DE3514093A1 - METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD - Google Patents
METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARDInfo
- Publication number
- DE3514093A1 DE3514093A1 DE19853514093 DE3514093A DE3514093A1 DE 3514093 A1 DE3514093 A1 DE 3514093A1 DE 19853514093 DE19853514093 DE 19853514093 DE 3514093 A DE3514093 A DE 3514093A DE 3514093 A1 DE3514093 A1 DE 3514093A1
- Authority
- DE
- Germany
- Prior art keywords
- holes
- circuit board
- solder resist
- template
- closed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Beschreibung description
Die Erfindung betrifft ein Verfahren zum Verschließen von in einer Leiterplatte vorgesehenen Bohrungen mit Auftragen eines Lötstoplackes auf mindestens eine Seite der Leiterplatte. The invention relates to a method for closing in a Printed circuit board provided holes with application of a solder resist on at least one side of the circuit board.
Leiterplatten, auf denen gedruckte Schaltungen ausgebildet werden, sind bekannt. Diese Leiterplatten weisen aktive und passive Bohrungen auf. In die aktiven Bohrungen werden die Bauelemente eingesetzt. Diese werden mit Lot elektrisch angeschlossen. Dadurch werden die aktiven Bohrungen vakuumdicht verschlossen. Printed circuit boards on which printed circuits are formed, are known. These circuit boards have active and passive holes. In the The components are used for active bores. These become electrical with solder connected. This closes the active bores in a vacuum-tight manner.
Die passiven Bohrungen dienen zum elektrischen Verbinden der einen mit der anderen Seite der Leiterplatte.The passive holes are used to electrically connect the one with the other side of the circuit board.
Man bezeichnet sie auch als Umsteiger von der einen zur nächsten Ebene. Hierzu bleiben die passiven Bohrungen offen. Sie werden nicht mit Lot verschlossen. Die elektrische Verbindung von der einen zur anderen Seite der Leiterplatte erfolgt dabei zum Beispiel mit der sogenannten Durchmetallisierung.They are also referred to as switching from one level to the next. The passive holes remain open for this purpose. They are not sealed with solder. The electrical connection is made from one side of the circuit board to the other for example with the so-called through-plating.
Die fertigen bestückten Leiterplatten werden auf verschiedene Weise geprüft. Bei einem modernen Prüfverfahren werden die Leiterplatten mit Unterdruck in einen Adapter gezogen und durch den Unterdruck in diesem gehalten. Dieser Unterdruck wird durch die offen gebliebenen passiven Bohrungen zerstört. Zum Anwenden dieses Prüfverfahrens müssen daher auch die passiven Bohrungen geschlossen werden. The finished assembled circuit boards are made in different ways checked. In a modern test method, the circuit boards are subjected to negative pressure pulled into an adapter and held in this by the negative pressure. This negative pressure is destroyed by the passive holes that have remained open. To apply this Test procedure, the passive bores must therefore also be closed.
Man hat versucht, die passiven Bohrungen auf einer Lötwelle zu schließen. Dabei können sich jedoch zwischen einem Lötauge und einer angrenzenden Leiterbahn kleine Zinnperlen festsetzen. Dadurch kann unter einem Bauelement ein Kurzschluß entstehen. Dieses Verfahren hat daher starke Nachteile. Attempts have been made to close the passive holes on a solder wave. However, there can be between a soldering eye and an adjacent conductor track attach small pewter beads. This can cause a short circuit under a component develop. This method therefore has serious disadvantages.
Man hat weiter versucht, die Bohrungen mit einer Lötstopmaske aus einer Fotopolymerschicht geschlossen zu halten. Hierzu beläßt man diese Schicht in gespanntem Zustand über den Bohrungen. Unter Lötstopmaske ist dabei eine Schicht aus einem sogenannten Lötstoplack zu verstehen. Ein Lötstoplack ist ein Lack, der nach einem bestimmten Muster auf eine Leiterplatte aufgebracht wird. Er verhindert das Anhaften von Lot. Das Verschließen der Bohrungen mit einer Fotopolymerschicht ist jedoch ein sehr teures Verfahren. Attempts have continued to make the holes with a solder mask to keep a photopolymer layer closed. For this purpose one leaves this layer in the clamped state over the holes. There is a layer under the solder mask to be understood from a so-called solder resist. A solder resist is a lacquer that is applied to a circuit board according to a specific pattern. He prevents the clinging of solder. Sealing the holes with a photopolymer layer however, it is a very expensive process.
