JPS6482994A - Ic card - Google Patents

Ic card

Info

Publication number
JPS6482994A
JPS6482994A JP62242313A JP24231387A JPS6482994A JP S6482994 A JPS6482994 A JP S6482994A JP 62242313 A JP62242313 A JP 62242313A JP 24231387 A JP24231387 A JP 24231387A JP S6482994 A JPS6482994 A JP S6482994A
Authority
JP
Japan
Prior art keywords
card
chip
sealing resin
module
long side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62242313A
Other languages
Japanese (ja)
Inventor
Katsunori Ochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62242313A priority Critical patent/JPS6482994A/en
Publication of JPS6482994A publication Critical patent/JPS6482994A/en
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the mechanical stress to a chip caused by bending force on a card short side and prevent the chip from being broken by a method wherein the long side of a chip incorporated in an module IC of a card is made vertical to a card short side (parallel to a card long side). CONSTITUTION: After adhering a chip 1 on a module substrate 5 forming a lead 2 and an outer electrode 6, the lead 2 is connected to a metal thin wire 3, the chip 1 and the metal thin wire 3 being sealed by a sealing resin 4. Then, the sealing resin 4 is heated via heated air and a module IC 5 is built in an IC card 7 where the card bending stress is not concentrated (the upper left section) after the hardening of the sealing resin is complete. Accordingly, the IC card is designed to make the long side of the chip 1 vertical to a short side of the card 7 (parallel to a card long side) at the time of forming the module IC 5 in advance or the time of incorporating into the card 7 during the sealing process by the sealing resin 4.
JP62242313A 1987-09-25 1987-09-25 Ic card Pending JPS6482994A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242313A JPS6482994A (en) 1987-09-25 1987-09-25 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242313A JPS6482994A (en) 1987-09-25 1987-09-25 Ic card

Publications (1)

Publication Number Publication Date
JPS6482994A true JPS6482994A (en) 1989-03-28

Family

ID=17087356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242313A Pending JPS6482994A (en) 1987-09-25 1987-09-25 Ic card

Country Status (1)

Country Link
JP (1) JPS6482994A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002092577A (en) * 2000-09-20 2002-03-29 Hitachi Maxell Ltd Combination card and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002092577A (en) * 2000-09-20 2002-03-29 Hitachi Maxell Ltd Combination card and manufacturing method thereof

Similar Documents

Publication Publication Date Title
FR2579798B1 (en) METHOD FOR MANUFACTURING ELECTRONIC MODULES FOR MICROCIRCUIT CARDS AND MODULES OBTAINED ACCORDING TO THIS METHOD
JPS51131274A (en) Tip bonding method
EP0149923A3 (en) Microcircuit substrate and method of making same
JPS6482994A (en) Ic card
JPS5721830A (en) Bonding wire for semiconductor element
JPS5763850A (en) Semiconductor device
JPS57194539A (en) Pressing structure for lead frame
JPS6418247A (en) Plastic sealed semiconductor device
JPS6456596A (en) Manufacture of ic card
JPS5279774A (en) Forming method for lead frame for resin sealing
JPS5710955A (en) Manufacture of semiconductor device
JPS6455291A (en) Integrated circuit device
JPS57159032A (en) Forming method for package of electronic timepiece
JPS6481258A (en) Semiconductor device
JPS6473754A (en) Manufacture of lead frame for semiconductor device
ATE49680T1 (en) PROCESS FOR MAKING AN ENCAPSULATED IC PLATE.
JPS6410634A (en) Semiconductor integrated circuit device
JPS57108632A (en) Pressure sensor
JPS5439343A (en) Bonding method
JPS55140248A (en) Method of packaging semiconductor device
JPS645022A (en) Resin sealing method for optical semiconductor device
JPS57148355A (en) Manufacture of semiconductor device
JPS5647113A (en) Connecting method for quartz oscillator
GOBLISH Manufacturing methods and technology program for the 10 kHz tape-automated bonded hybrid microcircuit oscillator[Final Report]
JPS5487181A (en) Resin sealing method for semiconductor element