JPS5496385A - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPS5496385A JPS5496385A JP271878A JP271878A JPS5496385A JP S5496385 A JPS5496385 A JP S5496385A JP 271878 A JP271878 A JP 271878A JP 271878 A JP271878 A JP 271878A JP S5496385 A JPS5496385 A JP S5496385A
- Authority
- JP
- Japan
- Prior art keywords
- reflective surface
- electrode
- component
- electrode lead
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
PURPOSE: To secure the degassing for the bubble when the resin is sealed for formation of the ambient unit by providing the 1st reflecting surface which connects the 1st electrode of the luminous element to the electrode lead-out component plus the electrode lead-out material which is connected to the 2nd electrode to form the 2nd reflective surface.
CONSTITUTION: Luminous element 1 is provided on 1st reflective surface 12a at the concave part of 1st reflector 12a' which is formed concave through pressing and part of which extends to possess 1st electrode lead-out component 13a. The 2nd reflective surface 12b is formed to reflector 12b' and is isolated electrically from the 1st reflector. The electrode of element 1 is connected to 2nd electrode lead-out component 13b via metal thin wire 4. The light emission of the element is classified into the direct emission component and the reflected component, and no loss is caused for the reflected component even though the reflective surface has a gap. In the formation of the ambient unit, the bubbles 7, 7' and so forth which are generated when resin 6 is enclosed into the cavity of mold 10 are degassed by passing through the gap formed between the reflective surface. Thus, the lighting appearance is improved with increased reliability.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP271878A JPS5496385A (en) | 1978-01-17 | 1978-01-17 | Optical semiconductor device |
US05/969,259 US4255688A (en) | 1977-12-15 | 1978-12-13 | Light emitter mounted on reflector formed on end of lead |
EP78101688A EP0002529A1 (en) | 1977-12-15 | 1978-12-14 | A light emitting display device |
US06/199,627 US4529907A (en) | 1977-12-15 | 1980-10-22 | Light emitting display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP271878A JPS5496385A (en) | 1978-01-17 | 1978-01-17 | Optical semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5496385A true JPS5496385A (en) | 1979-07-30 |
Family
ID=11537079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP271878A Pending JPS5496385A (en) | 1977-12-15 | 1978-01-17 | Optical semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5496385A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01238076A (en) * | 1988-03-17 | 1989-09-22 | Fuji Electric Co Ltd | Light emitting diode |
-
1978
- 1978-01-17 JP JP271878A patent/JPS5496385A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01238076A (en) * | 1988-03-17 | 1989-09-22 | Fuji Electric Co Ltd | Light emitting diode |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4529907A (en) | Light emitting display device | |
JPS5524404A (en) | Semiconductor light emitting device | |
JPS5496385A (en) | Optical semiconductor device | |
JPS6428882A (en) | Photoelectronic device, manufacture thereof, and lead frame used in same manufacture | |
JPS56142657A (en) | Resin-sealed semiconductor device | |
JPS56131977A (en) | Manufacture of gan light emitting diode | |
JPS53112061A (en) | Wiring substrate of semiconductor chip | |
JPS5930540Y2 (en) | light emitting diode lamp | |
KR950015728A (en) | Surface Mount Semiconductor Devices | |
JPS51139787A (en) | Semiconductor light emitting device | |
JPS5768088A (en) | Photosemiconductor device | |
JPS5456780A (en) | Manufacture of light emitting device | |
JPS5315095A (en) | Preparing recurrence reflector having gas layer | |
JPS58204575A (en) | Semiconductor light emitting element | |
JPS59168682A (en) | Reflection type photosensor | |
JPH0620159B2 (en) | Method for manufacturing optical semiconductor device | |
JPS6025084Y2 (en) | Light-emitting element encapsulated with translucent resin material | |
JPH048401Y2 (en) | ||
JPH05145186A (en) | Package type semiconductor laser device | |
JPS5745270A (en) | Semiconductor device | |
JPS6486419A (en) | Condenser of visible indicator | |
JPH09232636A (en) | Light emitting diode | |
JPS617672A (en) | Tabular lighting light source device | |
JPS6489280A (en) | El device for light source | |
JPS52113073A (en) | Electric bulb |