JPH01215092A - Manufacture of printed board - Google Patents

Manufacture of printed board

Info

Publication number
JPH01215092A
JPH01215092A JP4120288A JP4120288A JPH01215092A JP H01215092 A JPH01215092 A JP H01215092A JP 4120288 A JP4120288 A JP 4120288A JP 4120288 A JP4120288 A JP 4120288A JP H01215092 A JPH01215092 A JP H01215092A
Authority
JP
Japan
Prior art keywords
printed board
hole
holes
prepreg
penetrating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4120288A
Other languages
Japanese (ja)
Inventor
Yutaka Igarashi
豊 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4120288A priority Critical patent/JPH01215092A/en
Publication of JPH01215092A publication Critical patent/JPH01215092A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To shorten manufacturing process and to reduce manufacturing cost, by a method wherein through holes are bored at predetermined positions through a printed board, and another printed board is then laminated on the resultant printed board to form a multilayer structure, and thereby the through holes are made non-through holes for being inserted therein to with leads of a mounting component. CONSTITUTION:Both a double sided printed board 11 and a double-sided printed board 12 between which a prepreg 13 is held are pressed with being heated to produce a multilayer printed board 20. With this resultant multilayer printed board 20, non-through holes 14 are plated with conductive plating material 22. Among the plated non-through holes 14, with the holes 14 (indicated by an arrow A) in the opening of which a hole 19 of the prepreg 13 is located, the conductive plating material 22 extends from the inner face of the hole 14 to a circuit face pattern 17 through the hole 19 of the prepreg 13 to be connected with the circuit face pattern 17. On the other hand, with the hole 14 (indicated by an arrow B) whose position does not correspond to the hole 19 of the prepreg 13, the conductive plating material 2 is blocked by the prepreg 13 to remain within the hole 14, and therefore it is insulated from the circuit face pattern 17. Accordingly, when a component 23 is mounted, leads 24 of the component 23 are inserted into the respective holes 14 and then electrically connected to the holes 14 by solder 25.

Description

【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、不貫通スルーホールを有するプリント板の製
造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method of manufacturing a printed board having non-penetrating through holes.

（従来の技術） 従来の不貫通スルーホールを６するプリント板としては
、例えば第４図に示すようなものが知られている。(Prior Art) As a conventional printed board having non-penetrating through holes, for example, the one shown in FIG. 4 is known.

この図において、符号１はプリント板を示し、このプリ
ント板１には、不貫通スルーホール２が設けられている
。この不貫通スルーホール２には、実装部品３の部品リ
ード４が挿入されて、半田５によって電気的接続が行な
われている。また、符号６は第１層の外層配線パターン
、符号７．８はそれぞれ第２層、第３層の内層配線パタ
ーン、符号９は第４層の外層配線パターン、符号１０は
ランド、符号１１は貫通スルーホールを示す。このよう
なプリント板は、積層後プリント板毎にドリルによって
１つずつ不貫通スルーホール２の穴明けを行ない、その
後スルーホールめっきを行ない製造するようにしている
。In this figure, reference numeral 1 indicates a printed board, and this printed board 1 is provided with a non-penetrating through hole 2. A component lead 4 of a mounted component 3 is inserted into the non-penetrating through hole 2, and an electrical connection is made with solder 5. Further, reference numeral 6 is an outer layer wiring pattern of the first layer, numerals 7 and 8 are inner layer wiring patterns of the second and third layers, respectively, numeral 9 is an outer layer wiring pattern of the fourth layer, numeral 10 is a land, and numeral 11 is a A through-hole is shown. Such printed boards are manufactured by drilling one non-penetrating through hole 2 in each printed board after lamination, and then plating the through holes.

（発明が解決しようとする課題） ところで、上記のプリント板の製造方法にあっては、プ
リント板の積層後不貫通スルーホール２゜・・・をドリ
ルで個々に穴明けするようにしている。(Problems to be Solved by the Invention) By the way, in the method for manufacturing printed boards described above, after the printed boards are laminated, the non-penetrating through holes 2° are individually drilled with a drill.

