FR1559157A - - Google Patents
Info
- Publication number
- FR1559157A FR1559157A FR1559157DA FR1559157A FR 1559157 A FR1559157 A FR 1559157A FR 1559157D A FR1559157D A FR 1559157DA FR 1559157 A FR1559157 A FR 1559157A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB743767A GB1194853A (en) | 1967-02-16 | 1967-02-16 | A Method of Forming Printed Circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1559157A true FR1559157A (en) | 1969-03-07 |
Family
ID=9833088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1559157D Expired FR1559157A (en) | 1967-02-16 | 1968-02-15 |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1615853A1 (en) |
FR (1) | FR1559157A (en) |
GB (1) | GB1194853A (en) |
NL (1) | NL6801988A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2430165A1 (en) * | 1978-06-29 | 1980-01-25 | Rogers Corp | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
FR2478420A1 (en) * | 1980-03-14 | 1981-09-18 | Dainippon Screen Mfg | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS |
EP0238929A2 (en) * | 1986-03-28 | 1987-09-30 | International Business Machines Corporation | Process for providing circuit lines on a substrate |
EP0349161A2 (en) * | 1988-06-27 | 1990-01-03 | AT&T Corp. | Printed wiring board fabrication method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3217983C2 (en) * | 1982-05-13 | 1984-03-29 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Method for making a masking mask |
-
1967
- 1967-02-16 GB GB743767A patent/GB1194853A/en not_active Expired
-
1968
- 1968-02-12 NL NL6801988A patent/NL6801988A/xx unknown
- 1968-02-13 DE DE19681615853 patent/DE1615853A1/en active Pending
- 1968-02-15 FR FR1559157D patent/FR1559157A/fr not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2430165A1 (en) * | 1978-06-29 | 1980-01-25 | Rogers Corp | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
FR2478420A1 (en) * | 1980-03-14 | 1981-09-18 | Dainippon Screen Mfg | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS |
EP0238929A2 (en) * | 1986-03-28 | 1987-09-30 | International Business Machines Corporation | Process for providing circuit lines on a substrate |
EP0238929A3 (en) * | 1986-03-28 | 1988-12-21 | International Business Machines Corporation | Process for providing circuit lines on a substrate |
EP0349161A2 (en) * | 1988-06-27 | 1990-01-03 | AT&T Corp. | Printed wiring board fabrication method |
EP0349161A3 (en) * | 1988-06-27 | 1990-05-09 | American Telephone And Telegraph Company | Printed wiring board fabrication method |
Also Published As
Publication number | Publication date |
---|---|
GB1194853A (en) | 1970-06-17 |
DE1615853A1 (en) | 1970-05-21 |
NL6801988A (en) | 1968-08-19 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |