JPS55123181A - Lead frame for light emitting diode - Google Patents

Lead frame for light emitting diode

Info

Publication number
JPS55123181A
JPS55123181A JP3024079A JP3024079A JPS55123181A JP S55123181 A JPS55123181 A JP S55123181A JP 3024079 A JP3024079 A JP 3024079A JP 3024079 A JP3024079 A JP 3024079A JP S55123181 A JPS55123181 A JP S55123181A
Authority
JP
Japan
Prior art keywords
lead frame
pellet
junction
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3024079A
Other languages
Japanese (ja)
Inventor
Kazuo Kiyohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3024079A priority Critical patent/JPS55123181A/en
Publication of JPS55123181A publication Critical patent/JPS55123181A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To avoid junction shortcircuiting due to attachment of solder by placing the bottom surface of a lead frame for mounting a semiconductor pellet at both sides of which are exposed the ends of a pn-junction, one step higher than th bottom surface of a reflector plate placed around the lead frame. CONSTITUTION:Light emitting diode pellet 4 on both sides of which are exposed the ends of a pn-junction is fixed to a light emitting diode lead frame. On the surrounding edge of this lead frame is provided depressed reflector plate 1' forming an inverted cone surface or paraboroidal surface in the direction of discharging light. Pellet 4 is fixed to the bottom of the flame surrounded by this. At this time, the shape of the bottom is made as follows. That is, the bottom is not made flat, but matching with the size of pellet 4, cylindrical support 6, one step higher, is provided, and groove 7 is cut around this. By this, even if pellet 4 fixed on support 6 by using silver paste 2', junction 3 is not shorted by swelling.
JP3024079A 1979-03-15 1979-03-15 Lead frame for light emitting diode Pending JPS55123181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3024079A JPS55123181A (en) 1979-03-15 1979-03-15 Lead frame for light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3024079A JPS55123181A (en) 1979-03-15 1979-03-15 Lead frame for light emitting diode

Publications (1)

Publication Number Publication Date
JPS55123181A true JPS55123181A (en) 1980-09-22

Family

ID=12298180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3024079A Pending JPS55123181A (en) 1979-03-15 1979-03-15 Lead frame for light emitting diode

Country Status (1)

Country Link
JP (1) JPS55123181A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181155U (en) * 1984-10-31 1986-05-29
FR2610451A1 (en) * 1987-01-30 1988-08-05 Radiotechnique Compelec Opto-electronic device comprising at least one component mounted on a support
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
EP1179858A2 (en) * 2000-08-09 2002-02-13 Agilent Technologies Inc Light emitting devices
JP2008258413A (en) * 2007-04-05 2008-10-23 Rohm Co Ltd Semiconductor light-emitting device
JP2016515310A (en) * 2014-03-05 2016-05-26 ルーメンス カンパニー リミテッド LIGHT EMITTING ELEMENT PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE, AND LIGHT EMITTING ELEMENT PACKAGE MANUFACTURING METHOD

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181155U (en) * 1984-10-31 1986-05-29
FR2610451A1 (en) * 1987-01-30 1988-08-05 Radiotechnique Compelec Opto-electronic device comprising at least one component mounted on a support
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
EP1179858A2 (en) * 2000-08-09 2002-02-13 Agilent Technologies Inc Light emitting devices
EP1179858A3 (en) * 2000-08-09 2003-07-30 Agilent Technologies, Inc. (a Delaware corporation) Light emitting devices
JP2008258413A (en) * 2007-04-05 2008-10-23 Rohm Co Ltd Semiconductor light-emitting device
WO2008126696A1 (en) * 2007-04-05 2008-10-23 Rohm Co., Ltd. Semiconductor light-emitting device
US8035124B2 (en) 2007-04-05 2011-10-11 Rohm Co., Ltd. Semiconductor light-emitting device
US8227829B2 (en) 2007-04-05 2012-07-24 Rohm Co., Ltd. Semiconductor light-emitting device
JP2016515310A (en) * 2014-03-05 2016-05-26 ルーメンス カンパニー リミテッド LIGHT EMITTING ELEMENT PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE, AND LIGHT EMITTING ELEMENT PACKAGE MANUFACTURING METHOD

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