Von diesem Stand der Technik ausgehend liegt der Erfindung die Aufgabe zugrunde, ein Verfahren zum Verschließen von Bohrungen in einer Leiterplatte zu finden, das sich sicher und kostengünstig durchführen läßt. Die Lösung für diese Aufgabe ergibt sich nach der Erfindung dadurch, daß die Bohrungen mit einem Pfropfen aus dem schon genannten Lötstoplack verschlossen werden. Zweckmäßig wird dieser Lötstoplack im Siebdruckverfahren aufgebracht. Im Siebdruckverfahren besitzt man große Erfahrung, und er läßt sich kostengünstig durchführen. On the basis of this prior art, the object of the invention is to be found based on a method for closing bores in a circuit board find that can be carried out safely and inexpensively. The solution to this The object is obtained according to the invention in that the bores with a plug are sealed from the already mentioned solder resist. This is useful Solder resist applied by screen printing. In the screen printing process you have great experience and it can be carried out inexpensively.
In der praktischen Verwirklichung der Erfindung ist vorgesehen, daß eine erste Schablone mit einem der Zahl und der Lage der zu verschließenden Bohrungen entsprechenden Lochmuster und einem Sieb auf der von der Leiterplatte abgewandten Seite auf diese aufgelegt, der Lötstoplack aufgebracht und mit einem Rakel in die Bohrungen hineingedrückt wird. Dabei sollte der Durchmesser der in der ersten Schablone vorgesehenen Löcher etwas über dem Durchmesser der zu verschließenden Bohrungen liegen. Das für die Pfropfen gewünschte oder erforderliche Volumen läßt sich mit der Stärke der ersten Schablone einregeln. Bei ansteigender Stärke steigt das Volumen der Pfropfen und umgekehrt. In the practical implementation of the invention it is provided that a first template with one of the number and the position of the holes to be closed corresponding hole pattern and a sieve on the facing away from the circuit board Side placed on this, the solder mask applied and with a squeegee in the Holes is pressed. The diameter should be the same as in the first template provided holes slightly above the diameter of the holes to be closed lie. The volume desired or required for the plug can be used with adjust to the thickness of the first template. As the strength increases, the volume increases the plug and vice versa.
Die Schnelligkeit und das Ausmaß, mit denen der Lötstoplack in die zu verschließenden Bohrungen eindringt, läßt sich erfindungsgemäß durch Anlegen eines Unterdruckes auf die andere Seite der Leiterplatte erhöhen. The speed and extent with which the solder mask goes into the penetrates holes to be closed, according to the invention can be applied by applying of a negative pressure on the other side of the circuit board.
Hierzu wird im einzelnen vorgeschlagen, daß eine zweite Schablone mit einem der Zahl und der Lage der zu verschließenden Bohrungen entsprechenden Lochmuster auf die andere Seite der Leiterplatte aufgelegt und ein Vakuum angelegt wird und damit das Hineindrücken des Lötstoplackes in die Bohrungen von der einen Seite unterstützt wird.For this purpose, it is proposed in detail that a second template with one of the number and position of the holes to be closed Hole pattern placed on the other side of the circuit board and a vacuum applied and thus the pressing of the solder resist into the holes of one Page is supported.
Das für den erfindungsgemäßen Siebdruck verwendete und auf die Schablone aufgebrachte Sieb muß sehr grobmaschig sein. Der Lötstoplack soll weiter eine hohe Thixotropie aufweisen. Damit wird sichergestellt, daß er ausreichend schnell und tief in die zu verschließenden Bohrungen eindringt. Die Menge des Lötstoplackes wird so eingestellt, daß er mindestens die halbe Tiefe der Bohrung ausfüllt. In einer Weiterbildung kann das erfindungsgemäße Verfahren auch von den beiden Seiten der Leiterplatte aus angewendet werden. Hierbei werden die Bohrungen von jeder Seite zur Hälfte gefüllt und damit vakuumdicht verschlossen. That used for the screen printing according to the invention and on the stencil The sieve applied must be very wide-meshed. The solder resist should continue to be high Have thixotropy. This ensures that he is sufficiently fast and penetrates deep into the holes to be closed. The amount of solder resist is adjusted so that it fills at least half the depth of the hole. In In a further development, the method according to the invention can also be used from both sides of the printed circuit board. Here the holes are from each side half filled and thus sealed vacuum-tight.
