DE3217983C2 - Method for making a masking mask - Google Patents
Method for making a masking maskInfo
- Publication number
- DE3217983C2 DE3217983C2 DE3217983A DE3217983A DE3217983C2 DE 3217983 C2 DE3217983 C2 DE 3217983C2 DE 3217983 A DE3217983 A DE 3217983A DE 3217983 A DE3217983 A DE 3217983A DE 3217983 C2 DE3217983 C2 DE 3217983C2
- Authority
- DE
- Germany
- Prior art keywords
- film
- perforations
- masking
- screen
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000873 masking effect Effects 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 18
- 239000003973 paint Substances 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 238000005530 etching Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Description
5050
Die vorliegende Erfindung betrifft ein Verfahren zum Herstellen einer Abdeckmaske zum Füllen von Löchern in Leiterplatten mit einer Abdeckfarbe. Die Abdeckmaske dient zum Schutz der mit einem Metallbelag versehenen Lochungen in Leiterplatten während des Metallätzvorganges.The present invention relates to a method of manufacturing a mask for filling holes in printed circuit boards with a masking color. The cover mask is used to protect the with a metal coating provided holes in circuit boards during the metal etching process.
Zum Anfertigen solcher Abdeckmasken wurde bereits eine Vielzahl von Verfahren vorgeschlagen. Nach einem dieser Verfahren werden die Leiterzüge einer gedruckten Leiterplatte einschließlich der Lochwandungen mit einem Metallüberzug versehen, der als Abdeckmaske beim nachfolgenden Ätzvorgang dient und anschließend wieder entfernt wird. Es wurde auch bereits vorgeschlagen, die Oberfläche einer Leiterplatte beidseitig mit einer Schicht eines Photoresist-Trockenfilms geeigneter Dicke zu versehen. Nach dem Belichten durch ein Positiv des gewünschten Leiterzugmusters und Entwickeln des Filmes ergibt sich eine Abdeckmaske, die sowohl die den Leiiterzügen der fertigen Leiterplatte entsprechenden Oberflächengebiete der Kupferschichf. als auch die Lochungen bedeckt und so hermetisch abschließtA large number of methods have already been proposed for producing such cover masks. According to one of these methods, the conductor tracks of a printed circuit board including the hole walls provided with a metal coating, which serves as a mask for the subsequent etching process and then removed again. It has also been proposed to use the surface of a printed circuit board to be provided on both sides with a layer of a photoresist dry film of suitable thickness. After exposure A cover mask results from a positive of the desired conductor pattern and developing the film. both the surface areas of the Copper layer as well as the perforations and thus hermetically sealed
Es wurde auch bereits vorgeschlagen, anstelle des Auftragens eines Photoresist-Trockenfilms die mit dem Kupferbelag versehenen Lochwandungen mit einer ätzresistemen Farbe als Abdeckmaske, beispielsweise durch Aufrakeln, auszufüllen. Vor oder nach dem Entfernen der Abdeckfarbe von der Plattenoberfläche wird die Füllung der Löcher in einem entsprechenden Trockenvorgang verfestigt Das Entfernen der die Abdeckmaske bildenden, getrockneten und erhärteten Abdeckfarbe von der Piattenoberfläche ist aufwendig und erfordert größte Sorgfalt Weiterhin hat es sich als schwierig und aufwendig erwiesen, alle Reste der Abdeckfarbe nach dem Ätzen aus den Lochungen und von deren Wandungen zu entfernen.It has also been suggested that instead of applying a photoresist dry film that with the Hole walls provided with copper coating with an etch-resistant paint as a cover mask, for example by squeegeeing to fill in. Before or after removing the masking paint from the panel surface the filling of the holes is solidified in a corresponding drying process Removing the the Covering mask-forming, dried and hardened covering paint from the plate surface is expensive and requires the greatest care Furthermore, it has proven difficult and time-consuming to remove all of the remnants of the Remove masking paint from the perforations and their walls after etching.
