KR880002416A - Manufacturing Method of Printed Circuit Board - Google Patents

Manufacturing Method of Printed Circuit Board Download PDF

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Publication number
KR880002416A
KR880002416A KR1019870007457A KR870007457A KR880002416A KR 880002416 A KR880002416 A KR 880002416A KR 1019870007457 A KR1019870007457 A KR 1019870007457A KR 870007457 A KR870007457 A KR 870007457A KR 880002416 A KR880002416 A KR 880002416A
Authority
KR
South Korea
Prior art keywords
circuit board
manufacturing
printed circuit
resin composition
substrate
Prior art date
Application number
KR1019870007457A
Other languages
Korean (ko)
Other versions
KR900003848B1 (en
Inventor
도시아끼 이시마루
노부유끼 하야시
하루오 아까호시
간지 무라까미
모또요 와지마
Original Assignee
요꼬야마 료오지
히따찌 가세이 고오교 가부시끼가이샤
미따 가쯔시게
가부시끼가이샤 히따찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요꼬야마 료오지, 히따찌 가세이 고오교 가부시끼가이샤, 미따 가쯔시게, 가부시끼가이샤 히따찌 세이사꾸쇼 filed Critical 요꼬야마 료오지
Publication of KR880002416A publication Critical patent/KR880002416A/en
Application granted granted Critical
Publication of KR900003848B1 publication Critical patent/KR900003848B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Abstract

내용 없음No content

Description

인쇄 회로 기판의 제조방법Manufacturing Method of Printed Circuit Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 1 도는 본 발명의 실시예에 사용된 광감성 엘리멘트의 제조용 장치의 개요도.1 is a schematic diagram of an apparatus for producing a photosensitive element used in an embodiment of the present invention.

제 2 도는 본 발명의 실시예에 사용된 시험 네가티브 마스크의 개략도.2 is a schematic diagram of a test negative mask used in an embodiment of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

5 : 폴리에틸렌 테레프탈레이트 필름의 공급롤5: feed roll of polyethylene terephthalate film

6, 7, 8 : 롤 9 : 나이프6, 7, 8: roll 9: knife

10 : 광감성 수지 조성물 용액 11 : 건조기10 photosensitive resin composition solution 11 dryer

12 : 폴리에틸렌 필름의 공급롤 13, 14 : 롤12: feed roll of polyethylene film 13, 14: roll

15 : 광감성 엘리멘트의 권취롤 16 : 폴리에틸렌 데레프탈레이트 필름15 winding roll of photosensitive element 16 polyethylene derephthalate film

17 : 폴리에틸렌 필름 21 : 네가티브 마스크의 불투명부17 polyethylene film 21 opaque portion of the negative mask

22 : 네가티브 마스크의 투명부22: transparent part of negative mask

Claims (6)

(1) 기판의 표면(무전해 도금에 의해 동이 석출되어야 할 필요 부분)에 (A)(a) 적어도 하나의 말단 메타크릴로일기를 가지고 그 분자내에 적어도 하나의 수소원자와 직접 결합한 질소원자를 갖지 않는 적어도 한 종류의 불포화 화합물 5 내지 99중량%와 (b) 적어도 하나의 말단 아크릴로일기를 가지고 그 분자내에 적어도 하나의 수소원자와 직접 결합한 질소원자를 갖지 않는 적어도 한 종류의 불포화 화합물 95 내지 1중량%를 구성하는 광중합성 혼합 성분 100중량부와, (B) 분자내에 적어도 하나의 수소원자와 직접 결합한 질소원자를 갖지 않는 선형 고분자 화합물 0 내지 400중량부 및, (C) 활성광의 조사시 유리 래디칼을 생성하는 증감제 및/또는 증감제계 0.5 내지 20중량부를 함유하는 광감성 수지 조성물층을 형성하는 단계, (2)상기 광감성 수지 조성물에 상적인 활성광을 조사하고 현상하여 기판의 표면상에 광감성 수지 조성물의 네가티브 패턴을 형성하는 단계, 및 (3) 도금 레지스트로서 상기 광감성 수지 조성물의 네가티브 패턴을 이용하여 기판에 무전해 동도금을 실시하여 기판의 표면에 회로 패턴을 형성하는 단계를 구성함을 특징으로 하는 인쇄 회로 기판의 제조방법.(1) A nitrogen atom directly bonded to at least one hydrogen atom in the molecule with (A) (a) at least one terminal methacryloyl group on the surface of the substrate (necessary portion where copper should be precipitated by electroless plating). 5 to 99% by weight of at least one type of unsaturated compound not having, and (b) at least one type of unsaturated compound having from at least one terminal acryloyl group and having no nitrogen atom directly bonded to at least one hydrogen atom in the molecule. 100 parts by weight of the photopolymerizable mixed component constituting 1% by weight, (B) 0 to 400 parts by weight of the linear polymer compound having no nitrogen atom directly bonded to at least one hydrogen atom in the molecule, and (C) upon irradiation of the actinic light Forming a photosensitive resin composition layer containing 0.5 to 20 parts by weight of a sensitizer and / or a sensitizer to produce free radicals, and (2) an image on the photosensitive resin composition Irradiating and developing phosphorus actinic light to form a negative pattern of the photosensitive resin composition on the surface of the substrate, and (3) electroless copper plating on the substrate using the negative pattern of the photosensitive resin composition as the plating resist. And forming a circuit pattern on the surface of the substrate. 제 1 항에 있어서, 분자내에 적어도 하나의 수소원자와 직접 결합한 질소원자를 갖지 않는 선형 고분자 화합물(B)이 곁사슬로서 적어도 하나의 테트라히드로푸르푸릴기를 갖는 것을 특징으로 하는 인쇄 회로 기판의 제조방법.The method of manufacturing a printed circuit board according to claim 1, wherein the linear polymer compound (B) having no nitrogen atom directly bonded to at least one hydrogen atom in the molecule has at least one tetrahydrofurfuryl group as a side chain. 제 1 항에 있어서, 광감성 수지 조성물층을 형성하는 단계가 기관의 표면상에 광감성 엘리멘트를 적층시킴으로써 실시됨을 특징으로 하는 인쇄 회로 기판의 제조방법.The method of manufacturing a printed circuit board according to claim 1, wherein the step of forming the photosensitive resin composition layer is carried out by laminating photosensitive elements on the surface of the engine. 제 2 항에 있어서, 광감성 수지 조성물층을 형성하는 단계가 기판의 표면상에 광감성 엘리멘트를 적층시킴으로써 실시됨을 특징으로 하는 인쇄 회로 기판의 제조방법.The method of manufacturing a printed circuit board according to claim 2, wherein the step of forming the photosensitive resin composition layer is carried out by laminating photosensitive elements on the surface of the substrate. 제 1 항에 있어서, 상기 현상[단계(2)]후, 기판 표면에 활성광을 재조사하는 단계를 더 구성함을 특징으로 하는 인쇄 회로 기판의 제조방법.The method of manufacturing a printed circuit board according to claim 1, further comprising re-irradiating actinic light on the surface of the substrate after the development (step (2)). 제 1 항에 있어서, 적어도 하나의 말단 메타크릴로일기를 가지고 그 분자내에 적어도 하나의 수소원자와 직접 결합한 질소원자를 갖지 않는 적어도 한 종류의 불포화 화합물이 수소원자와 직접 결합한 산소원자도 포함하지 않음을 특징으로 하는 인쇄 회로 기판의 제조방법.The method of claim 1, wherein at least one unsaturated compound having at least one terminal methacryloyl group and not having a nitrogen atom directly bonded to at least one hydrogen atom in the molecule does not include an oxygen atom directly bonded to a hydrogen atom. Method of manufacturing a printed circuit board, characterized in that. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870007457A 1986-07-11 1987-07-10 Manufacture of printed wiring board KR900003848B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61163097A JPS6318692A (en) 1986-07-11 1986-07-11 Manufacture of printed wiring board
JP163097 1986-07-11
JP86-163097 1986-07-11

