JPS5791571A - Manufacture of light module - Google Patents

Manufacture of light module

Info

Publication number
JPS5791571A
JPS5791571A JP16668680A JP16668680A JPS5791571A JP S5791571 A JPS5791571 A JP S5791571A JP 16668680 A JP16668680 A JP 16668680A JP 16668680 A JP16668680 A JP 16668680A JP S5791571 A JPS5791571 A JP S5791571A
Authority
JP
Japan
Prior art keywords
mold
substance
light module
metal
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16668680A
Other languages
Japanese (ja)
Other versions
JPS6052600B2 (en
Inventor
Shuhei Katagiri
Kenichi Tsuchinuma
Makoto Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55166686A priority Critical patent/JPS6052600B2/en
Priority to EP81305591A priority patent/EP0053483B1/en
Priority to DE8181305591T priority patent/DE3172553D1/en
Priority to US06/325,486 priority patent/US4410469A/en
Publication of JPS5791571A publication Critical patent/JPS5791571A/en
Publication of JPS6052600B2 publication Critical patent/JPS6052600B2/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To easily obtain a light module with high accuracy by going through (1) a process of coating the conversion element of a light module with a transparent mold, (2) that of supporting and holding the transparent mold substance with two metal molds, (3) that of forming an external shape with an impermeable mold substance, and (4) that of remving the metal molds. CONSTITUTION:A conversion element 60, IC element 55, and bonding wires 56 are coated by a transparent mold substance 57 by using a lead frame group 54 as reference. The transparent mold substance 57 is supported and held by the first metal mold 71 corresponding to a cylindrical inner wall section serving as a light connector coupling section 59 into which a light connector plug 63 is inserted and by a metal mold 72 as well, and after forming a light impermeable mold substance 52 by using another metal mold capable of forming an external shape, the former metal molds are removed. In this way, a small-sized and highly reliable light module can be produced at low cost.
JP55166686A 1980-11-28 1980-11-28 Manufacturing method of optical module Expired JPS6052600B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP55166686A JPS6052600B2 (en) 1980-11-28 1980-11-28 Manufacturing method of optical module
EP81305591A EP0053483B1 (en) 1980-11-28 1981-11-26 Method for manufacturing a module for a fiber optic link
DE8181305591T DE3172553D1 (en) 1980-11-28 1981-11-26 Method for manufacturing a module for a fiber optic link
US06/325,486 US4410469A (en) 1980-11-28 1981-11-27 Method for manufacturing a module for a fiber optic link

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55166686A JPS6052600B2 (en) 1980-11-28 1980-11-28 Manufacturing method of optical module

Publications (2)

Publication Number Publication Date
JPS5791571A true JPS5791571A (en) 1982-06-07
JPS6052600B2 JPS6052600B2 (en) 1985-11-20

Family

ID=15835847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55166686A Expired JPS6052600B2 (en) 1980-11-28 1980-11-28 Manufacturing method of optical module

Country Status (1)

Country Link
JP (1) JPS6052600B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146204U (en) * 1988-03-30 1989-10-09
JPH02186401A (en) * 1989-01-12 1990-07-20 Honda Motor Co Ltd Controller
JPH0350355U (en) * 1990-09-04 1991-05-16

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146204U (en) * 1988-03-30 1989-10-09
JPH02186401A (en) * 1989-01-12 1990-07-20 Honda Motor Co Ltd Controller
JPH0350355U (en) * 1990-09-04 1991-05-16

Also Published As

Publication number Publication date
JPS6052600B2 (en) 1985-11-20

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