JPH067971U - Electronic card - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a thin electronic card that can secure high bending rigidity and has a simple structure. [Structure] The card case 1 is formed of a molded substrate,
Electronic components 4 and 5 are directly mounted on the card case 1. The exterior sheets 6 and 6 are attached to both sides of the card case 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic card. More specifically, the present invention relates to an electronic card in which a board on which electronic components are mounted is made into a card.

[0002]

[Background technology]

 FIG. 3 is a sectional view showing the configuration of a conventional electronic card C. In this electronic card C, electronic components such as an IC package 32 and a chip component 33 are mounted on a resin laminated substrate 31 such as a glass / epoxy resin laminated substrate. Further, a recess 34a for fitting the board is provided on one surface of the card case 34, and a plurality of electronic component insertion holes 34b are opened.

Then, an adhesive is applied to the board fitting recess 34a, the IC package 32, the chip component 33, etc. are inserted into the electronic component insertion hole 34b, and the resin laminated substrate 31 is fitted into the board fitting recess 34a. And glue with adhesive. Next, the exterior sheets 35, 35 are attached to both surfaces to form the electronic card C.

[0004]

[Problems to be solved by the device]

 In such an electronic card, since electronic components are built in, high bending rigidity is required to protect the electronic components. In the electronic card C of FIG. 3, the bending rigidity of the electronic card C is ensured by the card case 34.

However, in the conventional electronic card C, the resin laminated substrate 31, the card case 34, and the exterior sheets 35, 35 are bonded together. Therefore, when the electronic card C is thinned, Since the thickness of the case 34 becomes thin, sufficient bending rigidity cannot be secured. For example, in the case of the electronic card C having the total thickness D = 1.0 mm, the thickness of the card case 34 itself can be secured only d = 0.4 mm. Therefore, if the adhesive surface between the resin laminated substrate 31 and the card case 34 is peeled off or the adhesive strength is weak, the bending rigidity required for the electronic card C cannot be maintained, and the electronic card C is thin. There was a problem that it was not possible to realize this electronic card.

Further, the resin laminated substrate 31 on which the electronic parts are mounted must be firmly adhered to the card case 34, which is troublesome in assembling.

The present invention has been made in view of the drawbacks of the above conventional examples, and an object of the present invention is to provide a thin electronic card having high bending rigidity and a simple structure. .

[0008]

[Means for Solving the Problems]

 The electronic card of the present invention is characterized in that the card case is formed of a molded substrate and the electronic components are directly mounted on the card case.

[0009]

[Action]

 In the electronic card of the present invention, the molded board itself on which the electronic components are mounted serves as a card case, so that the thickness of the card case is not taken by the resin molded board unlike the conventional case. If the electronic cards have the same thickness, the thickness of the card case can be increased. Therefore, the bending rigidity of the card case itself can be increased, and a thin electronic card having high mechanical rigidity can be realized.

In particular, when the adhesive surface between the resin-molded substrate and the card case is peeled off or the adhesive is weak as in the conventional case, the disadvantage that the bending rigidity of the electronic card sharply decreases is solved. It

Further, the number of parts is reduced and the assembling process can be simplified.

[0012]

FIG. 1 is a sectional view showing the configuration of an electronic card A according to an embodiment of the present invention. This electronic card A has a structure in which exterior sheets 6 and 6 are attached to both sides of a card case 1 on which ICs, memory elements and other electronic components 4 and 5 are mounted by an adhesive.

The card case 1 is composed of a known molded substrate 1. The molded substrate is a substrate formed by engineering plastics such as ABS resin or PBT resin having high mechanical rigidity, on the surface of which wiring patterns, electrode pads, and through holes are formed if necessary. Most of them have high heat resistance so that they can be soldered.

The card case 1 has storage holes 2 and 3 for mounting the electronic components 4 and 5, respectively. A step portion 2a is formed in one of the storage holes 2, and an electrode pad (not shown) for connecting the lead 4a of the electronic component 4 is provided in the step portion 2a. Therefore, the leaded electronic component 4 is housed in the housing hole 2 with the end of the lead 4 a connected to the electrode of the step 2 a.

In the chip-type electronic component 5, the external electrodes 5 a, 5 a are soldered to the electrodes 3 a, 3 a provided on the inner surface of the housing hole 3 and housed in the housing hole 3.

As described above, in this embodiment, the molded substrate itself is the card case 1, and the electronic components 4 and 5 can be mounted on the card case 1. Therefore, the resin laminated substrate as in the conventional example is used. Since the thickness of the card case is not reduced, the thickness of the card case can be secured even when the electronic card A is made thin, and the bending rigidity of the electronic card C can be increased.

FIG. 2 is a sectional view showing an electronic card B according to another embodiment of the present invention. Even in the present invention, like the electronic card B, the exterior sheets 8 and 8 are attached to the recesses 7a and 7a provided on the surface of the card case, and the exterior sheets 8 and 8 are peeled from the ends. You may make it difficult.

[0018]

[Effect of device]

 According to the present invention, since the thickness of the card case is not taken by the resin molded substrate as in the conventional case, the thickness of the card case can be increased if the electronic card has the same thickness. Therefore, the bending rigidity of the card case itself can be increased, and a thin electronic card having high mechanical rigidity can be realized.

In particular, when the adhesive surface between the resin-molded substrate and the card case is peeled off or the adhesive is weak as in the conventional case, the disadvantage that the bending rigidity of the electronic card is sharply reduced is solved. , The reliability of electronic cards is improved.

Further, since the electronic parts can be mounted on the card case itself, the number of parts can be reduced and the assembling process can be simplified.

[Brief description of drawings]

FIG. 1 is a sectional view showing a structure of an electronic card according to an embodiment of the present invention.

FIG. 2 is a sectional view showing the structure of an electronic card according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a structure of an electronic card according to a conventional example.

[Explanation of symbols]

 1 Card case 4,5 Electronic parts 6 Exterior sheet

Claims (1)

[Scope of utility model registration request] 1. An electronic card in which a card case is formed of a molded substrate, and electronic parts are directly mounted on the card case.