JPS53108279A - Manufacture of substrate for mounting electronic parts - Google Patents

Manufacture of substrate for mounting electronic parts

Info

Publication number
JPS53108279A
JPS53108279A JP2215877A JP2215877A JPS53108279A JP S53108279 A JPS53108279 A JP S53108279A JP 2215877 A JP2215877 A JP 2215877A JP 2215877 A JP2215877 A JP 2215877A JP S53108279 A JPS53108279 A JP S53108279A
Authority
JP
Japan
Prior art keywords
substrate
manufacture
electronic parts
mounting electronic
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2215877A
Other languages
Japanese (ja)
Other versions
JPS6113386B2 (en
Inventor
Rikuro Sono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2215877A priority Critical patent/JPS53108279A/en
Publication of JPS53108279A publication Critical patent/JPS53108279A/en
Publication of JPS6113386B2 publication Critical patent/JPS6113386B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Abstract

PURPOSE: To produce a solder layer of a fixed pattern by forming previously a pattern of the metal thin film featuring good solder leakage properties on the substrate surface and then heating up the substrate after pressure-bonding the solder foil.
COPYRIGHT: (C)1978,JPO&Japio
JP2215877A 1977-03-03 1977-03-03 Manufacture of substrate for mounting electronic parts Granted JPS53108279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2215877A JPS53108279A (en) 1977-03-03 1977-03-03 Manufacture of substrate for mounting electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2215877A JPS53108279A (en) 1977-03-03 1977-03-03 Manufacture of substrate for mounting electronic parts

Publications (2)

Publication Number Publication Date
JPS53108279A true JPS53108279A (en) 1978-09-20
JPS6113386B2 JPS6113386B2 (en) 1986-04-12

Family

ID=12075023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2215877A Granted JPS53108279A (en) 1977-03-03 1977-03-03 Manufacture of substrate for mounting electronic parts

Country Status (1)

Country Link
JP (1) JPS53108279A (en)

Also Published As

Publication number Publication date
JPS6113386B2 (en) 1986-04-12

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