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JPS5669882A - Semiconductor luminous device - Google Patents

Semiconductor luminous device

Info

Publication number
JPS5669882A
JPS5669882A JP14574479A JP14574479A JPS5669882A JP S5669882 A JPS5669882 A JP S5669882A JP 14574479 A JP14574479 A JP 14574479A JP 14574479 A JP14574479 A JP 14574479A JP S5669882 A JPS5669882 A JP S5669882A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
diode
laser
chip
lights
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14574479A
Inventor
Hiroshi Matsubara
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02236Mounts or sub-mounts
    • H01S5/02248Mechanically integrated components on a mount or an optical microbench, e.g. optical components, detectors, etc.
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical devices external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Shape of the housing
    • H01S5/02212Can-type, e.g. TO-9 housing with emission along or parallel to symmetry axis
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068Stabilisation of laser output parameters
    • H01S5/0683Stabilisation of laser output parameters by monitoring the optical output parameters

Abstract

PURPOSE:To simplify assembly extremely and miniaturize a device by forming a submount and a light receiving element in monolithic shapes. CONSTITUTION:A submount 2 and a photodiode 7 are integrally made up on a substrate 13, and a laser chip 1 is united. The laser chip has electrodes 9a, 9b, and the diode 7has electrodes 9c, 9d. A glass piece 10 obliquely cut is fixed on the diode 7. One side of lights emitted from an active layer 11 of the laser chip 1 is reflected by a cut surface 10a of the glass 10, and projected into a light receiving surface 12 of the diode 7. The lights are converted into electricity by means of the diode 7 in response to incident lights, and used as monitor signals. According to this constitution, the laser chip 1 and the substrate 13 are joined to a package 3 at the same time, assembly is simplified, and a device can be miniaturized.
JP14574479A 1979-11-09 1979-11-09 Semiconductor luminous device Pending JPS5669882A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14574479A JPS5669882A (en) 1979-11-09 1979-11-09 Semiconductor luminous device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14574479A JPS5669882A (en) 1979-11-09 1979-11-09 Semiconductor luminous device

Publications (1)

Publication Number Publication Date
JPS5669882A true true JPS5669882A (en) 1981-06-11

Family

ID=15392137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14574479A Pending JPS5669882A (en) 1979-11-09 1979-11-09 Semiconductor luminous device

Country Status (1)

Country Link
JP (1) JPS5669882A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821889A (en) * 1981-07-31 1983-02-08 Shinko Electric Ind Co Ltd Semiconductor assembly structure
JPS5972748U (en) * 1982-11-08 1984-05-17
JPS6161864U (en) * 1984-09-26 1986-04-25
JPS6161863U (en) * 1984-09-26 1986-04-25
US5052005A (en) * 1988-12-19 1991-09-24 Rohm Co., Ltd. Method of mounting a laser diode unit
US5233580A (en) * 1988-12-19 1993-08-03 Rohm Co., Ltd. Laser diode unit welded to a mounting member by laser light
US5268922A (en) * 1991-10-31 1993-12-07 International Business Machines Corporation Laser diode assembly
EP0713271A1 (en) * 1994-11-18 1996-05-22 Northern Telecom Limited Injection laser assembly incorporating a monitor photosensor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821889A (en) * 1981-07-31 1983-02-08 Shinko Electric Ind Co Ltd Semiconductor assembly structure
JPS5972748U (en) * 1982-11-08 1984-05-17
JPS6161864U (en) * 1984-09-26 1986-04-25
JPS6161863U (en) * 1984-09-26 1986-04-25
US5052005A (en) * 1988-12-19 1991-09-24 Rohm Co., Ltd. Method of mounting a laser diode unit
US5233580A (en) * 1988-12-19 1993-08-03 Rohm Co., Ltd. Laser diode unit welded to a mounting member by laser light
US5268922A (en) * 1991-10-31 1993-12-07 International Business Machines Corporation Laser diode assembly
EP0713271A1 (en) * 1994-11-18 1996-05-22 Northern Telecom Limited Injection laser assembly incorporating a monitor photosensor

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