JPS5524404A - Semiconductor light emitting device - Google Patents
Semiconductor light emitting deviceInfo
- Publication number
- JPS5524404A JPS5524404A JP9610178A JP9610178A JPS5524404A JP S5524404 A JPS5524404 A JP S5524404A JP 9610178 A JP9610178 A JP 9610178A JP 9610178 A JP9610178 A JP 9610178A JP S5524404 A JPS5524404 A JP S5524404A
- Authority
- JP
- Japan
- Prior art keywords
- led
- dent
- lead frame
- light guide
- coupling efficiency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
PURPOSE: To transmit light at high coupling efficiency by configuring a system so as to radiate the light in one direction and constituting a concave lens with insulating resin near the tip of a light guide.
CONSTITUTION: LED 1 is sticked on a lead frame 21 with a conductive epoxy 3 with n type GaP coming lower. There is provided beforehand a reflection plate 4 around the portion sticked. Next, LED and the other terminal 22 of lead frame are subjected to connection 5. Then, a die is filled up with a transparent epoxy resin, the lead frame is soaked to harden the resin 6 through heat treatment, and the bottom 8 of a dent 7 formed then is positioned near LED 1. After a light guide 9 is inserted in the dent, a transparent bonding agent 10 is used to fix it, and LED and the light guide are coupled optically. The nearer is the dent bottom to LED, the better is coupling efficiency improved, thus ensuring a high coupling efficiency accurate and steady in construction.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9610178A JPS5524404A (en) | 1978-08-09 | 1978-08-09 | Semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9610178A JPS5524404A (en) | 1978-08-09 | 1978-08-09 | Semiconductor light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5524404A true JPS5524404A (en) | 1980-02-21 |
Family
ID=14155989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9610178A Pending JPS5524404A (en) | 1978-08-09 | 1978-08-09 | Semiconductor light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5524404A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5243811A (en) * | 1975-10-03 | 1977-04-06 | Nippon Kogen Concrete | Concrete mold of boxxform section |
JPS587365U (en) * | 1981-07-07 | 1983-01-18 | スタンレー電気株式会社 | Light condensing device for light emitting diodes for optical communication |
JPS58204576A (en) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | Semiconductor light emitting element and photodetector |
JPS594514U (en) * | 1982-07-01 | 1984-01-12 | オムロン株式会社 | fiber optic equipment |
JPS59141314U (en) * | 1983-03-14 | 1984-09-21 | ロ−ム株式会社 | light emitting diode device |
JPS6129501A (en) * | 1984-07-19 | 1986-02-10 | 積水プラントシステム株式会社 | Manufacture of unit body for constituting cellar |
JPS61108180A (en) * | 1984-10-31 | 1986-05-26 | Tatsuta Electric Wire & Cable Co Ltd | Photoelectric conversion element |
JPS62113308U (en) * | 1986-12-26 | 1987-07-18 | ||
JPS6446335U (en) * | 1987-09-18 | 1989-03-22 | ||
JPH0218057U (en) * | 1988-07-15 | 1990-02-06 | ||
JP2009128430A (en) * | 2007-11-20 | 2009-06-11 | Nitto Denko Corp | Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device |
WO2010113911A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社オートネットワーク技術研究所 | Optical communication module and manufacturing method therefor |
WO2010113910A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社オートネットワーク技術研究所 | Optical communication module and manufacturing method therefor |
-
1978
- 1978-08-09 JP JP9610178A patent/JPS5524404A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583803B2 (en) * | 1975-10-03 | 1983-01-22 | ニホンコウゲンコンクリ−ト カブシキガイシヤ | Hakogata Danmenno Concrete Katawaku |
JPS5243811A (en) * | 1975-10-03 | 1977-04-06 | Nippon Kogen Concrete | Concrete mold of boxxform section |
JPS587365U (en) * | 1981-07-07 | 1983-01-18 | スタンレー電気株式会社 | Light condensing device for light emitting diodes for optical communication |
JPS58204576A (en) * | 1982-05-24 | 1983-11-29 | Mitsubishi Rayon Co Ltd | Semiconductor light emitting element and photodetector |
JPS594514U (en) * | 1982-07-01 | 1984-01-12 | オムロン株式会社 | fiber optic equipment |
JPS59141314U (en) * | 1983-03-14 | 1984-09-21 | ロ−ム株式会社 | light emitting diode device |
JPS6129501A (en) * | 1984-07-19 | 1986-02-10 | 積水プラントシステム株式会社 | Manufacture of unit body for constituting cellar |
JPS61108180A (en) * | 1984-10-31 | 1986-05-26 | Tatsuta Electric Wire & Cable Co Ltd | Photoelectric conversion element |
JPS62113308U (en) * | 1986-12-26 | 1987-07-18 | ||
JPH069241Y2 (en) * | 1987-09-18 | 1994-03-09 | 株式会社大林組 | Indoor formwork integrated building device |
JPS6446335U (en) * | 1987-09-18 | 1989-03-22 | ||
JPH0218057U (en) * | 1988-07-15 | 1990-02-06 | ||
JP2009128430A (en) * | 2007-11-20 | 2009-06-11 | Nitto Denko Corp | Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device |
JP4503064B2 (en) * | 2007-11-20 | 2010-07-14 | 日東電工株式会社 | Optical waveguide device manufacturing method, optical waveguide device obtained thereby, and optical waveguide connection structure used therefor |
US7906355B2 (en) | 2007-11-20 | 2011-03-15 | Nitto Denko Corporation | Optical waveguide device production method, optical waveguide device produced by the method, and optical waveguide connection structure to be used for the device |
KR101510895B1 (en) * | 2007-11-20 | 2015-04-10 | 닛토덴코 가부시키가이샤 | Optical waveguide, manufacturing method thereof, and connecting structure therefor |
WO2010113911A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社オートネットワーク技術研究所 | Optical communication module and manufacturing method therefor |
WO2010113910A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社オートネットワーク技術研究所 | Optical communication module and manufacturing method therefor |
JP5338900B2 (en) * | 2009-03-30 | 2013-11-13 | 株式会社オートネットワーク技術研究所 | Optical communication module and method for manufacturing optical communication module |
JP5338899B2 (en) * | 2009-03-30 | 2013-11-13 | 株式会社オートネットワーク技術研究所 | Optical communication module and method for manufacturing optical communication module |
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