このため、穴明けに多くの作業と時間を必要とし、プリ
ント板製造工程が増加し、コスト高をまねいていた。ま
た、ドリルの穴深さを高精度に維持する必要があり、し
たがって作業の手間がかかるとともに高精度の加工機械
を必要とし、コストが高くつくという問題点があった。For this reason, drilling holes requires a lot of work and time, which increases the number of printed board manufacturing steps and increases costs. In addition, it is necessary to maintain the depth of the drill hole with high accuracy, which causes problems in that the work is time-consuming and requires a high-precision processing machine, resulting in high costs.

本発明は、製造工程を短縮しコストを低減することがで
きるプリント板の製造方法を提供することを目的として
いる。An object of the present invention is to provide a printed board manufacturing method that can shorten the manufacturing process and reduce costs.

〔発明の構成〕[Structure of the invention]

（課題を解決するための手段） 本発明は、上記課題を解決するためになされたもので、
プリント板の所定位置に貫通孔を形成し、このプリント
板に他のプリント板を積層して多層構造とし、前記貫通
孔を実装部品のリードを挿入するための不貫通スルーホ
ールとしている。(Means for Solving the Problems) The present invention has been made to solve the above problems.
A through hole is formed at a predetermined position on a printed board, another printed board is laminated on this printed board to form a multilayer structure, and the through hole is made into a non-penetrating through hole for inserting a lead of a mounted component.

（作　用） 本発明にあっては、プリント板の所定位置に後に不貫通
スルーホールとなる貫通孔を形成し、その後プリント板
を積層するようにしているから、一般の製造プロセスで
製造することができ、したがって余分な製造工程を必要
とせず、製造工程を短縮することができる。また、貫通
孔を形成すればよいのでドリルの穴深さの精度を考慮す
る必要がない。(Function) In the present invention, a through hole that later becomes a non-through hole is formed at a predetermined position of a printed board, and then the printed boards are laminated, so that it can be manufactured using a general manufacturing process. Therefore, no extra manufacturing process is required, and the manufacturing process can be shortened. Furthermore, since it is sufficient to form a through hole, there is no need to consider the accuracy of the hole depth of the drill.

したがって、作業の手間を削減することができるととも
に、高精度の加工機械を必要とせず製造コストを低くお
さえることができる。Therefore, it is possible to reduce the labor involved in the work, and also to keep manufacturing costs low without requiring a high-precision processing machine.

（実施例） 以ド、本発明の一実施例について、第１図ないし第３図
を参照して説明する。(Embodiment) Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 3.

まず、第１図（ａ）に示す両面プリント板１１、第１図
（ｂ）に示す両面プリント板１２、第１図（ｃ）に示す
プリプレグ１３を製造する。First, a double-sided printed board 11 shown in FIG. 1(a), a double-sided printed board 12 shown in FIG. 1(b), and a prepreg 13 shown in FIG. 1(c) are manufactured.

第１図（ａ）に示す両面プリント板１１には、実装部品
のリードを挿入するための複数のスルーホール１４．・
・・を形成するとともに、実装側の面に第１層の回路パ
ターン１５、反対側の面に第２層の回路パターン１６を
形成する。The double-sided printed board 11 shown in FIG. 1(a) has a plurality of through holes 14 for inserting leads of mounted components.・
. . , a first layer circuit pattern 15 is formed on the mounting side surface, and a second layer circuit pattern 16 is formed on the opposite surface.

第１図（ｂ）に示す両面プリント板１２には、実装側の
面に第３層の回路パターン１７、反対側の面に第４層の
回路パターン１８を形成する。On the double-sided printed board 12 shown in FIG. 1(b), a third layer circuit pattern 17 is formed on the mounting side, and a fourth layer circuit pattern 18 is formed on the opposite side.

第１図（Ｃ）に示すプリプレグ１３には、両面プリント
板１１のスルーホール１４．・・・のうち第３層の回路
パターン１７と導通をとるべきスルーホール１４に対応
する位置に孔１９を形成する。The prepreg 13 shown in FIG. 1(C) has through holes 14 in the double-sided printed board 11. . . , holes 19 are formed at positions corresponding to through holes 14 that are to be electrically connected to the circuit pattern 17 in the third layer.

このような両面プリント板１１と両面プリント板１２と
の間にプリプレグ１３を介装し、ヒートプレス等により
加圧加熱して一体の多層プリント板２０を製造する。A prepreg 13 is interposed between the double-sided printed board 11 and the double-sided printed board 12, and an integrated multilayer printed board 20 is manufactured by applying pressure and heating using a heat press or the like.

