JPS5456780A - Manufacture of light emitting device - Google Patents

Manufacture of light emitting device

Info

Publication number
JPS5456780A
JPS5456780A JP12379177A JP12379177A JPS5456780A JP S5456780 A JPS5456780 A JP S5456780A JP 12379177 A JP12379177 A JP 12379177A JP 12379177 A JP12379177 A JP 12379177A JP S5456780 A JPS5456780 A JP S5456780A
Authority
JP
Japan
Prior art keywords
lead
reflector
diode
light emitting
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12379177A
Other languages
Japanese (ja)
Inventor
Kiyokazu Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP12379177A priority Critical patent/JPS5456780A/en
Publication of JPS5456780A publication Critical patent/JPS5456780A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To simplify the formation as well as to increasing the luminous intensity for the light emitting device, by connecting the luminous element to a pair of lead substances, providing a fanwise reflector surrounding the luminous element and molding the whole part with the light transmissible resin.
CONSTITUTION: A pair of lead substances 11 and 12 are distributed in the fixed formation. And light emitting diode 14 is adhered onto fold-up bar 13 provided to the end of lead 11 of one side, and a bonding connection is given between lead 12 of the other side and diode 14 via wire 15. Then fanwise reflector 16 is fixed to bar 13 while surrounding diode 14, and the whole part is molded with the light tranmsissible resin to form peripheral body 17. Here, synthetic resin 20 such as the ABS resin is used for reflector 16, and metal plating part 22 is formed previously at the settig side of diode 14 excluding part 21 touching lead 11. As a result, the up-down rapping becomes possible to simplify the constitution of the forming device, and furthermore the luminous intensity can be increased since the reflector is buried in.
COPYRIGHT: (C)1979,JPO&Japio
JP12379177A 1977-10-14 1977-10-14 Manufacture of light emitting device Pending JPS5456780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12379177A JPS5456780A (en) 1977-10-14 1977-10-14 Manufacture of light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12379177A JPS5456780A (en) 1977-10-14 1977-10-14 Manufacture of light emitting device

Publications (1)

Publication Number Publication Date
JPS5456780A true JPS5456780A (en) 1979-05-08

Family

ID=14869382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12379177A Pending JPS5456780A (en) 1977-10-14 1977-10-14 Manufacture of light emitting device

Country Status (1)

Country Link
JP (1) JPS5456780A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125553U (en) * 1981-01-30 1982-08-05
JP2002374005A (en) * 2001-04-10 2002-12-26 Toshiba Corp Optical semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125553U (en) * 1981-01-30 1982-08-05
JP2002374005A (en) * 2001-04-10 2002-12-26 Toshiba Corp Optical semiconductor device

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