GB2137422B - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
GB2137422B
GB2137422B GB08308882A GB8308882A GB2137422B GB 2137422 B GB2137422 B GB 2137422B GB 08308882 A GB08308882 A GB 08308882A GB 8308882 A GB8308882 A GB 8308882A GB 2137422 B GB2137422 B GB 2137422B
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08308882A
Other versions
GB2137422A (en
GB8308882D0 (en
Inventor
Geoffrey Charles Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB08308882A priority Critical patent/GB2137422B/en
Publication of GB8308882D0 publication Critical patent/GB8308882D0/en
Publication of GB2137422A publication Critical patent/GB2137422A/en
Application granted granted Critical
Publication of GB2137422B publication Critical patent/GB2137422B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
GB08308882A 1983-03-30 1983-03-30 Printed circuit board Expired GB2137422B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08308882A GB2137422B (en) 1983-03-30 1983-03-30 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08308882A GB2137422B (en) 1983-03-30 1983-03-30 Printed circuit board

Publications (3)

Publication Number Publication Date
GB8308882D0 GB8308882D0 (en) 1983-05-11
GB2137422A GB2137422A (en) 1984-10-03
GB2137422B true GB2137422B (en) 1986-10-29

Family

ID=10540523

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08308882A Expired GB2137422B (en) 1983-03-30 1983-03-30 Printed circuit board

Country Status (1)

Country Link
GB (1) GB2137422B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1201315B (en) * 1985-06-17 1989-01-27 M A S Ind Spa METHOD TO ENSURE THE COOLING OF ELECTRONIC COMPONENTS FIXED ON A MULTILAYER FOR MOLDED AND MULTI-LAYER CIRCUITS REALIZED ACCORDING TO THAT METHOD
EP0399161B1 (en) * 1989-04-17 1995-01-11 International Business Machines Corporation Multi-level circuit card structure
GB2247782A (en) * 1990-09-05 1992-03-11 Marconi Gec Ltd A circuit board assembly
JPH0828583B2 (en) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション Multilayer printed circuit board, manufacturing method thereof, and ball dispenser
DE4446594A1 (en) * 1994-12-24 1996-06-27 Bosch Gmbh Robert Electric device
DE19516547A1 (en) * 1995-05-05 1996-11-14 Bosch Gmbh Robert Printed circuit board with an electrically conductive layer and method for producing a printed circuit board
US5831826A (en) * 1996-09-20 1998-11-03 Motorola, Inc. Heat transfer apparatus suitable for use in a circuit board assembly
US7628512B2 (en) * 2005-10-26 2009-12-08 Pentair Water Pool And Spa, Inc. LED pool and spa light

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1197281A (en) * 1966-10-17 1970-07-01 Ass Elect Ind Improvements in Thin Film Circuits
GB1594834A (en) * 1978-05-08 1981-08-05 Plessey Co Ltd Method of bonding a heat sink to a printed circuit board

Also Published As

Publication number Publication date
GB2137422A (en) 1984-10-03
GB8308882D0 (en) 1983-05-11

Similar Documents

Publication Publication Date Title
GB2125100B (en) Printed circuit board supports
EP0146241A3 (en) Circuit board
DE3475592D1 (en) Printed circuit board
GB8322473D0 (en) Printed circuit boards
GB8307142D0 (en) Printed circuit boards
GB2124035B (en) Printed circuit boards
GB8300836D0 (en) Printed circuit board
DE3475023D1 (en) Circuit board
GB8311200D0 (en) Printed circuit board
GB8304280D0 (en) Printed circuit boards
GB2137422B (en) Printed circuit board
DE3380394D1 (en) Improved printed circuit board
GB8322222D0 (en) Printed circuit board
HK38887A (en) Printed circuit boards
GB8326169D0 (en) Printed circuit board
GB8322474D0 (en) Printed circuit boards
GB8317952D0 (en) Printed circuit board
GB2139007B (en) Multi-layer printed circuit board
GB2150361B (en) Circuit board
GB2098809B (en) Printed circuit board
JPS57130499A (en) Printed circuit board
SU1157708A1 (en) Printed circuit board
GB2136211B (en) Printed circuit board
GB8300247D0 (en) Printed circuit board
AU88868S (en) Printed circuit board

Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940330