プリプレグ１３はガラス布を基材とし、結合剤として半
硬化状態のエポキシ樹脂を含浸させたもので、接着及び
絶縁層として用いられ、加圧加熱により両面プリント板
１１と両面プリント板１２とが接着されて一体の多層プ
リント板２０となる。The prepreg 13 is made of glass cloth as a base material and is impregnated with a semi-cured epoxy resin as a binder. It is used as an adhesive and an insulating layer, and the double-sided printed board 11 and the double-sided printed board 12 are bonded together by pressure and heating. As a result, an integrated multilayer printed board 20 is formed.

このようにして製造された多層プリント板２０に実装側
から反対側へ貫通する貫通孔２１を形成する。その後、
この貫通孔２１および既に形成されたスルーホール（以
下不貫通スルーホールという）１４．・・・にパートリ
アディティブ等の製法によって導電性めっき２２を施す
。A through hole 21 penetrating from the mounting side to the opposite side is formed in the multilayer printed board 20 manufactured in this way. after that,
This through hole 21 and the already formed through hole (hereinafter referred to as non-penetrating through hole) 14. Conductive plating 22 is applied to .

ここで、第３図に示すように不貫通スルーホール１４．
・・・のうち、その開口部にプリプレグ１３の孔が位置
している不貫通スルーホール１４（第３図中矢印Ａで示
す不貫通スルーホール１４）においては、導電性めっき
２２は、不貫通スルーホールの内面からプリプレグ１３
の孔１９を貫通して第３層の回路面パターン１７に到達
して、導通をとることができる。Here, as shown in FIG. 3, a non-penetrating through hole 14.
..., in the non-penetrating through hole 14 (the non-penetrating through hole 14 indicated by arrow A in FIG. 3) in which the hole of the prepreg 13 is located, the conductive plating 22 is non-penetrating. Prepreg 13 from the inside of the through hole
It is possible to penetrate through the hole 19 and reach the circuit surface pattern 17 of the third layer to establish conduction.

一方、不貫通スルーホール１４．・・・のうち、プリプ
レグ１３の孔１９と一致しない位置にある不貫通スルー
ホール１４（第３図中矢印Ｂで示す不貫・通スルーホー
ル１４）においては、導電めっき２２は、プリプレグ１
３によって阻＋Ｌされて不貫通スルーホール内に１トま
り、第３層の回路面パターン１７とは絶縁される。On the other hand, non-penetrating through hole 14. In the non-penetrating through hole 14 (the non-penetrating/through-hole through hole 14 indicated by arrow B in FIG. 3) located at a position that does not coincide with the hole 19 of the prepreg 13, the conductive plating 22 is
3, it is blocked by L and remains in the non-penetrating through hole, and is insulated from the circuit surface pattern 17 of the third layer.

このようにして製造された多層プリント板に部品２３を
実装するには、部品２３のリード２４゜・・・を不貫通
スルーホール１４．・・・に挿入し、半ｌｌＩ２５によ
って′Ｐ、＋ＩＩ付けし、電気的接続を行う。また、半
田２５の替りに導電性接若剤等を用いてもよい。In order to mount the component 23 on the multilayer printed board manufactured in this way, the leads 24° of the component 23 are connected to the non-penetrating through holes 14. . . , and connect 'P and +II with half III25 to make an electrical connection. Moreover, a conductive adhesive or the like may be used instead of the solder 25.

以上説明したように、上記実施例にあっては、両面プリ
ント板１１に予めスルーホール１４．・・・を形成し、
その後、この両面プリント板１１に両面プリント板１２
をプリプレグ１３によって接着して積層するようにして
いるから、スルーホール１４、・・・の形成を一般の製
造プロセスで製造することができ、したがって余分な製
造工程を必要とせず、製造工程を短縮することができる
。また、両面プリント板１１に形成するスルーホール１
４゜・・・は貫通孔であるから、ドリルの穴深さの精度
を考慮に入れる必要がない。したがって、穴明は作業の
１間を削減することができるとともに、高精度の加工機
械を必要とせず、製造コストを低く抑さえることができ
る。As explained above, in the above embodiment, the through holes 14. ...forming,
After that, the double-sided printed board 12 is attached to this double-sided printed board 11.
Since the through-holes 14, . can do. Also, through holes 1 formed in the double-sided printed board 11
4°... is a through hole, so there is no need to take into account the accuracy of the drill hole depth. Therefore, the time required for drilling holes can be reduced, and a high-precision processing machine is not required, making it possible to keep manufacturing costs low.

