JPS5456780A - Manufacture of light emitting device - Google Patents
Manufacture of light emitting deviceInfo
- Publication number
- JPS5456780A JPS5456780A JP12379177A JP12379177A JPS5456780A JP S5456780 A JPS5456780 A JP S5456780A JP 12379177 A JP12379177 A JP 12379177A JP 12379177 A JP12379177 A JP 12379177A JP S5456780 A JPS5456780 A JP S5456780A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- reflector
- diode
- light emitting
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
PURPOSE: To simplify the formation as well as to increasing the luminous intensity for the light emitting device, by connecting the luminous element to a pair of lead substances, providing a fanwise reflector surrounding the luminous element and molding the whole part with the light transmissible resin.
CONSTITUTION: A pair of lead substances 11 and 12 are distributed in the fixed formation. And light emitting diode 14 is adhered onto fold-up bar 13 provided to the end of lead 11 of one side, and a bonding connection is given between lead 12 of the other side and diode 14 via wire 15. Then fanwise reflector 16 is fixed to bar 13 while surrounding diode 14, and the whole part is molded with the light tranmsissible resin to form peripheral body 17. Here, synthetic resin 20 such as the ABS resin is used for reflector 16, and metal plating part 22 is formed previously at the settig side of diode 14 excluding part 21 touching lead 11. As a result, the up-down rapping becomes possible to simplify the constitution of the forming device, and furthermore the luminous intensity can be increased since the reflector is buried in.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12379177A JPS5456780A (en) | 1977-10-14 | 1977-10-14 | Manufacture of light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12379177A JPS5456780A (en) | 1977-10-14 | 1977-10-14 | Manufacture of light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5456780A true JPS5456780A (en) | 1979-05-08 |
Family
ID=14869382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12379177A Pending JPS5456780A (en) | 1977-10-14 | 1977-10-14 | Manufacture of light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5456780A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57125553U (en) * | 1981-01-30 | 1982-08-05 | ||
JP2002374005A (en) * | 2001-04-10 | 2002-12-26 | Toshiba Corp | Optical semiconductor device |
-
1977
- 1977-10-14 JP JP12379177A patent/JPS5456780A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57125553U (en) * | 1981-01-30 | 1982-08-05 | ||
JP2002374005A (en) * | 2001-04-10 | 2002-12-26 | Toshiba Corp | Optical semiconductor device |
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