Das Verfahren nach der vorliegenden Erfindung vermeidet die oben beschriebenen Probleme und Nachteile bei der Herstellung einer Abdeckmaske und ist dadurch gekennzeichnet, daß ein als Träger dienendes, in üblicher Weise in einen Druckrahmen gespanntes Siebdrucksieb auf der beim Druckvorgang der Oberfläche der Leiterplatte zugekehrten Seite mit einer abdeckfarben-undurchlässigen Folie versehen wird, daß diese Anordnung an den Stellen gelocht wird, die im Leiterzugmuster den Lochungen mit metallisierten Wandungen entsprechen, und daß dann mit Hilfe eines Rakels die zur Füllung bestimmte Abdeckfarbe in die Lochungen eingebracht wird.The method according to the present invention avoids the problems described above and Disadvantages in the production of a cover mask and is characterized in that a carrier Serving, in the usual way stretched in a printing frame screen printing screen on the during the printing process The side facing the surface of the circuit board is provided with a film that is impermeable to masking paint is that this arrangement is punched in the places which correspond to the perforations with metallized walls in the conductor pattern, and that with the help With a squeegee, the masking color intended for the filling is introduced into the perforations.
Die Abdeckmaske für die Lochungen wird beispielsweise nach dem Aufbringen einer dem Positiv des gewünschten Leiterzugmusters der Leiterplatte entsprechenden Ätzmaske angebrachtThe cover mask for the perforations is, for example, after the application of one of the positive of the desired conductor pattern of the printed circuit board corresponding etching mask attached
Zum Herstellen der Anordnung aus Siebdrucksieb und Folie eignen sich Folien aus Metall oder Kunststoff, deren Dicke vorzugsweise 0,1 mm oder weniger beträgt Nach einer Ausführungsform der Erfindung wird eine Aluminiumfolie auf das Siebdrucksiebgewebe aufgeklebt Foils made of metal or plastic are suitable for producing the arrangement of screen printing screen and foil, whose thickness is preferably 0.1 mm or less. According to one embodiment of the invention, a Aluminum foil glued to the screen printing screen mesh
Die Anordnung aus Siebdrucksieb und Folie wird an allen jenen Stellen gelocht, vorzugsweise durchbohrt an denen sich in der fertiggestellten Leiterplatte Lochungen mit metallisierten Wandungen befinden sollen. Vorzugsweise wird der Durchmesser der Lochungen größer gewählt als der Durchmesser der betreffenden Lochung in der Leiterplatte. Die obere Grenze des Lochdurchmessers darf nicht über die Begrenzung der beispielsweise im Siebdruck aufgebrachten Ätzmaske für das Leiterzugmuster hinausgehen. In der Regel wird der Durchmesser der Bohrungen oder Lochungen in der Anordnung nur geringfügig größer gewählt als der Durchmesser der Lochungen in der Leiterplatte.The arrangement of screen printing screen and film is perforated, preferably drilled through, at all those points where there should be perforations with metallized walls in the finished printed circuit board. The diameter of the perforations is preferably selected to be larger than the diameter of the relevant perforation in the circuit board. The upper limit of the hole diameter must not go beyond the limit of the etching mask applied, for example, by screen printing for the conductor pattern. In general, de r diameter of the holes or perforations is selected in the arrangement only slightly larger than the diameter of the holes in the circuit board.
Für die in die Lochungen eingerakelte Abdeckfarbe wird vorzugsweise eine solche gewählt, die beim Einwirken dqr Trockenluft bzw. des darin enthaltenen Sauerstoffs an der Oberfläche einen so weit gehärteten Film bildet, daß die Lochungen abgedeckt sind, während der Rest der in den Lochungen befindlichen Abdeckfarbe weitgehend oder zur Gänze viskos bleibt. Dadurch wird in einem späteren Arbeitsschritt die restlose Entfernung der Lochfüllungen in einfacher Weise durch Einwirken eines Lösungsmittels bzw. Verdünnungsmittels für die Abdeckfarbe ermöglicht.For the masking color that is squeegeed into the perforations, one is preferably chosen that corresponds to The effect of the dry air or the oxygen it contains on the surface is so hardened Film forms that the holes are covered, while the rest of the masking paint located in the holes remains largely or entirely viscous. This will make the rest of the work in a later step Removal of the hole fillings in a simple manner by the action of a solvent or diluent for the masking color.
Anstelle der wärmehärtbaren Abdeckfarbe kann vorteilhafterweise eine durch UV-Strahlung härtbare Farbe analog benutzt werden.Instead of the heat-curable masking paint, a UV-curable one can advantageously be used Color can be used analogously.