さらに、予め実装側の両面プリント板１１に複数のスル
ーホール１４．・・・を形成するとともに、プリプレグ
１３のうちこれらスルーホール１４のうち第３層の回路
パターン１７と導通を確保する必要のあるスルーホール
１４に対応する位置に孔１９を形成しているから、不貫
通スルーホール１４とプリント板内の第２層の回路パタ
ーン１６および第３層の回路パターン１７との導通を確
実かつ容品に実現することができる。Furthermore, a plurality of through holes 14. ..., and holes 19 are formed in the prepreg 13 at positions corresponding to the through holes 14 that need to ensure conduction with the circuit pattern 17 of the third layer. Electrical conduction between the non-penetrating through hole 14 and the second layer circuit pattern 16 and the third layer circuit pattern 17 in the printed board can be realized reliably and neatly.

なお、上記実施例においては、プリント板として両面プ
リント板１１．１２を採用しているが、これに限る必要
はなく、片面板、多層板でもよく、部品実装する大部分
がスルーホールめっき処理されていればいかなる多層板
あるいはいかなる層構成でもよい。In the above embodiment, double-sided printed boards 11 and 12 are used as printed boards, but there is no need to be limited to this, and single-sided boards or multilayer boards may be used, and most of the parts to be mounted are through-hole plated. Any multilayer board or any layer configuration may be used as long as it is suitable.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明にあっては、不貫通スルー
ホールをＨするプリント板を、短い工程で容易に製造す
ることができるとともに、高精度の加工機械を必要とせ
ず低コストで製造することができるという効果が得られ
る。　　　　　　・As explained above, in the present invention, a printed board with non-penetrating through holes can be easily manufactured in a short process, and can be manufactured at low cost without requiring a high-precision processing machine. You can get the effect that you can.・

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図は本発明の一実施例を示す図であっ
て、第１図は積層する前の各プリント板を示す断面図、
第２図は積層後のプリント板を示す断面図、第３図は第
２図中矢印■部分の拡大断面図、第４図は従来の不貫通
スルーホールを有するプリント板を示す断面図である。 １１・・・両面プリント板、１２・・・両面プリント板
、１４・・・スルーホール。 出願人代理人　　佐　　藤　　−雄 鳥１　図 為２図1 to 3 are views showing one embodiment of the present invention, and FIG. 1 is a sectional view showing each printed board before lamination;
Fig. 2 is a sectional view showing the printed board after lamination, Fig. 3 is an enlarged sectional view of the arrow ■ in Fig. 2, and Fig. 4 is a sectional view showing a conventional printed board with non-penetrating through holes. . 11...Double-sided printed board, 12...Double-sided printed board, 14...Through hole. Applicant's agent Sato - Rooster 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] プリント板の所定位置に貫通孔を形成し、このプリント
板に他のプリント板を積層して多層構造とし、前記貫通
孔を実装部品のリードを挿入するための不貫通スルーホ
ールとしたことを特徴とするプリント板の製造方法。A through hole is formed at a predetermined position on a printed board, another printed board is laminated on this printed board to form a multilayer structure, and the through hole is a non-penetrating through hole for inserting a lead of a mounted component. A method of manufacturing a printed board.
JP4120288A 1988-02-24 1988-02-24 Manufacture of printed board Pending JPH01215092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4120288A JPH01215092A (en) 1988-02-24 1988-02-24 Manufacture of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4120288A JPH01215092A (en) 1988-02-24 1988-02-24 Manufacture of printed board

Publications (1)

Publication Number Publication Date
JPH01215092A true JPH01215092A (en) 1989-08-29

Family

ID=12601831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4120288A Pending JPH01215092A (en) 1988-02-24 1988-02-24 Manufacture of printed board

Country Status (1)

Country Link
JP (1) JPH01215092A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016100421A (en) * 2014-11-20 2016-05-30 アガタ電子株式会社 Connector connection substrate, connector connection substrate structure, cable with connector plug and connector connection substrate manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016100421A (en) * 2014-11-20 2016-05-30 アガタ電子株式会社 Connector connection substrate, connector connection substrate structure, cable with connector plug and connector connection substrate manufacturing method

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