Publications (2)

Publication Number Publication Date
KR880002416A true KR880002416A (en) 1988-04-30
KR900003848B1 KR900003848B1 (en) 1990-06-02

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ID=15767122

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007457A KR900003848B1 (en) 1986-07-11 1987-07-10 Manufacture of printed wiring board

Country Status (4)

Country Link
JP (1) JPS6318692A (en)
KR (1) KR900003848B1 (en)
DE (1) DE3722749C2 (en)
GB (1) GB2193730B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004672A (en) * 1989-07-10 1991-04-02 Shipley Company Inc. Electrophoretic method for applying photoresist to three dimensional circuit board substrate
US5352326A (en) * 1993-05-28 1994-10-04 International Business Machines Corporation Process for manufacturing metalized ceramic substrates
TW290583B (en) * 1993-10-14 1996-11-11 Alpha Metals Ltd
JP4126793B2 (en) * 1998-10-09 2008-07-30 チッソ株式会社 Resin composition for color filter
JP4715234B2 (en) * 2005-02-28 2011-07-06 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, printed wiring board manufacturing method, and photocured product removing method
DE102020215812A1 (en) 2020-12-14 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung power module

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Publication number Priority date Publication date Assignee Title
FR1548401A (en) * 1967-08-16 1968-12-06
GB1414453A (en) * 1971-09-03 1975-11-19 Ici Ltd Recording material
DE2406400B2 (en) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio LIGHT-SENSITIVE RESIN COMPOSITIONS ON THE BASIS OF COMPOUNDS WITH EPOXY OR. PHOTOPOLYMERIZABLE ACRYLIC GROUPS
US4089686A (en) * 1976-04-19 1978-05-16 Western Electric Company, Inc. Method of depositing a metal on a surface
JPS5619752A (en) * 1979-07-27 1981-02-24 Hitachi Chemical Co Ltd Photosensitive resin composition laminate
US4394434A (en) * 1980-12-08 1983-07-19 Minnesota Mining And Manufacturing Company Plating resist with improved resistance to extraneous plating
US4454219A (en) * 1981-04-27 1984-06-12 Hitachi Chemical Company, Ltd. Photosensitive resin composition comprised of a polymer obtained from an aliphatic amino group-containing monomer as a comonomer
US4411980A (en) * 1981-09-21 1983-10-25 E. I. Du Pont De Nemours And Company Process for the preparation of flexible circuits
JPS5888741A (en) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd Photosensitive resin composition and its laminate
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
GB2150596A (en) * 1983-11-30 1985-07-03 Pa Consulting Services Mesh structures especially for use in television camera tubes
JPH0642073B2 (en) * 1984-04-10 1994-06-01 三菱レイヨン株式会社 Photopolymerizable resin composition
JPH0731399B2 (en) * 1984-12-21 1995-04-10 三菱化学株式会社 Photopolymerizable composition

Also Published As

Publication number Publication date
GB2193730B (en) 1991-04-03
JPS6318692A (en) 1988-01-26
JPH0344432B2 (en) 1991-07-05
DE3722749C2 (en) 1994-09-15
GB8715744D0 (en) 1987-08-12
DE3722749A1 (en) 1988-01-21
KR900003848B1 (en) 1990-06-02
GB2193730A (en) 1988-02-17

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