GB2145574B - Multi-layer printed circuit boards - Google Patents

Multi-layer printed circuit boards

Info

Publication number
GB2145574B
GB2145574B GB08421094A GB8421094A GB2145574B GB 2145574 B GB2145574 B GB 2145574B GB 08421094 A GB08421094 A GB 08421094A GB 8421094 A GB8421094 A GB 8421094A GB 2145574 B GB2145574 B GB 2145574B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
layer printed
layer
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08421094A
Other versions
GB2145574A (en
GB8421094D0 (en
Inventor
Gordon Leslie Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of GB8421094D0 publication Critical patent/GB8421094D0/en
Publication of GB2145574A publication Critical patent/GB2145574A/en
Application granted granted Critical
Publication of GB2145574B publication Critical patent/GB2145574B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
GB08421094A 1983-08-20 1984-08-20 Multi-layer printed circuit boards Expired GB2145574B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838322474A GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards

Publications (3)

Publication Number Publication Date
GB8421094D0 GB8421094D0 (en) 1984-09-26
GB2145574A GB2145574A (en) 1985-03-27
GB2145574B true GB2145574B (en) 1986-04-09

Family

ID=10547638

Family Applications (2)

Application Number Title Priority Date Filing Date
GB838322474A Pending GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards
GB08421094A Expired GB2145574B (en) 1983-08-20 1984-08-20 Multi-layer printed circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB838322474A Pending GB8322474D0 (en) 1983-08-20 1983-08-20 Printed circuit boards

Country Status (7)

Country Link
JP (1) JPS6059799A (en)
AU (1) AU571886B2 (en)
DE (1) DE3428812A1 (en)
FR (1) FR2550906B1 (en)
GB (2) GB8322474D0 (en)
NL (1) NL8402527A (en)
ZA (1) ZA846089B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2551618B1 (en) * 1983-09-02 1989-12-01 Inf Milit Spatiale Aeronaut METHOD FOR MANUFACTURING A PRINTED CIRCUIT WITH BURIED LAYERS AND PRINTED CIRCUIT OBTAINED BY SUCH A METHOD
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
TW526693B (en) 2000-06-15 2003-04-01 Murata Manufacturing Co Multilayer circuit component and method for manufacturing the same
DE102015111432A1 (en) * 2015-07-15 2017-01-19 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Method for processing a mechatronic system for a commercial vehicle and a mechatronic system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2650348A1 (en) * 1976-11-03 1978-05-11 Bosch Gmbh Robert Electric component soldered on printed circuit board - using layer of nickel covered by gold to ensure strong soldered joint
BR8008696A (en) * 1979-05-24 1981-04-14 Fujitsu Ltd MULTIPLE LAYER PRINTED CIRCUIT PANEL, HOLLOW, AND PROCESS FOR MANUFACTURING THE SAME
FR2476428A1 (en) * 1980-02-15 1981-08-21 Tech Electro Cie Indle METHOD FOR FASTENING ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT AND PRODUCT OBTAINED THEREBY
JPS5724775U (en) * 1980-07-17 1982-02-08

Also Published As

Publication number Publication date
ZA846089B (en) 1985-03-27
GB8322474D0 (en) 1983-09-21
GB2145574A (en) 1985-03-27
GB8421094D0 (en) 1984-09-26
JPS6059799A (en) 1985-04-06
AU3204684A (en) 1985-02-21
FR2550906A1 (en) 1985-02-22
NL8402527A (en) 1985-03-18
FR2550906B1 (en) 1992-09-04
DE3428812A1 (en) 1985-03-07
AU571886B2 (en) 1988-04-28

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020820