GB8322474D0 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB8322474D0
GB8322474D0 GB838322474A GB8322474A GB8322474D0 GB 8322474 D0 GB8322474 D0 GB 8322474D0 GB 838322474 A GB838322474 A GB 838322474A GB 8322474 A GB8322474 A GB 8322474A GB 8322474 D0 GB8322474 D0 GB 8322474D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB838322474A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB838322474A priority Critical patent/GB8322474D0/en
Publication of GB8322474D0 publication Critical patent/GB8322474D0/en
Priority to DE19843428812 priority patent/DE3428812A1/en
Priority to ZA846089A priority patent/ZA846089B/en
Priority to AU32046/84A priority patent/AU571886B2/en
Priority to NL8402527A priority patent/NL8402527A/en
Priority to GB08421094A priority patent/GB2145574B/en
Priority to FR848412980A priority patent/FR2550906B1/en
Priority to JP59171699A priority patent/JPS6059799A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
GB838322474A 1983-08-20 1983-08-20 Printed circuit boards Pending GB8322474D0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB838322474A GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards
DE19843428812 DE3428812A1 (en) 1983-08-20 1984-08-04 PRINTED CIRCUIT BOARDS AND METHOD FOR THEIR PRODUCTION
ZA846089A ZA846089B (en) 1983-08-20 1984-08-06 Printed circuit boards
AU32046/84A AU571886B2 (en) 1983-08-20 1984-08-17 Printed circuit board
NL8402527A NL8402527A (en) 1983-08-20 1984-08-17 MULTILAYER LAYER WITH PRINTED WIRING, AND METHOD FOR MANUFACTURING THE SAME.
GB08421094A GB2145574B (en) 1983-08-20 1984-08-20 Multi-layer printed circuit boards
FR848412980A FR2550906B1 (en) 1983-08-20 1984-08-20 MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
JP59171699A JPS6059799A (en) 1983-08-20 1984-08-20 Composite layer printed circuit board and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838322474A GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards

Publications (1)

Publication Number Publication Date
GB8322474D0 true GB8322474D0 (en) 1983-09-21

Family

ID=10547638

Family Applications (2)

Application Number Title Priority Date Filing Date
GB838322474A Pending GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards
GB08421094A Expired GB2145574B (en) 1983-08-20 1984-08-20 Multi-layer printed circuit boards

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB08421094A Expired GB2145574B (en) 1983-08-20 1984-08-20 Multi-layer printed circuit boards

Country Status (7)

Country Link
JP (1) JPS6059799A (en)
AU (1) AU571886B2 (en)
DE (1) DE3428812A1 (en)
FR (1) FR2550906B1 (en)
GB (2) GB8322474D0 (en)
NL (1) NL8402527A (en)
ZA (1) ZA846089B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618B1 (en) * 1983-09-02 1989-12-01 Inf Milit Spatiale Aeronaut METHOD FOR MANUFACTURING A PRINTED CIRCUIT WITH BURIED LAYERS AND PRINTED CIRCUIT OBTAINED BY SUCH A METHOD
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
TW526693B (en) * 2000-06-15 2003-04-01 Murata Manufacturing Co Multilayer circuit component and method for manufacturing the same
DE102015111432A1 (en) * 2015-07-15 2017-01-19 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Method for processing a mechatronic system for a commercial vehicle and a mechatronic system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2650348A1 (en) * 1976-11-03 1978-05-11 Bosch Gmbh Robert Electric component soldered on printed circuit board - using layer of nickel covered by gold to ensure strong soldered joint
AU530841B2 (en) * 1979-05-24 1983-07-28 Fujitsu Limited Hollow multilayer printed wiring board, and method of fabricating same
FR2476428A1 (en) * 1980-02-15 1981-08-21 Tech Electro Cie Indle METHOD FOR FASTENING ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT AND PRODUCT OBTAINED THEREBY
JPS5724775U (en) * 1980-07-17 1982-02-08

Also Published As

Publication number Publication date
ZA846089B (en) 1985-03-27
AU3204684A (en) 1985-02-21
GB8421094D0 (en) 1984-09-26
FR2550906A1 (en) 1985-02-22
AU571886B2 (en) 1988-04-28
JPS6059799A (en) 1985-04-06
GB2145574A (en) 1985-03-27
NL8402527A (en) 1985-03-18
GB2145574B (en) 1986-04-09
DE3428812A1 (en) 1985-03-07
FR2550906B1 (en) 1992-09-04

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