In der Skizze ist ein Ausführungsbeispiel dargestellt. An exemplary embodiment is shown in the sketch.
Die Skizze zeigt einen Teil einer Leiterplatte 12 mit einer zu verschließenden Bohrung 14. Diese ist durchmetallisiert. Entsprechend trägt sie auf ihrer Wand eine Metallschicht 16. Oberhalb der Leiterplatte 12 befindet sich die Maske 18 mit dem Sieb 20. Diese Teile sind nur schematisch dargestellt. Auf das Sieb 20 wird der Lötstoplack aufgebracht. Die Skizze zeigt den Rakel 22. Bei Blick auf die Skizze wird er von rechts nach links verschoben. Dabei schiebt er eine Welle 24 des Lötstoplakkes über das Sieb 20. Dieser Lötstoplack dringt in das in der Schablone 18 vorgesehene Loch und aus diesem in die Bohrung 14 ein. Dabei bildet sich in dem Loch der Schablone 18 ein Pfropfen 26 aus Lötstoplack. Er fließt nach unten und füllt etwa die halbe Höhe der Bohrung 14 aus. Falls dies zu deren Verschließen nicht ausreichen sollte, kann das Verfahren, wie vorstehend angegeben, auch von der anderen Seite, das heißt von unten, ausgeführt werden. Ebenso läßt sich das Eindringen des Pfropfens 26 in die Bohrung 14 durch das Anlegen eines Unterdruckes auf die andere, die untere Seite der Leiterplatte 12 verbessern. Auch hierauf wurde vorstehend hingewiesen. The sketch shows part of a circuit board 12 with one Hole 14 to be closed. This is plated through with metal. She wears accordingly a metal layer 16 on its wall. Above the circuit board 12 is located the mask 18 with the screen 20. These parts are only shown schematically. on the screen 20, the solder resist is applied. The sketch shows the doctor blade 22. At Looking at the sketch, it is shifted from right to left. He pushes a wave 24 of the solder resist over the screen 20. This solder resist penetrates into the provided in the template 18 hole and from this into the bore 14. Included A plug 26 of solder resist is formed in the hole in the template 18. He flows downwards and fills approximately half the height of the bore 14. If this is their If sealing is not sufficient, the procedure as indicated above can be can also be carried out from the other side, i.e. from below. Likewise lets the penetration of the plug 26 into the bore 14 by the application of a negative pressure on the other, the lower side of the circuit board 12 improve. Also on this was noted above.
Die Abmessungen und die räumliche Zuordnung der verschiedenen Teile in der Skizze sind nur schematisch zu verstehen. The dimensions and spatial allocation of the various parts in the sketch are to be understood only schematically.
Claims (8)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853514093 DE3514093A1 (en) | 1985-04-16 | 1985-04-16 | METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD |
PCT/DE1986/000165 WO1986006243A1 (en) | 1985-04-16 | 1986-04-15 | Process for the closing up of drill holes provided for in a printed circuit board |
EP86902333A EP0217886A1 (en) | 1985-04-16 | 1986-04-15 | Process for the closing up of drill holes provided for in a printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853514093 DE3514093A1 (en) | 1985-04-16 | 1985-04-16 | METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3514093A1 true DE3514093A1 (en) | 1986-10-23 |
Family
ID=6268527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19853514093 Withdrawn DE3514093A1 (en) | 1985-04-16 | 1985-04-16 | METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0217886A1 (en) |
DE (1) | DE3514093A1 (en) |
WO (1) | WO1986006243A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19842590A1 (en) * | 1998-09-17 | 2000-04-13 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
DE19909505A1 (en) * | 1999-03-04 | 2000-09-21 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
US6929975B2 (en) | 2001-01-13 | 2005-08-16 | Conti Temic Microelectronic Gmbh | Method for the production of an electronic component |
EP1701600A1 (en) * | 2005-03-10 | 2006-09-13 | LPKF Laser & Electronics AG | Method for contacting conductive tracks of a printed circuit board |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2039486T5 (en) * | 1988-02-25 | 2003-07-01 | Schmid Gmbh & Co Geb | DEVICE FOR THE TREATMENT OF ELECTRIC PRINTED CIRCUIT PLATES. |
US4982892A (en) * | 1989-11-09 | 1991-01-08 | International Business Machines Corporation | Solder interconnects for selective line coupling |
