CN86105392A - The manufacture method of printed substrate - Google Patents
The manufacture method of printed substrate Download PDFInfo
- Publication number
- CN86105392A CN86105392A CN198686105392A CN86105392A CN86105392A CN 86105392 A CN86105392 A CN 86105392A CN 198686105392 A CN198686105392 A CN 198686105392A CN 86105392 A CN86105392 A CN 86105392A CN 86105392 A CN86105392 A CN 86105392A
- Authority
- CN
- China
- Prior art keywords
- resin
- printed substrate
- laminated board
- lining copper
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Abstract
The invention relates to the printed substrate manufacture method of (comprising printed substrate with holes); its process characteristic is when forming the photonasty diaphragm on the surface of the lining copper lamination insulation board of printed substrate; above-mentioned lining copper lamination insulation board is immersed in the electrophoretic coating that is coated with tankage; by dc electrolysis, the photonasty diaphragm is separated out.Because the present invention adopts electrophoretic painting, the photosensitive resin material can loss, and automation is very easily carried out, and helps stabilised quality and effectively utilizes the factory building space.
Description
The present invention is in the printed substrate manufacturing process, about on the copper foil surface of lining copper lamination insulation board (being designated hereinafter simply as " lining copper laminated board "), forms the method for photonasty diaphragm.
In addition, the present invention also comprises relevant copper foil surface at through hole and lining copper lamination insulation board (following also abbreviate as " lining copper laminated board ") in the manufacturing process of printed substrate with holes, forms the method for photonasty diaphragm simultaneously.
About the method for making of printed substrate, the past one to since the method that adopts be: the copper foil surface at the lining copper laminated board forms the photonasty diaphragm earlier, exposes facing to required line map then, handles through video picture, promptly makes the diaphragm line map.After this figure sheltered, corrode, can obtain required line map thus at above-mentioned copper foil surface.
And the method for making in printed substrate past with holes is as follows: normally perforate on the lining copper laminated board earlier; then through-hole plating (generally being copper facing); reusable heat cured resin filling through hole; thereafter the copper foil surface at the lining copper laminated board forms the photonasty diaphragm; facing to required line map exposure, form the diaphragm line map again through development treatment.After this figure sheltered, copper foil surface is corroded.Remove the resin of clogging in the through hole then, so make required line map.
Another kind method is, will serve as a contrast the through-hole surfaces that copper laminated board opens earlier and cover with the photonasty diaphragm, and secondly the copper foil surface at the lining copper laminated board forms the photonasty diaphragm, facing to required line map exposure, promptly obtains the diaphragm line map after the development treatment.It is sheltered, then copper foil surface is corroded, make required line map thus.
Method as filling resin in the through hole can adopt printing to rub with the hands and is coated with, or clogs method such as through hole resin with cylinder coating machine.
Fig. 3 is the principle profile in order to front roll coating machine method filling through hole.(1) be the lining copper laminated board, (2) are the through holes of opening on this lining copper laminated board (1), and (3) are the resins that is used for clogging through hole (2).On lining copper laminated board (1), carry out coating with the coating roller (4a) and the help roll (4b) of cylinder coating machine, simultaneously resin (3) is pressed in the through hole (2) that serves as a contrast copper laminated board (1).Treat just to remove the lip-deep resin of lining copper laminated board (1) after the dry sclerosis of resin (3), just form the photonasty diaphragm then, thereby further produce required line map at its copper foil surface.
Secondly; the method of past as the copper foil surface formation photonasty diaphragm of lining copper laminated board has; with aqueous protective material dipping; the cylinder coating; the method of coatings such as centrifugal coating; or with special-purpose press, the method that the membranaceous light-sensitive surface of so-called dry film protective layer (for example liston diaphragm of Dupong corporate system) is laminated.
Fig. 4 is the formation end view of general dry film protective layer, represents that promptly the surface of dry film (5) is laminating the situation of diaphragm (6).
