JPS6418357A - Contact type image sensor - Google Patents

Contact type image sensor

Info

Publication number
JPS6418357A
JPS6418357A JP62173764A JP17376487A JPS6418357A JP S6418357 A JPS6418357 A JP S6418357A JP 62173764 A JP62173764 A JP 62173764A JP 17376487 A JP17376487 A JP 17376487A JP S6418357 A JPS6418357 A JP S6418357A
Authority
JP
Japan
Prior art keywords
image sensor
thermal expansion
board
expansion rate
contact type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62173764A
Other languages
Japanese (ja)
Inventor
Kunikazu Suzuki
Shunji Sakai
Toru Kitagawa
Naohiro Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62173764A priority Critical patent/JPS6418357A/en
Publication of JPS6418357A publication Critical patent/JPS6418357A/en
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a contact type image sensor with low cost and high reliability while the temperature change effect is hardly given, by selecting the thermal expansion rate of a circuit board nearly the same as that of an image sensor chip fixed to the board. CONSTITUTION:A long circuit board 11 is a conjugated body of a ceramic porrous substance whose thermal expansion rate is 3.8X10<-6>/ deg.C and an epoxy resin, has excellent electric insulation and the wiring pattern is applied to the upper face 11a. The image sensor chip 12 made of the silicon whose thermal expansion rate is nearly the same and having the size of 70X0.6mm<2>, has plural light receiving parts 12a arranged in an array. Three chips 12 are arranged in a line and fixed by using a die bond on the upper face 11a of the board 11 to constitute the contact image sensor 10. Thus, the distortion caused between the board 11 and the chip 12 due to thermal expansion/contraction attended with the temperature change is decreased. Thus, reliability is improved and the number of manufacturing processes is reduced to attain the low cost.
JP62173764A 1987-07-14 1987-07-14 Contact type image sensor Pending JPS6418357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62173764A JPS6418357A (en) 1987-07-14 1987-07-14 Contact type image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62173764A JPS6418357A (en) 1987-07-14 1987-07-14 Contact type image sensor

Publications (1)

Publication Number Publication Date
JPS6418357A true JPS6418357A (en) 1989-01-23

Family

ID=15966711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62173764A Pending JPS6418357A (en) 1987-07-14 1987-07-14 Contact type image sensor

Country Status (1)

Country Link
JP (1) JPS6418357A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892141A (en) * 1986-07-28 1990-01-09 The Furukawa Electric Co., Ltd. Fin of heat exchanger and method of making it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892141A (en) * 1986-07-28 1990-01-09 The Furukawa Electric Co., Ltd. Fin of heat exchanger and method of making it

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