JPS5524404A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS5524404A
JPS5524404A JP9610178A JP9610178A JPS5524404A JP S5524404 A JPS5524404 A JP S5524404A JP 9610178 A JP9610178 A JP 9610178A JP 9610178 A JP9610178 A JP 9610178A JP S5524404 A JPS5524404 A JP S5524404A
Authority
JP
Japan
Prior art keywords
led
dent
lead frame
light guide
coupling efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9610178A
Other languages
Japanese (ja)
Inventor
Tetsuo Sadamasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9610178A priority Critical patent/JPS5524404A/en
Publication of JPS5524404A publication Critical patent/JPS5524404A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To transmit light at high coupling efficiency by configuring a system so as to radiate the light in one direction and constituting a concave lens with insulating resin near the tip of a light guide.
CONSTITUTION: LED 1 is sticked on a lead frame 21 with a conductive epoxy 3 with n type GaP coming lower. There is provided beforehand a reflection plate 4 around the portion sticked. Next, LED and the other terminal 22 of lead frame are subjected to connection 5. Then, a die is filled up with a transparent epoxy resin, the lead frame is soaked to harden the resin 6 through heat treatment, and the bottom 8 of a dent 7 formed then is positioned near LED 1. After a light guide 9 is inserted in the dent, a transparent bonding agent 10 is used to fix it, and LED and the light guide are coupled optically. The nearer is the dent bottom to LED, the better is coupling efficiency improved, thus ensuring a high coupling efficiency accurate and steady in construction.
COPYRIGHT: (C)1980,JPO&Japio
JP9610178A 1978-08-09 1978-08-09 Semiconductor light emitting device Pending JPS5524404A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9610178A JPS5524404A (en) 1978-08-09 1978-08-09 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9610178A JPS5524404A (en) 1978-08-09 1978-08-09 Semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS5524404A true JPS5524404A (en) 1980-02-21

Family

ID=14155989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9610178A Pending JPS5524404A (en) 1978-08-09 1978-08-09 Semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS5524404A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243811A (en) * 1975-10-03 1977-04-06 Nippon Kogen Concrete Concrete mold of boxxform section
JPS587365U (en) * 1981-07-07 1983-01-18 スタンレー電気株式会社 Light condensing device for light emitting diodes for optical communication
JPS58204576A (en) * 1982-05-24 1983-11-29 Mitsubishi Rayon Co Ltd Semiconductor light emitting element and photodetector
JPS594514U (en) * 1982-07-01 1984-01-12 オムロン株式会社 fiber optic equipment
JPS59141314U (en) * 1983-03-14 1984-09-21 ロ−ム株式会社 light emitting diode device
JPS6129501A (en) * 1984-07-19 1986-02-10 積水プラントシステム株式会社 Manufacture of unit body for constituting cellar
JPS61108180A (en) * 1984-10-31 1986-05-26 Tatsuta Electric Wire & Cable Co Ltd Photoelectric conversion element
JPS62113308U (en) * 1986-12-26 1987-07-18
JPS6446335U (en) * 1987-09-18 1989-03-22
JPH0218057U (en) * 1988-07-15 1990-02-06
JP2009128430A (en) * 2007-11-20 2009-06-11 Nitto Denko Corp Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device
WO2010113911A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor
WO2010113910A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583803B2 (en) * 1975-10-03 1983-01-22 ニホンコウゲンコンクリ−ト カブシキガイシヤ Hakogata Danmenno Concrete Katawaku
JPS5243811A (en) * 1975-10-03 1977-04-06 Nippon Kogen Concrete Concrete mold of boxxform section
JPS587365U (en) * 1981-07-07 1983-01-18 スタンレー電気株式会社 Light condensing device for light emitting diodes for optical communication
JPS58204576A (en) * 1982-05-24 1983-11-29 Mitsubishi Rayon Co Ltd Semiconductor light emitting element and photodetector
JPS594514U (en) * 1982-07-01 1984-01-12 オムロン株式会社 fiber optic equipment
JPS59141314U (en) * 1983-03-14 1984-09-21 ロ−ム株式会社 light emitting diode device
JPS6129501A (en) * 1984-07-19 1986-02-10 積水プラントシステム株式会社 Manufacture of unit body for constituting cellar
JPS61108180A (en) * 1984-10-31 1986-05-26 Tatsuta Electric Wire & Cable Co Ltd Photoelectric conversion element
JPS62113308U (en) * 1986-12-26 1987-07-18
JPH069241Y2 (en) * 1987-09-18 1994-03-09 株式会社大林組 Indoor formwork integrated building device
JPS6446335U (en) * 1987-09-18 1989-03-22
JPH0218057U (en) * 1988-07-15 1990-02-06
JP2009128430A (en) * 2007-11-20 2009-06-11 Nitto Denko Corp Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device
JP4503064B2 (en) * 2007-11-20 2010-07-14 日東電工株式会社 Optical waveguide device manufacturing method, optical waveguide device obtained thereby, and optical waveguide connection structure used therefor
US7906355B2 (en) 2007-11-20 2011-03-15 Nitto Denko Corporation Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device
KR101510895B1 (en) * 2007-11-20 2015-04-10 닛토덴코 가부시키가이샤 Optical waveguide, manufacturing method thereof, and connecting structure therefor
WO2010113911A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor
WO2010113910A1 (en) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 Optical communication module and manufacturing method therefor
JP5338900B2 (en) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 Optical communication module and method for manufacturing optical communication module
JP5338899B2 (en) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 Optical communication module and method for manufacturing optical communication module

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