Fig. 5 is the principle end view that expression dry film (5) laminates situation.Promptly the two sides of expression lining copper laminated board (1) laminates respectively with the 1st and the 2nd dry film (5a) and situation (5b).For printed substrate with holes, then be illustrated in the two sides that through hole (2) has been used the lining copper laminated board (1) of resin (3) filling, the situation of using the 1st and the 2nd dry film (5a) respectively and (5b) laminating.By the feed roller (7a) of the 1st and the 2nd dry film with (7b) supply with the 1st and the 2nd dry film (5a) and (5b) respectively; make each diaphragm (6a) of the 1st and the 2nd simultaneously and (6b) emit, these diaphragms (6a) with (6b) can be batched respectively the 1st and the 2nd diaphragm coiler drum (8a) and (8b) on.When each diaphragm (6a) when (6b) emitting, the dry film as the 1st and the 2nd (5a) with (5b) then respectively and (9b) by the 1st and the 2nd heating and pressurizing roller (9a), may be laminated on the lining copper laminated board (1) that passes this two roller two-sided.In addition, (10a) being the deflector roll of the 1st dry film (5a), (10b) then is the deflector roll of the 2nd dry film (5b), is again the deflector roll of emitting of the 2nd diaphragm (6b) simultaneously.
The method in past is the dry film that will make in addition as mentioned above, repeatedly is pressed in as stated above on the lining copper laminated board.There are some problems in the method, as, for width that makes dry film and the size that serves as a contrast copper laminated board match, cause dry film that suitable loss is all arranged on width and length direction.Secondly, because of the discharge end of the infeed end of lining copper laminated board (during printed substrate with holes, being the infeed end of the lining copper laminated board clogged of through hole) after laminating with dry film is divided into two, therefore need two people's operations.Though occurred automatic press recently, expensive problem arranged.Moreover, when copper foil surface has fault,, thereby when wiring board corrodes, can cause and open circuit or problem such as short circuit because this fault can not tamp fully.For printed substrate with holes, the method in past is except existing the problems referred to above, more than a shortcoming, that is, as mentioned above, the through hole of offering on the lining copper laminated board plate (1) (2) must give to be clogged with resin earlier, again according to the method described above, the dry film of making in addition is laminated on the lining copper laminated board, for this reason, must set up a drying process in addition again, make the resin (3) of filling in the through hole (2) be able to drying.
The present invention also is devoted to reach following advantage when addressing the above problem: the surface of lining copper laminated board is the coating photosensitive resin comprehensively and equably, and does not need many losses photosensitive material; Copper foil surface had both just had fault, also can tamp fully.For printed substrate with holes, the fault of copper foil surface only can both fully not tamped and coating with regard to intercommunicating pore yet; Seeking when quality improves, do not needing to adopt the equipment of high price, also do not needing supernumerary's hand and can organize and weave into automatic assembly line.
The autofrettage of the present invention's printed substrate is that the lining copper laminated board be impregnated in the electrophoretic painting electrolyzer that the water soluble light-sensitive resin is housed, by dc electrolysis, and the method that light-sensitive surface is separated out.
The autofrettage of the present invention's printed substrate with holes is that the lining copper laminated board that will have through hole is immersed in the electrophoretic painting electrolysis tank that the water soluble light-sensitive resin is housed, by dc electrolysis, and the method that light-sensitive surface is separated out.
In the present invention, to serve as a contrast copper laminated board (or lining copper laminated board of band through hole) impregnated in the electrolysis tank that water soluble light-sensitive resin electrophoretic coating is housed, pass through dc electrolysis, photosensitive resin is precipitate on the Copper Foil (during printed substrate with holes, be that photosensitive resin is precipitate on through-hole surfaces and the Copper Foil), heating makes it dry then, makes light-sensitive surface thus.Therefore, neither can consumable material, coating equably again, the fault of copper foil surface also can both be clogged fully, forms uniform coating.
Embodiment
Fig. 1 is the cutaway view that one embodiment of the invention is implemented situation.(11) are electrolysis tanks among the figure, (12) be the water soluble light-sensitive resin electrophoretic coating that is loaded in the electrolysis tank, lining copper laminated board (1) promptly impregnated in wherein, (13) be the negative electrode of making by no spot copper, it with lining copper laminated board (1) parallel opposed longer sides impregnated in the electrolysis tank, (14) are the aspiration tube that agitated liquid is used.
Between lining copper laminated board (1) and negative electrode (13), add the direct voltage about 200 volts, so the electronegative photoresist that is dissolved or dispersed in the liquid (12) is the surface of electro-deposition in lining copper laminated board (1).Electric current reduces with the increase of thickness.When thickness reaches certain thickness, also dewater simultaneously., will serve as a contrast copper laminated board (1) lift up, make it dry, can obtain light-sensitive surface thus by heating thereafter.
