GB2101411B - Flexi-rigid printed circuit boards - Google Patents

Flexi-rigid printed circuit boards

Info

Publication number
GB2101411B
GB2101411B GB08117140A GB8117140A GB2101411B GB 2101411 B GB2101411 B GB 2101411B GB 08117140 A GB08117140 A GB 08117140A GB 8117140 A GB8117140 A GB 8117140A GB 2101411 B GB2101411 B GB 2101411B
Authority
GB
United Kingdom
Prior art keywords
flexi
printed circuit
circuit boards
rigid printed
rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08117140A
Other versions
GB2101411A (en
Inventor
John Alan Scarlett
James Alexander Grant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB08117140A priority Critical patent/GB2101411B/en
Publication of GB2101411A publication Critical patent/GB2101411A/en
Application granted granted Critical
Publication of GB2101411B publication Critical patent/GB2101411B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
GB08117140A 1981-06-04 1981-06-04 Flexi-rigid printed circuit boards Expired GB2101411B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08117140A GB2101411B (en) 1981-06-04 1981-06-04 Flexi-rigid printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08117140A GB2101411B (en) 1981-06-04 1981-06-04 Flexi-rigid printed circuit boards

Publications (2)

Publication Number Publication Date
GB2101411A GB2101411A (en) 1983-01-12
GB2101411B true GB2101411B (en) 1985-06-05

Family

ID=10522276

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08117140A Expired GB2101411B (en) 1981-06-04 1981-06-04 Flexi-rigid printed circuit boards

Country Status (1)

Country Link
GB (1) GB2101411B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144968A (en) * 1983-02-08 1984-08-20 Sharp Corp Thin type electronic instrument
DE3318717C1 (en) * 1983-05-21 1984-05-30 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth Process for manufacturing printed circuit boards with rigid and flexible areas
JP2631287B2 (en) * 1987-06-30 1997-07-16 日本メクトロン 株式会社 Manufacturing method of hybrid multilayer circuit board
JPH0635499Y2 (en) * 1989-08-09 1994-09-14 ファイン電子株式会社 Double sided printed circuit board
DE602004005598T2 (en) 2003-07-08 2008-01-24 Viasystems Group, Inc. METHOD FOR PRODUCING A MIDPLANE
ES2234430B1 (en) * 2003-12-11 2006-11-01 Vitelcom Mobile Technology, S.A. PRINTED CIRCUIT PLATE STRUCTURE (PCB) CONFIGURED WITH DIFFERENT LEVELS.

Also Published As

Publication number Publication date
GB2101411A (en) 1983-01-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee