GB8322222D0 - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- GB8322222D0 GB8322222D0 GB838322222A GB8322222A GB8322222D0 GB 8322222 D0 GB8322222 D0 GB 8322222D0 GB 838322222 A GB838322222 A GB 838322222A GB 8322222 A GB8322222 A GB 8322222A GB 8322222 D0 GB8322222 D0 GB 8322222D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit board
- printed circuit
- printed
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41963482A | 1982-09-17 | 1982-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8322222D0 true GB8322222D0 (en) | 1983-09-21 |
GB2126794A GB2126794A (en) | 1984-03-28 |
Family
ID=23663078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08322222A Withdrawn GB2126794A (en) | 1982-09-17 | 1983-08-18 | Printed circuit board |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5972756A (en) |
AU (1) | AU1843683A (en) |
DE (2) | DE8322946U1 (en) |
FR (1) | FR2533399A1 (en) |
GB (1) | GB2126794A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111988909A (en) * | 2019-05-23 | 2020-11-24 | 辉达公司 | Printed circuit board, layout method thereof and electronic equipment |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2588124B1 (en) * | 1985-09-27 | 1987-11-20 | Thomson Csf | METHOD FOR CONNECTING AN ELECTRONIC CIRCUIT TO A FLAT AND FLEXIBLE CONNECTOR CABLE |
JPS6387064U (en) * | 1986-11-27 | 1988-06-07 | ||
IL85008A0 (en) * | 1987-01-21 | 1988-06-30 | Hughes Aircraft Co | Method for connecting leadless chip packages and articles |
DE4232266A1 (en) * | 1992-09-25 | 1994-03-31 | Siemens Ag | Circuit board structure with two through-contacted surfaces - has SMD components on top and bottom sides of circuit board for parallel input terminals above each other |
JP4770514B2 (en) * | 2006-02-27 | 2011-09-14 | 株式会社デンソー | Electronic equipment |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3646399A (en) * | 1970-03-04 | 1972-02-29 | Gen Electric | Printed circuit board construction |
-
1983
- 1983-08-09 DE DE8322946U patent/DE8322946U1/de not_active Expired
- 1983-08-09 DE DE19833328736 patent/DE3328736A1/en not_active Withdrawn
- 1983-08-18 GB GB08322222A patent/GB2126794A/en not_active Withdrawn
- 1983-08-25 AU AU18436/83A patent/AU1843683A/en not_active Abandoned
- 1983-09-16 JP JP58171071A patent/JPS5972756A/en active Pending
- 1983-09-16 FR FR8314801A patent/FR2533399A1/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111988909A (en) * | 2019-05-23 | 2020-11-24 | 辉达公司 | Printed circuit board, layout method thereof and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
JPS5972756A (en) | 1984-04-24 |
GB2126794A (en) | 1984-03-28 |
AU1843683A (en) | 1984-03-22 |
FR2533399A1 (en) | 1984-03-23 |
DE8322946U1 (en) | 1987-05-07 |
DE3328736A1 (en) | 1984-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |