FR2837345B1 - METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE - Google Patents

METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE

Info

Publication number
FR2837345B1
FR2837345B1 FR0203205A FR0203205A FR2837345B1 FR 2837345 B1 FR2837345 B1 FR 2837345B1 FR 0203205 A FR0203205 A FR 0203205A FR 0203205 A FR0203205 A FR 0203205A FR 2837345 B1 FR2837345 B1 FR 2837345B1
Authority
FR
France
Prior art keywords
substrate
hollow areas
filling hollow
filling
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0203205A
Other languages
French (fr)
Other versions
FR2837345A1 (en
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novatec SA filed Critical Novatec SA
Priority to FR0203205A priority Critical patent/FR2837345B1/en
Publication of FR2837345A1 publication Critical patent/FR2837345A1/en
Application granted granted Critical
Publication of FR2837345B1 publication Critical patent/FR2837345B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
FR0203205A 2002-03-15 2002-03-15 METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE Expired - Fee Related FR2837345B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0203205A FR2837345B1 (en) 2002-03-15 2002-03-15 METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0203205A FR2837345B1 (en) 2002-03-15 2002-03-15 METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE

Publications (2)

Publication Number Publication Date
FR2837345A1 FR2837345A1 (en) 2003-09-19
FR2837345B1 true FR2837345B1 (en) 2004-06-04

Family

ID=27772137

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0203205A Expired - Fee Related FR2837345B1 (en) 2002-03-15 2002-03-15 METHOD FOR FILLING HOLLOW AREAS ON A SUBSTRATE

Country Status (1)

Country Link
FR (1) FR2837345B1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514093A1 (en) * 1985-04-16 1986-10-23 Kaspar 5241 Gebhardshain Eidenberg METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD
JPH01308679A (en) * 1989-01-11 1989-12-13 Sono Kogyo Kk Screen printing for recessed part
US5531020A (en) * 1989-11-14 1996-07-02 Poly Flex Circuits, Inc. Method of making subsurface electronic circuits
JPH0471293A (en) * 1990-07-11 1992-03-05 Cmk Corp Filling of conductive substance and the like in through hole and the like in printed-wiring board
JP3849170B2 (en) * 1996-04-16 2006-11-22 松下電器産業株式会社 Printing plate and method for producing printed wiring board using the same
JP3985302B2 (en) * 1997-09-01 2007-10-03 日立金属株式会社 Manufacturing method of ceramic laminates

Also Published As

Publication number Publication date
FR2837345A1 (en) 2003-09-19

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20071130