281A true GB1254281A (en) 1971-11-17

Family

ID=10211162

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2440168A Expired GB1254281A (en) 1968-05-22 1968-05-22 Printed circuits

Country Status (4)

Country Link
BE (1) BE733380A (en)
ES (1) ES367823A1 (en)
FR (1) FR2009162A1 (en)
GB (1) GB1254281A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2266999A (en) * 1992-05-15 1993-11-17 Nippon Cmk Kk Method of manufacturing reinforced flexible printed circuit boards
WO2008009493A1 (en) * 2006-07-18 2008-01-24 Continental Automotive Gmbh Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier
EP1962425A3 (en) * 2007-02-20 2008-09-17 Agotek Desarrollo Tecnologico, S.L. Proximity sensor system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2266999A (en) * 1992-05-15 1993-11-17 Nippon Cmk Kk Method of manufacturing reinforced flexible printed circuit boards
WO2008009493A1 (en) * 2006-07-18 2008-01-24 Continental Automotive Gmbh Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier
US8220148B2 (en) 2006-07-18 2012-07-17 Continental Automotive Gmbh Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier
EP1962425A3 (en) * 2007-02-20 2008-09-17 Agotek Desarrollo Tecnologico, S.L. Proximity sensor system
ES2322737A1 (en) * 2007-02-20 2009-06-25 Agotek, S.L. Proximity sensor system

Also Published As

Publication number Publication date
BE733380A (en) 1969-11-03
ES367823A1 (en) 1971-04-16
DE1925745A1 (en) 1970-01-15
DE1925745B2 (en) 1972-10-12
FR2009162A1 (en) 1970-01-30

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