(1) of the embodiment of printed substrate with holes in Fig. 1 is for to have the lining copper laminated board plate of through hole, and the meaning of other label is identical.When between lining copper laminated board (1) with holes and negative electrode (13), adding the direct voltage about 200 volts, be dissolved or dispersed in electronegative photoresist in the liquid (12) and be electro-deposition in the through hole of lining copper laminated board (1) and the surface of this plate.Enforcement situation subsequently and the foregoing description are together.
Fig. 2 is a diagrammatic side view of the electrolysis tank group in the foregoing description being weaved into the application examples of automatic processing line.In a series of automatic treatment trough (15), the electrophoretic painting electrolysis tank (11) of packing into shown in Figure 1, lining copper laminated board (1) then by automatics (16), in required time, is transported on the position of regulation.
In addition, negative electrode in the foregoing description (13) usefulness be no spot copper coin, in fact also can use raw material of wood-charcoal or other electric conducting material.Again, though be anode with the lining copper laminated board in the foregoing description, also can be with the pole reversal of applied voltage, make lining copper laminated board (1) become negative electrode, need adopt electrophoresis photoresist correspondingly simultaneously.
Because the present invention adopts electrophoretic painting, the surface that makes the lining copper laminated board is (for printed substrate with holes, be make in the through hole of lining copper laminated board of band through hole and copper coin surperficial) form light-sensitive surface, so the photosensitive resin material can loss, automation is also very easily carried out, help stabilised quality, also can effectively utilize the space of factory building.
Brief description of drawings
Fig. 1 is the cutaway view that one embodiment of the invention is implemented situation.Fig. 2 weaves into the diagrammatic side view that the line application examples is handled in automation with the electrolysis tank group of the foregoing description.Fig. 3 is the principle cutaway view that serves as a contrast the through hole of copper laminated board with cylinder coating machine filling in the past.Fig. 4 represents the side-looking pie graph of in the past used general dry film protective layer, and Fig. 5 is the principle end view that this dry film of expression is repeatedly pressed situation.
Among the figure, (1) is lining copper lamination insulation board, and (2) are through holes, and (11) are the electrophoretic painting grooves, and (12) are water soluble light-sensitive resin electrophoretic coatings, and (15) are to handle automatically to use the groove group, and (16) are automatic conveying devices.
Again, the prosign among each figure is represented identical or suitable part.
The electrophoretic coating that the present invention uses is such as United States Patent (USP) 3,954,587 anion electrophoresis coatings of putting down in writing. Specifically, by containing acid value 20-300, the about 150-3000 of unsaturated equivalent, the composition of selecting in following (1)-(5) constituent of the poly-unsaturated-resin of the about water-soluble or water dispersible more than 300 of number average molecule equivalent, and water-insoluble Photoepolymerizationinitiater initiater (such as styrax etc.) consists of as the photohardenable composition of the water-soluble or water dispersible of Main Ingredients and Appearance.
(1) will the compound of polymerism unsaturated bond and hydroxy be arranged in the molecule, and the reactant between diisocyanate compound, add on the high acid value acrylic resin that hydroxy is arranged in the molecular skeleton synthetic poly-unsaturated-resin; Or the constituent that the vinyl unsaturates that an above polymerism unsaturated bond is arranged in they and the molecule is used with is as the resin of Main Ingredients and Appearance.
(2) in the synthetic carboxylate of the epoxy resin that epoxy radicals is arranged and unrighted acid on the unsaturated bond of aliphatic chain, add α, unsaturated two basic acids of β vinyl or its anhydride, in the poly-unsaturated-resin that consists of thus and the molecule mixture of the vinyl unsaturated compound of an above polymerization unsaturated bond being arranged is the resin of Main Ingredients and Appearance.
(3) it is main in the poly-unsaturated-resin that is made up of the high acid value alkyd resins of unrighted acid modification and the molecule mixture of the vinyl unsaturated compound of an above polymerism unsaturated bond being arranged Want the resin of composition.
(4) be the resin of Main Ingredients and Appearance in oily poly-unsaturated-resin that constitutes of maleic anhydride and the molecule mixture of the vinyl unsaturated compound of an above polymerism unsaturated bond to be arranged.
(5) make the compound that polymerism unsaturated bond and glycidyl are arranged in the molecule, addition becomes poly-unsaturated-resin on high acid value acrylic resin.Perhaps the component that the vinyl unsaturated compound that the unsaturated bond of an above polymerization is arranged in they and the molecule is used with is as the resin of main component.
