GB8620789D0 - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
GB8620789D0
GB8620789D0 GB868620789A GB8620789A GB8620789D0 GB 8620789 D0 GB8620789 D0 GB 8620789D0 GB 868620789 A GB868620789 A GB 868620789A GB 8620789 A GB8620789 A GB 8620789A GB 8620789 D0 GB8620789 D0 GB 8620789D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB868620789A
Other versions
GB2193727A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Mitsubishi Electric Corp
Original Assignee
Kansai Paint Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd, Mitsubishi Electric Corp filed Critical Kansai Paint Co Ltd
Publication of GB8620789D0 publication Critical patent/GB8620789D0/en
Publication of GB2193727A publication Critical patent/GB2193727A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
GB08620789A 1986-07-09 1986-08-28 Producing a printed circuit board Withdrawn GB2193727A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61161422A JPS6317592A (en) 1986-07-09 1986-07-09 Manufacture of printed wiring board

Publications (2)

Publication Number Publication Date
GB8620789D0 true GB8620789D0 (en) 1986-10-08
GB2193727A GB2193727A (en) 1988-02-17

Family

ID=15734800

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08620789A Withdrawn GB2193727A (en) 1986-07-09 1986-08-28 Producing a printed circuit board

Country Status (5)

Country Link
JP (1) JPS6317592A (en)
KR (1) KR900001798B1 (en)
CN (1) CN86105392A (en)
DE (1) DE3628340A1 (en)
GB (1) GB2193727A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943346A (en) * 1988-09-29 1990-07-24 Siemens Aktiengesellschaft Method for manufacturing printed circuit boards
EP0370133A1 (en) * 1988-11-24 1990-05-30 Siemens Aktiengesellschaft Process for producing printed-circuit boards
EP0469537B1 (en) * 1990-08-02 1998-12-30 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
JPH04146687A (en) * 1990-10-08 1992-05-20 Nippon Paint Co Ltd Manufacture of solder masked circuit board
US5223116A (en) * 1992-05-11 1993-06-29 Siemens Aktiengesellschaft Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces
KR100465613B1 (en) * 2002-11-01 2005-01-13 태창엔지니어링 주식회사 Electrodeposition resist coating apparatus
CN101144967B (en) * 2007-06-28 2011-04-06 武汉立胜超滤科技发展有限公司 Electrophoresis coating method and whole set apparatus for pattern transfer of positive electrophoresis coating on printing board
CN108811359B (en) * 2018-07-03 2019-11-08 刘平 A kind of two-sided and multilayer printed circuit board production method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0155231B2 (en) * 1984-03-07 1997-01-15 Ciba-Geigy Ag Image-producing process
US4592816A (en) * 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process

Also Published As

Publication number Publication date
KR900001798B1 (en) 1990-03-24
KR880002413A (en) 1988-04-30
DE3628340A1 (en) 1988-01-21
GB2193727A (en) 1988-02-17
JPS6317592A (en) 1988-01-25
CN86105392A (en) 1988-01-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)