Im folgenden wird die Erfindung anhand von Figuren näher erläutert.The invention is explained in more detail below with reference to figures.
F i g. IA bis 1F sind eine schematische Darstellung der einzelnen Verfahrensschritte entsprechend der Erfindung. Fig. IA zeigt einen Ausschnitt aus einem beidseitig mit einer Kupferfolie (2) kaschierten Leiterplatten-Basismaterial (1). Die Wandungen der Lochungen (10) ebenso wie die Oberfläche der Kupferfolie (2) sind mit einen, in bekannter Weise abgeschiedenen Kupferbelag (3) versehen.F i g. IA through 1F are a schematic representation of FIG individual process steps according to the invention. Fig. IA shows a section of a PCB base material (1) laminated on both sides with a copper foil (2). The walls of the perforations (10) as well as the surface of the copper foil (2) are deposited in a known manner with one Copper coating (3) provided.
Fig. IB zeigt den Ausschnitt nach dem Aufbringen einer im Siebdruck hergestellten und die den Leiterzügen entsprechenden Flächen abdeckenden ÄtzmaskeFig. IB shows the detail after application an etching mask produced by screen printing and covering the areas corresponding to the conductor tracks
F i g. IC stellt in schematischer Weise die AnordnungF i g. IC shows the arrangement in a schematic way
(5) und die Lochungen (9) in dieser im Verhältnis zu den(5) and the perforations (9) in this in relation to the
10 Lochungen (10) im Leiterplatten-Basismaterial (1) dar. Die Anordnung (5) weist das als Träger dienende Siebdrucksieb (50) und die auf dessen Unterseite befestigte abdeckfarbenundurchlässige Folie (51) auf. Bohrung (9) in (5) ist bereits mit Hilfe des Rakels (6) mit der Abdeckfarbe (7) gefüllt10 perforations (10) in the circuit board base material (1). The arrangement (5) has that serving as a carrier Screen printing screen (50) and the masking paint-impermeable film (51) attached to its underside. The hole (9) in (5) is already filled with the masking paint (7) using the squeegee (6)
Fig. ID zeigt die Platte (1) nach dem Ausfüllen der Lochungen (10) mit der Abdeckfarbe (7).Fig. ID shows the plate (1) after filling in the Perforations (10) with the covering color (7).
Fi g. IE stellt die Platte (1) nach dem Trocknen dar mit der in flüssig-viskosen Zustand befindlichen Füllung (7) der Lochungen (10) und dem an deren Oberfläche ausgebildeten ätzresistenten Film (70).Fi g. IE represents the plate (1) after drying with the filling (7) of the perforations (10) in the liquid-viscous state and the one on their surface formed etch-resistant film (70).
Fig. IF zeigt schließlich die Platte (1) nach dem Ablösen der Ätzmaske (4) (Fig. 1 E) und dem Entfernen der Abdeckmaske (7,70).Finally, FIG. IF shows the plate (1) after the etching mask (4) (FIG. 1 E) has been detached and removed the mask (7.70).