In addition, except above-mentioned anionic, also can adopt cation electrophoretic coating as electrophoretic coating.For example, the poly-unsaturated-resin that the water-soluble or water dispersible of selecting in the composition of following (6)-(8) of vinyl unsaturated group and amino component is arranged in the resin matrix, and the cation paint that constitutes as the photo-curable constituent of the water-soluble or water dispersible of main component of water-insoluble Photoepolymerizationinitiater initiater.
(6) one-level or secondary amine are added on after the epoxy compounds, the isocyanate compound that will contain the vinyl unsaturated group again is added to the resin of institute's addition on the hydroxy;
As epoxy compounds, can adopt bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, aliphatic epoxy resin, phenolic resin type (trade name Novolak) epoxy resin, and by styrene, methyl methacrylate, vinyl monomer such as 2-hydroxymethyl ethyl acrylate and glycidyl methacrylate etc. contain the resin that the unsaturated monomer of glycidyl is copolymerized into.As amine, can use monoethyl amine, monobutylamine (MBA), diethylamine, dibutyl amine, an ethyl monoethanolamine, diethanol amine etc.
And can list as follows as the isocyanate compound that contains the vinyl unsaturated group: at toluene di-isocyanate(TDI), IPDI, xylylene diisocyanate, 1, on the NCO of diisocyanate cpds such as 6-hexane diisocyanate, add 2-hydroxy acrylic acid ethyl ester, 2-hydroxymethyl ethyl acrylate, 2-hydroxy acrylic acid propyl ester, the compound that the unsaturated monomer of hydroxyls such as 2-hydroxymethyl propyl acrylate forms, and the isocyanic acid EMA etc.
(7) on the epoxy radicals of the resin that contains epoxy radicals and tertiary amine base, add the compound that contains vinyl unsaturated group and carboxyl and the resin of making; The resin that contains epoxy radicals and tertiary amine base then is to make by the part epoxy radicals of epoxy resin and secondary amine reaction.In this resin, add the compound of unsaturated groups such as containing methacrylic acid and carboxyl on the residual epoxy radicals, synthetic thus above-mentioned resin.
(8) this resin is that primary amine is added on the mono-epoxy compounds, after the secondary ammonification, add di-epoxy compounds or polyepoxy compound, making the secondary amine and the equivalents of epoxy radicals is more than 1 to 2, on the epoxy radicals of remnants, contained the compound of above-mentioned vinyl unsaturated group and carboxyl then and synthetic, or the synthetic resin of the isocyanate compound that on hydroxy, is contained above-mentioned vinyl unsaturated group
Mono-epoxy compounds can adopt allyl glycidyl ether, phenyl glycidyl ether, oxirane, propylene oxide, epoxy butane etc.
Di-epoxy compounds or polyepoxy compound then can adopt bisphenol-type epoxy resin, aliphatic epoxy resin, phenolic resin type (being trade name Novolak) epoxy resin etc.
Electrophoretic coating embodiment
To contain methyl methacrylate 40 weight portions, butyl acrylate 40 weight portions, acrylic acid 20 weight portions, and the mixed liquor of azobis isobutyronitrile 2 weight portions, under nitrogen atmosphere, be added drop-wise in propylene glycol monomethyl ether (hydrophilic solvent) the 90 weight portion solution that remain in 110 ℃, take three hours. After the dropping, made it slaking 1 hour. The mixed liquor dropping that will be made up of two methyl pentane nitrile 1 weight portions of azo and propylene glycol monomethyl ether 10 weight portions one hour again through slaking in 5 hours, thereby is produced acrylic resin (acid value 155) solution of high acid value. Then, in this solution, add again GMA 24 weight portions, hydroquinones 0.12 weight portion, and tetraethylammonium bromide 0.6 weight portion, under 110 ℃, blast air, make it to react 5 hours, produce poly-unsaturated-resin (acid value about 50, unsaturated equivalent is about 740, number-average molecular weight about 20,000) solution. With triethylamine this poly-unsaturated-resin to 0.6 equivalent that neutralizes, add then acetylacetone,2,4-pentanedione 6 weight portions, and light trigger Alpha-hydroxy isobutyl group phenol 6 weight portions, Add afterwards water, make solid concentration reach 10%(weight), make electrophoretic painting and bathe (pH7.0).
