JPS6181155U - - Google Patents
Info
- Publication number
- JPS6181155U JPS6181155U JP16551084U JP16551084U JPS6181155U JP S6181155 U JPS6181155 U JP S6181155U JP 16551084 U JP16551084 U JP 16551084U JP 16551084 U JP16551084 U JP 16551084U JP S6181155 U JPS6181155 U JP S6181155U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- electrode
- lead frame
- wire
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 2
Description
第１図は本考案の一実施例のリードフレームの
側面図、第２図は半導体チツプ固定部分の拡大正
面図、第３図は同拡大側面図、第４図は従来のリ
ードフレームの側面図、第５図は第４図における
半導体チツプ固定部分の拡大側面図である。
１…電極、２…半導体チツプ、３…導電性接着
剤、４…電極、５…ワイヤ、６…連結片。
Fig. 1 is a side view of a lead frame according to an embodiment of the present invention, Fig. 2 is an enlarged front view of the semiconductor chip fixing part, Fig. 3 is an enlarged side view of the same, and Fig. 4 is a side view of a conventional lead frame. , FIG. 5 is an enlarged side view of the semiconductor chip fixing portion in FIG. 4. DESCRIPTION OF SYMBOLS 1... Electrode, 2... Semiconductor chip, 3... Conductive adhesive, 4... Electrode, 5... Wire, 6... Connection piece.
Claims (1)
接着固定するための第一電極と、該半導体チツプ
との間にワイヤボンデイングされる第二電極とで
成り、上記第一電極における上記半導体チツプ接
着部分が段高となつていることを特徴とする光学
素子用リードフレーム。 It consists of a first electrode for adhesively fixing a semiconductor chip for an optical element with a conductive adhesive, and a second electrode that is wire-bonded between the semiconductor chip and the semiconductor chip bonding portion of the first electrode. A lead frame for optical elements characterized by a stepped height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16551084U JPS6181155U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16551084U JPS6181155U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181155U true JPS6181155U (en) | 1986-05-29 |
Family
ID=30723360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16551084U Pending JPS6181155U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181155U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55123181A (en) * | 1979-03-15 | 1980-09-22 | Nec Corp | Lead frame for light emitting diode |
| JPS571275A (en) * | 1980-06-03 | 1982-01-06 | Matsushita Electric Ind Co Ltd | Light emitting element |
| JPS5918691U (en) * | 1982-07-29 | 1984-02-04 | 株式会社シマノ | Gear shift operation device |
-
1984
- 1984-10-31 JP JP16551084U patent/JPS6181155U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55123181A (en) * | 1979-03-15 | 1980-09-22 | Nec Corp | Lead frame for light emitting diode |
| JPS571275A (en) * | 1980-06-03 | 1982-01-06 | Matsushita Electric Ind Co Ltd | Light emitting element |
| JPS5918691U (en) * | 1982-07-29 | 1984-02-04 | 株式会社シマノ | Gear shift operation device |