JPS6482994A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS6482994A JPS6482994A JP62242313A JP24231387A JPS6482994A JP S6482994 A JPS6482994 A JP S6482994A JP 62242313 A JP62242313 A JP 62242313A JP 24231387 A JP24231387 A JP 24231387A JP S6482994 A JPS6482994 A JP S6482994A
- Authority
- JP
- Japan
- Prior art keywords
- card
- chip
- sealing resin
- module
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To reduce the mechanical stress to a chip caused by bending force on a card short side and prevent the chip from being broken by a method wherein the long side of a chip incorporated in an module IC of a card is made vertical to a card short side (parallel to a card long side). CONSTITUTION: After adhering a chip 1 on a module substrate 5 forming a lead 2 and an outer electrode 6, the lead 2 is connected to a metal thin wire 3, the chip 1 and the metal thin wire 3 being sealed by a sealing resin 4. Then, the sealing resin 4 is heated via heated air and a module IC 5 is built in an IC card 7 where the card bending stress is not concentrated (the upper left section) after the hardening of the sealing resin is complete. Accordingly, the IC card is designed to make the long side of the chip 1 vertical to a short side of the card 7 (parallel to a card long side) at the time of forming the module IC 5 in advance or the time of incorporating into the card 7 during the sealing process by the sealing resin 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242313A JPS6482994A (en) | 1987-09-25 | 1987-09-25 | Ic card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242313A JPS6482994A (en) | 1987-09-25 | 1987-09-25 | Ic card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482994A true JPS6482994A (en) | 1989-03-28 |
Family
ID=17087356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62242313A Pending JPS6482994A (en) | 1987-09-25 | 1987-09-25 | Ic card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482994A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002092577A (en) * | 2000-09-20 | 2002-03-29 | Hitachi Maxell Ltd | Combination card and manufacturing method thereof |
-
1987
- 1987-09-25 JP JP62242313A patent/JPS6482994A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002092577A (en) * | 2000-09-20 | 2002-03-29 | Hitachi Maxell Ltd | Combination card and manufacturing method thereof |
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