Hierzu 2 Blatt ZeichnungenFor this purpose 2 sheets of drawings
Claims (9)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3217983A DE3217983C2 (en) | 1982-05-13 | 1982-05-13 | Method for making a masking mask |
| GB08312009A GB2120017B (en) | 1982-05-13 | 1983-05-03 | Making printed circuit boards having plated through-holes |
| NL8301586A NL8301586A (en) | 1982-05-13 | 1983-05-04 | METHOD AND APPARATUS FOR MANUFACTURING GUIDE PLATES |
| SE8302619A SE8302619L (en) | 1982-05-13 | 1983-05-06 | PROCEDURE AND DEVICE FOR MANUFACTURING CONNECTOR |
| JP58083445A JPS58206192A (en) | 1982-05-13 | 1983-05-10 | Method and device for producing printed circuit board |
| CH2557/83A CH659753A5 (en) | 1982-05-13 | 1983-05-10 | METHOD AND DEVICE FOR PRODUCING CIRCUIT BOARDS. |
| DK210983A DK210983A (en) | 1982-05-13 | 1983-05-11 | PROCEDURE FOR MAKING CIRCUIT BOARDS |
| IT48288/83A IT1197651B (en) | 1982-05-13 | 1983-05-13 | PROCEDURE AND DEVICE FOR THE PREPARATION OF CONDUCTOR PLATES |
| CA000428115A CA1196731A (en) | 1982-05-13 | 1983-05-13 | Process and device for the manufacture of printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3217983A DE3217983C2 (en) | 1982-05-13 | 1982-05-13 | Method for making a masking mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3217983A1 DE3217983A1 (en) | 1983-11-17 |
| DE3217983C2 true DE3217983C2 (en) | 1984-03-29 |
Family
ID=6163461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3217983A Expired DE3217983C2 (en) | 1982-05-13 | 1982-05-13 | Method for making a masking mask |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS58206192A (en) |
| CA (1) | CA1196731A (en) |
| CH (1) | CH659753A5 (en) |
| DE (1) | DE3217983C2 (en) |
| DK (1) | DK210983A (en) |
| GB (1) | GB2120017B (en) |
| IT (1) | IT1197651B (en) |
| NL (1) | NL8301586A (en) |
| SE (1) | SE8302619L (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3514093A1 (en) * | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4884337A (en) * | 1986-11-26 | 1989-12-05 | Epicor Technology, Inc. | Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
| US4748742A (en) * | 1986-11-26 | 1988-06-07 | Multitek Corporation | Method for temporarily sealing holes in printed circuit boards |
| US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| KR20030007753A (en) | 2000-05-31 | 2003-01-23 | 허니웰 인터내셔날 인코포레이티드 | Filling method |
| AU2001264968A1 (en) | 2000-05-31 | 2001-12-11 | Honeywell International, Inc. | Filling device |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| CN110557889A (en) * | 2018-05-30 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of aluminum sheet screen hole plugging |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1249966B (en) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Process for the production of metallized walls of bores in printed circuit boards | |
| GB1042234A (en) * | 1965-03-05 | 1966-09-14 | Mullard Ltd | Multilayer printed circuits |
| GB1194853A (en) * | 1967-02-16 | 1970-06-17 | Btr Industries Ltd | A Method of Forming Printed Circuits |
| JPS52118261A (en) * | 1976-03-30 | 1977-10-04 | Matsushita Electric Ind Co Ltd | Method of producing through hole printed circuit board |
| JPS5658797A (en) * | 1979-10-18 | 1981-05-21 | Yashima Denki Kk | Ac power control circuit in induction motor |
| JPS5667985A (en) * | 1979-11-08 | 1981-06-08 | Matsushita Electric Ind Co Ltd | Method of printing ink using metal mask |
-
1982
- 1982-05-13 DE DE3217983A patent/DE3217983C2/en not_active Expired
-
1983
- 1983-05-03 GB GB08312009A patent/GB2120017B/en not_active Expired
- 1983-05-04 NL NL8301586A patent/NL8301586A/en not_active Application Discontinuation
- 1983-05-06 SE SE8302619A patent/SE8302619L/en not_active Application Discontinuation
- 1983-05-10 JP JP58083445A patent/JPS58206192A/en active Pending
- 1983-05-10 CH CH2557/83A patent/CH659753A5/en not_active IP Right Cessation
- 1983-05-11 DK DK210983A patent/DK210983A/en not_active Application Discontinuation
- 1983-05-13 CA CA000428115A patent/CA1196731A/en not_active Expired
- 1983-05-13 IT IT48288/83A patent/IT1197651B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3514093A1 (en) * | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD |
Also Published As
| Publication number | Publication date |
|---|---|
| IT8348288A0 (en) | 1983-05-13 |
| GB2120017A (en) | 1983-11-23 |
| GB2120017B (en) | 1986-02-19 |
| CH659753A5 (en) | 1987-02-13 |
| JPS58206192A (en) | 1983-12-01 |
| SE8302619L (en) | 1983-11-14 |
| SE8302619D0 (en) | 1983-05-06 |
| CA1196731A (en) | 1985-11-12 |
| DE3217983A1 (en) | 1983-11-17 |
| GB8312009D0 (en) | 1983-06-08 |
| IT1197651B (en) | 1988-12-06 |
| NL8301586A (en) | 1983-12-01 |
| DK210983A (en) | 1983-11-14 |
| DK210983D0 (en) | 1983-05-11 |
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