JPS6454749A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS6454749A
JPS6454749A JP21199387A JP21199387A JPS6454749A JP S6454749 A JPS6454749 A JP S6454749A JP 21199387 A JP21199387 A JP 21199387A JP 21199387 A JP21199387 A JP 21199387A JP S6454749 A JPS6454749 A JP S6454749A
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
protrusions
semiconductor chip
highly accurate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21199387A
Other languages
Japanese (ja)
Inventor
Isamu Kitahiro
Shuji Kondo
Tatsuo Kikuchi
Yoshihisa Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21199387A priority Critical patent/JPS6454749A/en
Publication of JPS6454749A publication Critical patent/JPS6454749A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a highly accurate and highly reliable semiconductor device by placing a semiconductor chip through an insulating substrate on one group of highly accurate metal leads, connecting the leads to fine metal wirings, and transfer molding them. CONSTITUTION:A thin resin plate 3 is attached to leads 1 having protrusions 6, and electrodes on a semiconductor chip 4 are connected to the leads 1 by fine metal wirings 5. Then, the leads except the protrusions 6 are sealed with resins 2, 7, shape and size are determined and cut. According to this structure, a small-sized and thin semiconductor device having high dimensional accuracy and reliability is obtained without complicated structure like a both-side substrate only by employing metal leads of special shape at part, and is freferably adapted for an IC.
JP21199387A 1987-08-26 1987-08-26 Semiconductor device and manufacture thereof Pending JPS6454749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21199387A JPS6454749A (en) 1987-08-26 1987-08-26 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21199387A JPS6454749A (en) 1987-08-26 1987-08-26 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6454749A true JPS6454749A (en) 1989-03-02

Family

ID=16615120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21199387A Pending JPS6454749A (en) 1987-08-26 1987-08-26 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6454749A (en)

Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171234A (en) * 1987-12-25 1989-07-06 Texas Instr Japan Ltd Semiconductor device
JPH1154551A (en) * 1997-08-04 1999-02-26 Matsushita Electron Corp Plastic molded type semiconductor device and manufacture thereof
JPH11297750A (en) * 1998-04-08 1999-10-29 Matsushita Electron Corp Semiconductor device, manufacture thereof, and mounting of the semiconductor device
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6320251B1 (en) 2000-01-18 2001-11-20 Amkor Technology, Inc. Stackable package for an integrated circuit
US6404046B1 (en) 2000-02-03 2002-06-11 Amkor Technology, Inc. Module of stacked integrated circuit packages including an interposer
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6518659B1 (en) 2000-05-08 2003-02-11 Amkor Technology, Inc. Stackable package having a cavity and a lid for an electronic device
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
KR100404062B1 (en) * 2000-05-24 2003-11-03 산요덴키가부시키가이샤 Plate and method of manufacturing a semiconductor device
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171234A (en) * 1987-12-25 1989-07-06 Texas Instr Japan Ltd Semiconductor device
JPH1154551A (en) * 1997-08-04 1999-02-26 Matsushita Electron Corp Plastic molded type semiconductor device and manufacture thereof
JPH11297750A (en) * 1998-04-08 1999-10-29 Matsushita Electron Corp Semiconductor device, manufacture thereof, and mounting of the semiconductor device
US6455356B1 (en) 1998-10-21 2002-09-24 Amkor Technology Methods for moding a leadframe in plastic integrated circuit devices
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
US6420204B2 (en) 1999-06-03 2002-07-16 Amkor Technology, Inc. Method of making a plastic package for an optical integrated circuit device
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6320251B1 (en) 2000-01-18 2001-11-20 Amkor Technology, Inc. Stackable package for an integrated circuit
US6404046B1 (en) 2000-02-03 2002-06-11 Amkor Technology, Inc. Module of stacked integrated circuit packages including an interposer
US6518659B1 (en) 2000-05-08 2003-02-11 Amkor Technology, Inc. Stackable package having a cavity and a lid for an electronic device
KR100404062B1 (en) * 2000-05-24 2003-11-03 산요덴키가부시키가이샤 Plate and method of manufacturing a semiconductor device
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US10665567B1 (en) 2002-11-08 2020-05-26 Amkor Technology, Inc. Wafer level package and fabrication method
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US11869829B2 (en) 2009-01-05 2024-01-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with through-mold via
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US10546833B2 (en) 2009-12-07 2020-01-28 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US10410967B1 (en) 2011-11-29 2019-09-10 Amkor Technology, Inc. Electronic device comprising a conductive pad on a protruding-through electrode
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US11043458B2 (en) 2011-11-29 2021-06-22 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

Similar Documents

Publication Publication Date Title
JPS6454749A (en) Semiconductor device and manufacture thereof
JPS57207356A (en) Semiconductor device
JPS5471572A (en) Semiconductor device
EP0390996A3 (en) Ic card module
MY106727A (en) Plastic molded type semiconductor device.
EP0381383A3 (en) Semiconductor device having insulating substrate adhered to conductive substrate
JPS55111151A (en) Integrated circuit device
JPS57181144A (en) Semiconductor device
DE3681193D1 (en) LOGICAL INTEGRATED CIRCUIT DEVICE FORMED ON A COMPOSITE SEMICONDUCTOR SUBSTRATE.
JPS57176738A (en) Connecting structure for flip chip
JPS5998545A (en) Semiconductor device
JPS6455291A (en) Integrated circuit device
JPS5524405A (en) Magnetoelectric conversion element and its manufacturing process
EP0401017A3 (en) Method of producing a post molded cavity package with internal dam bar for integrated circuit
CA2017080A1 (en) Semiconductor device package structure
GB2013027A (en) Integrated circuit packages
GB1176326A (en) Improvements in and relating to Semiconductor Devices
JPS5710951A (en) Semiconductor device
JPS6489356A (en) Hybrid integrated circuit
JPS54102971A (en) Semiconductor device
JPS5483768A (en) Semiconductor device
JPS55103747A (en) Manufacture of semiconductor device
JPS6456595A (en) Manufacture of ic card
JPS5414676A (en) Carrier tape and electronic parts using it
JPS6444027A (en) Semiconductor device