GB8715744D0 - Printed circuit boards - Google Patents
Printed circuit boardsInfo
- Publication number
- GB8715744D0 GB8715744D0 GB878715744A GB8715744A GB8715744D0 GB 8715744 D0 GB8715744 D0 GB 8715744D0 GB 878715744 A GB878715744 A GB 878715744A GB 8715744 A GB8715744 A GB 8715744A GB 8715744 D0 GB8715744 D0 GB 8715744D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit boards
- boards
- printed
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61163097A JPS6318692A (en) | 1986-07-11 | 1986-07-11 | Manufacture of printed wiring board |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8715744D0 true GB8715744D0 (en) | 1987-08-12 |
GB2193730A GB2193730A (en) | 1988-02-17 |
GB2193730B GB2193730B (en) | 1991-04-03 |
Family
ID=15767122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8715744A Expired - Lifetime GB2193730B (en) | 1986-07-11 | 1987-07-03 | Production of printed circuit boards |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS6318692A (en) |
KR (1) | KR900003848B1 (en) |
DE (1) | DE3722749C2 (en) |
GB (1) | GB2193730B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5004672A (en) * | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
US5352326A (en) * | 1993-05-28 | 1994-10-04 | International Business Machines Corporation | Process for manufacturing metalized ceramic substrates |
TW290583B (en) * | 1993-10-14 | 1996-11-11 | Alpha Metals Ltd | |
JP4126793B2 (en) * | 1998-10-09 | 2008-07-30 | チッソ株式会社 | Resin composition for color filter |
JP4715234B2 (en) * | 2005-02-28 | 2011-07-06 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, printed wiring board manufacturing method, and photocured product removing method |
DE102020215812A1 (en) | 2020-12-14 | 2022-06-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | power module |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1548401A (en) * | 1967-08-16 | 1968-12-06 | ||
GB1414453A (en) * | 1971-09-03 | 1975-11-19 | Ici Ltd | Recording material |
DE2406400B2 (en) * | 1973-02-14 | 1977-04-28 | Hitachi Chemical Co., Ltd., Tokio | LIGHT-SENSITIVE RESIN COMPOSITIONS ON THE BASIS OF COMPOUNDS WITH EPOXY OR. PHOTOPOLYMERIZABLE ACRYLIC GROUPS |
US4089686A (en) * | 1976-04-19 | 1978-05-16 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
JPS5619752A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Chemical Co Ltd | Photosensitive resin composition laminate |
US4394434A (en) * | 1980-12-08 | 1983-07-19 | Minnesota Mining And Manufacturing Company | Plating resist with improved resistance to extraneous plating |
US4454219A (en) * | 1981-04-27 | 1984-06-12 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition comprised of a polymer obtained from an aliphatic amino group-containing monomer as a comonomer |
US4411980A (en) * | 1981-09-21 | 1983-10-25 | E. I. Du Pont De Nemours And Company | Process for the preparation of flexible circuits |
JPS5888741A (en) * | 1981-11-20 | 1983-05-26 | Hitachi Chem Co Ltd | Photosensitive resin composition and its laminate |
US4448804A (en) * | 1983-10-11 | 1984-05-15 | International Business Machines Corporation | Method for selective electroless plating of copper onto a non-conductive substrate surface |
GB2150596A (en) * | 1983-11-30 | 1985-07-03 | Pa Consulting Services | Mesh structures especially for use in television camera tubes |
JPH0642073B2 (en) * | 1984-04-10 | 1994-06-01 | 三菱レイヨン株式会社 | Photopolymerizable resin composition |
JPH0731399B2 (en) * | 1984-12-21 | 1995-04-10 | 三菱化学株式会社 | Photopolymerizable composition |
-
1986
- 1986-07-11 JP JP61163097A patent/JPS6318692A/en active Granted
-
1987
- 1987-07-03 GB GB8715744A patent/GB2193730B/en not_active Expired - Lifetime
- 1987-07-09 DE DE3722749A patent/DE3722749C2/en not_active Expired - Fee Related
- 1987-07-10 KR KR1019870007457A patent/KR900003848B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2193730B (en) | 1991-04-03 |
JPH0344432B2 (en) | 1991-07-05 |
KR900003848B1 (en) | 1990-06-02 |
JPS6318692A (en) | 1988-01-26 |
DE3722749C2 (en) | 1994-09-15 |
KR880002416A (en) | 1988-04-30 |
GB2193730A (en) | 1988-02-17 |
DE3722749A1 (en) | 1988-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19990703 |