JPS54135627A - Metal face decorated plate - Google Patents

Metal face decorated plate

Info

Publication number
JPS54135627A
JPS54135627A JP4351178A JP4351178A JPS54135627A JP S54135627 A JPS54135627 A JP S54135627A JP 4351178 A JP4351178 A JP 4351178A JP 4351178 A JP4351178 A JP 4351178A JP S54135627 A JPS54135627 A JP S54135627A
Authority
JP
Japan
Prior art keywords
metal
decorated plate
predetermined pattern
metal layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4351178A
Other languages
Japanese (ja)
Inventor
Michio Nakai
Takahisa Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4351178A priority Critical patent/JPS54135627A/en
Publication of JPS54135627A publication Critical patent/JPS54135627A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE: To provide a metal face decorated plate with further enhanced appearance by forming a plurality of metal layers of different metals on a substrate surface.
CONSTITUTION: First metal layer 2 of metal foil is formed on substrate 1 for a decorated plate, and different second metal layer 3 on layer 2 with a predetermined pattern. Both layers 2, 3 may be formed with patterns. This decorated plate is manufactured as folows: for example, first metal layer 2 is formed on substrate 1 with a predetermined pattern by etching or the like. This pattern is masked with a plating resist so as to form a predetermined pattern and plated. After removing the resist, second metal layer 3 is formed with a predetermined pattern. The above metal includes copper, aluminum, nickel, tin, etc. The metal pattern and so on may be coated with clear or colored coating film 4 or the like.
COPYRIGHT: (C)1979,JPO&Japio
JP4351178A 1978-04-12 1978-04-12 Metal face decorated plate Pending JPS54135627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4351178A JPS54135627A (en) 1978-04-12 1978-04-12 Metal face decorated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4351178A JPS54135627A (en) 1978-04-12 1978-04-12 Metal face decorated plate

Publications (1)

Publication Number Publication Date
JPS54135627A true JPS54135627A (en) 1979-10-22

Family

ID=12665750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4351178A Pending JPS54135627A (en) 1978-04-12 1978-04-12 Metal face decorated plate

Country Status (1)

Country Link
JP (1) JPS54135627A (en)

Similar Documents

Publication Publication Date Title
JPS57199294A (en) Method of producing printed circuit board
JPS5669835A (en) Method for forming thin film pattern
SE8101360L (en) PROCEDURE FOR MANUFACTURING PRINTED LEADER PLATES WITH PERFORTS, WHICH WALLS ARE METALLIZED
JPS54135627A (en) Metal face decorated plate
JPS5484932A (en) Forming method of multi-layer construction
EP0402811A3 (en) Method of manufacturing printed circuit boards
JPS5526613A (en) Manufacturing of carrier tape useful for ic
JPS5618446A (en) Formation of spherical salient electrode
JPS5534660A (en) Manufacture of decorative metal plate
GB1455854A (en) Methods of manufacturing printed circuit boards
JPS53142337A (en) Manufacture of copper through hole plate
EP0261301A3 (en) Process for the preparation of circuit-printed board having plated through-hole
JPS53119228A (en) Production of perforated plated metal foil
JPS5460582A (en) Electrode wiring and its forming method in semiconductor device
JPS5763690A (en) Plating method for forming embossed design
JPS54134036A (en) Manufacture of perforated plated product
JPS5779172A (en) Construction of precision metallic parts
JPS53138056A (en) Method of coating resin layer on printed circuit board metal material substrate having through hole
JPS5520257A (en) Production of decoration mirror and mirror plate thereof
JPS53108279A (en) Manufacture of substrate for mounting electronic parts
JPS56116656A (en) Manufacturing of high-density wiring pattern
JPS56158895A (en) Method for painting on metallic surface
JPS5718733A (en) Preparation of deposited metal transfer foil
JPS6465287A (en) Formation of metal pattern
JPS5291193A (en) Forming method of conductor pattern