JPS5713791A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS5713791A JPS5713791A JP8872780A JP8872780A JPS5713791A JP S5713791 A JPS5713791 A JP S5713791A JP 8872780 A JP8872780 A JP 8872780A JP 8872780 A JP8872780 A JP 8872780A JP S5713791 A JPS5713791 A JP S5713791A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8872780A JPS5713791A (en) | 1980-06-30 | 1980-06-30 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8872780A JPS5713791A (en) | 1980-06-30 | 1980-06-30 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5713791A true JPS5713791A (en) | 1982-01-23 |
Family
ID=13950941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8872780A Pending JPS5713791A (en) | 1980-06-30 | 1980-06-30 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5713791A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58166064U (en) * | 1982-04-30 | 1983-11-05 | パイオニア株式会社 | Stylus land |
JPS6171691A (en) * | 1984-09-17 | 1986-04-12 | 富士通テン株式会社 | Method of detecting split groove arrangement leakage of split printed board |
JPS6165771U (en) * | 1984-10-03 | 1986-05-06 | ||
JPS6183071U (en) * | 1984-11-06 | 1986-06-02 | ||
JPH01108966U (en) * | 1988-01-14 | 1989-07-24 | ||
JPH01169061U (en) * | 1988-05-19 | 1989-11-29 | ||
JP2007173627A (en) * | 2005-12-22 | 2007-07-05 | Ngk Spark Plug Co Ltd | Capacitor incorporated into wiring board, and manufacturing method thereof |
US8304321B2 (en) | 2005-12-22 | 2012-11-06 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339248B2 (en) * | 1974-12-26 | 1978-10-20 |
-
1980
- 1980-06-30 JP JP8872780A patent/JPS5713791A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339248B2 (en) * | 1974-12-26 | 1978-10-20 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58166064U (en) * | 1982-04-30 | 1983-11-05 | パイオニア株式会社 | Stylus land |
JPS6171691A (en) * | 1984-09-17 | 1986-04-12 | 富士通テン株式会社 | Method of detecting split groove arrangement leakage of split printed board |
JPH0360192B2 (en) * | 1984-09-17 | 1991-09-12 | Fujitsu Ten Ltd | |
JPS6165771U (en) * | 1984-10-03 | 1986-05-06 | ||
JPS6183071U (en) * | 1984-11-06 | 1986-06-02 | ||
JPH01108966U (en) * | 1988-01-14 | 1989-07-24 | ||
JPH01169061U (en) * | 1988-05-19 | 1989-11-29 | ||
JP2007173627A (en) * | 2005-12-22 | 2007-07-05 | Ngk Spark Plug Co Ltd | Capacitor incorporated into wiring board, and manufacturing method thereof |
JP4746423B2 (en) * | 2005-12-22 | 2011-08-10 | 日本特殊陶業株式会社 | Wiring board built-in capacitor manufacturing method and wiring board built-in capacitor |
US8304321B2 (en) | 2005-12-22 | 2012-11-06 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8350306B2 (en) | 2005-12-22 | 2013-01-08 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8697534B2 (en) | 2005-12-22 | 2014-04-15 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
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