FR2714567B1 (en) * | 1993-12-28 | 1996-01-26 | Thomson Hybrides | Method for plugging metallized holes in connection circuits. |
US5492266A (en) * | 1994-08-31 | 1996-02-20 | International Business Machines Corporation | Fine pitch solder deposits on printed circuit board process and product |
TW483940B (en) * | 1998-06-24 | 2002-04-21 | Ciba Sc Holding Ag | Method for coating printed circuit boards or similar substrates |
US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
DE10196262T1 (en) | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | filling system |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
JP2003535465A (en) | 2000-05-31 | 2003-11-25 | ハネウエル・インターナシヨナル・インコーポレーテツド | Filling device |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
FR2813216B1 (en) * | 2000-08-28 | 2003-03-21 | Novatec | DEVICE FOR FILLING OPENING HOLES IN A SUBSTRATE |
FR2837345B1 (en) * | 2002-03-15 | 2004-06-04 | Novatec | METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE |
EP4328028A1 (en) * | 2022-08-23 | 2024-02-28 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Filling holes of a component carrier structure with controllable and alignable movable medium applicator |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1249966B (en) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Process for the production of metallized walls of bores in printed circuit boards | |
US4323593A (en) * | 1979-04-11 | 1982-04-06 | Matsushita Electric Industrial Co., Ltd. | Method of printing a spot pattern in a printed circuit board |
DE3217983C2 (en) * | 1982-05-13 | 1984-03-29 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Method for making a masking mask |
DE3420966A1 (en) * | 1983-06-06 | 1984-12-06 | International Standard Electric Corp., New York, N.Y. | SCREEN PRINTING METHOD AND DEVICE FOR EXERCISING THE SAME |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4478882A (en) * | 1982-06-03 | 1984-10-23 | Italtel Societa Italiana Telecomunicazioni S.P.A. | Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer |
FR2551618B1 (en) * | 1983-09-02 | 1989-12-01 | Inf Milit Spatiale Aeronaut | METHOD FOR MANUFACTURING A PRINTED CIRCUIT WITH BURIED LAYERS AND PRINTED CIRCUIT OBTAINED BY SUCH A METHOD |
-
1985
- 1985-04-16 DE DE19853514093 patent/DE3514093A1/en not_active Withdrawn
-
1986
- 1986-04-15 EP EP86902333A patent/EP0217886A1/en not_active Withdrawn
- 1986-04-15 WO PCT/DE1986/000165 patent/WO1986006243A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1249966B (en) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Process for the production of metallized walls of bores in printed circuit boards | |
US4323593A (en) * | 1979-04-11 | 1982-04-06 | Matsushita Electric Industrial Co., Ltd. | Method of printing a spot pattern in a printed circuit board |
DE3217983C2 (en) * | 1982-05-13 | 1984-03-29 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Method for making a masking mask |
DE3420966A1 (en) * | 1983-06-06 | 1984-12-06 | International Standard Electric Corp., New York, N.Y. | SCREEN PRINTING METHOD AND DEVICE FOR EXERCISING THE SAME |
Non-Patent Citations (1)
Title |
---|
Herrmann, G., Handbuch der Leiterplattentechnik, Eugen Leuze Verlag, Saulgau 1982, S. 418 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19842590A1 (en) * | 1998-09-17 | 2000-04-13 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
DE19909505A1 (en) * | 1999-03-04 | 2000-09-21 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
DE19909505C2 (en) * | 1999-03-04 | 2001-11-15 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
US6820798B1 (en) | 1999-03-04 | 2004-11-23 | Conti Temic Microelectronic Gmbh | Method for producing circuit arrangments |
US6929975B2 (en) | 2001-01-13 | 2005-08-16 | Conti Temic Microelectronic Gmbh | Method for the production of an electronic component |
EP1701600A1 (en) * | 2005-03-10 | 2006-09-13 | LPKF Laser & Electronics AG | Method for contacting conductive tracks of a printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
EP0217886A1 (en) | 1987-04-15 |
WO1986006243A1 (en) | 1986-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8141 | Disposal/no request for examination | ||
8110 | Request for examination paragraph 44 | ||
8170 | Reinstatement of the former position | ||
8130 | Withdrawal |