JPS5496385A - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPS5496385A
JPS5496385A JP271878A JP271878A JPS5496385A JP S5496385 A JPS5496385 A JP S5496385A JP 271878 A JP271878 A JP 271878A JP 271878 A JP271878 A JP 271878A JP S5496385 A JPS5496385 A JP S5496385A
Authority
JP
Japan
Prior art keywords
reflective surface
electrode
component
electrode lead
reflector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP271878A
Other languages
Japanese (ja)
Inventor
Yutaka Nagasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP271878A priority Critical patent/JPS5496385A/en
Priority to US05/969,259 priority patent/US4255688A/en
Priority to EP78101688A priority patent/EP0002529A1/en
Publication of JPS5496385A publication Critical patent/JPS5496385A/en
Priority to US06/199,627 priority patent/US4529907A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PURPOSE: To secure the degassing for the bubble when the resin is sealed for formation of the ambient unit by providing the 1st reflecting surface which connects the 1st electrode of the luminous element to the electrode lead-out component plus the electrode lead-out material which is connected to the 2nd electrode to form the 2nd reflective surface.
CONSTITUTION: Luminous element 1 is provided on 1st reflective surface 12a at the concave part of 1st reflector 12a' which is formed concave through pressing and part of which extends to possess 1st electrode lead-out component 13a. The 2nd reflective surface 12b is formed to reflector 12b' and is isolated electrically from the 1st reflector. The electrode of element 1 is connected to 2nd electrode lead-out component 13b via metal thin wire 4. The light emission of the element is classified into the direct emission component and the reflected component, and no loss is caused for the reflected component even though the reflective surface has a gap. In the formation of the ambient unit, the bubbles 7, 7' and so forth which are generated when resin 6 is enclosed into the cavity of mold 10 are degassed by passing through the gap formed between the reflective surface. Thus, the lighting appearance is improved with increased reliability.
COPYRIGHT: (C)1979,JPO&Japio
JP271878A 1977-12-15 1978-01-17 Optical semiconductor device Pending JPS5496385A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP271878A JPS5496385A (en) 1978-01-17 1978-01-17 Optical semiconductor device
US05/969,259 US4255688A (en) 1977-12-15 1978-12-13 Light emitter mounted on reflector formed on end of lead
EP78101688A EP0002529A1 (en) 1977-12-15 1978-12-14 A light emitting display device
US06/199,627 US4529907A (en) 1977-12-15 1980-10-22 Light emitting display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP271878A JPS5496385A (en) 1978-01-17 1978-01-17 Optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS5496385A true JPS5496385A (en) 1979-07-30

Family

ID=11537079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP271878A Pending JPS5496385A (en) 1977-12-15 1978-01-17 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS5496385A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238076A (en) * 1988-03-17 1989-09-22 Fuji Electric Co Ltd Light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238076A (en) * 1988-03-17 1989-09-22 Fuji Electric Co Ltd Light emitting diode

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