Claims (3)
1, a kind of manufacture method of printed substrate; when its technology characteristics is to form the photonasty diaphragm on the surface of the lining copper lamination insulation board that is used as printed substrate; above-mentioned lining copper lamination insulation board is immersed in the electrophoretic coating that is coated with tankage; the Main Ingredients and Appearance of this electrophoretic coating is the light-cured resin of water-soluble or water dispersible; by dc electrolysis, the photonasty diaphragm is separated out.
2, a kind of manufacture method of printed substrate; it is characterized in that wiring board wherein has some through holes; the lining copper lamination insulation board that this is with holes impregnated in the water soluble light-sensitive resin electrophoretic coating in the electrophoretic painting groove, and by dc electrolysis, the photonasty diaphragm is separated out.
3, according to the method for fabricating printed wiring board of claim 1 or 2, it is characterized in that, if be equipped with the electrophoretic painting groove in the groove of individual automatic processing usefulness, is to form the photonasty diaphragm in this is coated with tankage as a step of automatic processing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61161422A JPS6317592A (en) | 1986-07-09 | 1986-07-09 | Manufacture of printed wiring board |
| JP161422/86 | 1986-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN86105392A true CN86105392A (en) | 1988-01-27 |
Family
ID=15734800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN198686105392A Pending CN86105392A (en) | 1986-07-09 | 1986-08-26 | The manufacture method of printed substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS6317592A (en) |
| KR (1) | KR900001798B1 (en) |
| CN (1) | CN86105392A (en) |
| DE (1) | DE3628340A1 (en) |
| GB (1) | GB2193727A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101144967B (en) * | 2007-06-28 | 2011-04-06 | 武汉立胜超滤科技发展有限公司 | Electrophoresis coating method and whole set apparatus for pattern transfer of positive electrophoresis coating on printing board |
| CN108811359B (en) * | 2018-07-03 | 2019-11-08 | 刘平 | A kind of two-sided and multilayer printed circuit board production method |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4943346A (en) * | 1988-09-29 | 1990-07-24 | Siemens Aktiengesellschaft | Method for manufacturing printed circuit boards |
| EP0370133A1 (en) * | 1988-11-24 | 1990-05-30 | Siemens Aktiengesellschaft | Process for producing printed-circuit boards |
| US5268256A (en) * | 1990-08-02 | 1993-12-07 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition for producing non-tacky films |
| DE69130691T2 (en) * | 1990-08-02 | 1999-07-22 | Ppg Industries Inc | Photosensitive, electrodepositable photoresist composition |
| JPH04146687A (en) * | 1990-10-08 | 1992-05-20 | Nippon Paint Co Ltd | Manufacture of solder masked circuit board |
| US5223116A (en) * | 1992-05-11 | 1993-06-29 | Siemens Aktiengesellschaft | Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces |
| KR100465613B1 (en) * | 2002-11-01 | 2005-01-13 | 태창엔지니어링 주식회사 | Electrodeposition resist coating apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3586263D1 (en) * | 1984-03-07 | 1992-08-06 | Ciba Geigy Ag | METHOD FOR PRODUCING IMAGES. |
| US4592816A (en) * | 1984-09-26 | 1986-06-03 | Rohm And Haas Company | Electrophoretic deposition process |
-
1986
- 1986-07-09 JP JP61161422A patent/JPS6317592A/en active Pending
- 1986-08-21 DE DE19863628340 patent/DE3628340A1/en not_active Ceased
- 1986-08-26 CN CN198686105392A patent/CN86105392A/en active Pending
- 1986-08-27 KR KR1019860007119A patent/KR900001798B1/en not_active IP Right Cessation
- 1986-08-28 GB GB08620789A patent/GB2193727A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101144967B (en) * | 2007-06-28 | 2011-04-06 | 武汉立胜超滤科技发展有限公司 | Electrophoresis coating method and whole set apparatus for pattern transfer of positive electrophoresis coating on printing board |
| CN108811359B (en) * | 2018-07-03 | 2019-11-08 | 刘平 | A kind of two-sided and multilayer printed circuit board production method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317592A (en) | 1988-01-25 |
| DE3628340A1 (en) | 1988-01-21 |
| KR880002413A (en) | 1988-04-30 |
| KR900001798B1 (en) | 1990-03-24 |
| GB8620789D0 (en) | 1986-10-08 |
| GB2193727A (en) | 1988-02-17 |
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|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |