JPS6428886A - Hybrid integrated circuit board - Google Patents

Hybrid integrated circuit board

Info

Publication number
JPS6428886A
JPS6428886A JP18401687A JP18401687A JPS6428886A JP S6428886 A JPS6428886 A JP S6428886A JP 18401687 A JP18401687 A JP 18401687A JP 18401687 A JP18401687 A JP 18401687A JP S6428886 A JPS6428886 A JP S6428886A
Authority
JP
Japan
Prior art keywords
core
circuit board
insulating material
exposed plane
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18401687A
Other languages
Japanese (ja)
Inventor
Koji Takemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18401687A priority Critical patent/JPS6428886A/en
Publication of JPS6428886A publication Critical patent/JPS6428886A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To increase a heat dissipation effect of a circuit board and to minimize a size of the whole circuit board body by exposing a part of the core made of metal in such substrate that said core is covered with an electrically insulating material and also sticking a metal plate for heat dissipation to the exposed plane. CONSTITUTION:A printed circuit board 4 is so formed that an insulating material 6 such as epoxy resin, glass, etc. covers its surface except a part of that for exposing a part of a core 5 made of metal. This exposed plane 7 is formed by masking the exposed plane 7 before covering the core 5 with said insulating material 6, or removing the insulating material 6 over the exposed plane 7 after covering the core 5 with the insulating material 6. Next, a metal plate 8 for heat dissipation which has high heat-dissipation properties is stuck to the exposed plane 7 by soldering etc., so as to form a hybrid integrated circuit board 9. By this constitution, the heat produced in a circuit device 10 is conducted through a core 5 to the exposed plane 7, and a large amount of heat can be dissipated from the heat dissipation metal plate 8 into the air effectively.
JP18401687A 1987-07-23 1987-07-23 Hybrid integrated circuit board Pending JPS6428886A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18401687A JPS6428886A (en) 1987-07-23 1987-07-23 Hybrid integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18401687A JPS6428886A (en) 1987-07-23 1987-07-23 Hybrid integrated circuit board

Publications (1)

Publication Number Publication Date
JPS6428886A true JPS6428886A (en) 1989-01-31

Family

ID=16145863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18401687A Pending JPS6428886A (en) 1987-07-23 1987-07-23 Hybrid integrated circuit board

Country Status (1)

Country Link
JP (1) JPS6428886A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132222A1 (en) 2005-06-07 2006-12-14 Fujikura Ltd. Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
WO2006132148A1 (en) 2005-06-07 2006-12-14 Fujikura Ltd. Porcelain enameled substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
US7982230B2 (en) 2005-06-13 2011-07-19 Fujikura Ltd. Substrate for mounting light emitting element, light emitting module and lighting apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132222A1 (en) 2005-06-07 2006-12-14 Fujikura Ltd. Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
WO2006132148A1 (en) 2005-06-07 2006-12-14 Fujikura Ltd. Porcelain enameled substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
US7997760B2 (en) 2005-06-07 2011-08-16 Fujikura Ltd. Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal
US7982230B2 (en) 2005-06-13 2011-07-19 Fujikura Ltd. Substrate for mounting light emitting element, light emitting module and lighting apparatus

Similar Documents

Publication Publication Date Title
GB2009504A (en) Protected integrated electrical circuits
JPS6428886A (en) Hybrid integrated circuit board
JPS57181144A (en) Semiconductor device
JPS5670655A (en) Manufacture of electronic circuit mounting device
JPS5562764A (en) Semiconductor device
JPS5514506A (en) Bubble memory plane
JPS57192058A (en) Semiconductor device
JPS57116665A (en) Thermal head incorporated in driving circuit
JPS5737839A (en) Manufacture of hybrid integrated circuit
JPS55138241A (en) Sealing structure for semiconductor device
JPS56133857A (en) Manufacture of hybrid ic
SE8702704L (en) SET FOR MANUFACTURE OF A PATTERN CARD AND DEVICE FOR USE IN IMPLEMENTATION OF THE SET
JPS551153A (en) Semiconductor fitting device
JPS6489547A (en) Board for mounting semiconductor element
JPS64787A (en) Electronic circuit device
JPS55138240A (en) Manufacture of semiconductor device
JPH05335452A (en) Hybrid integrated circuit device
JPS54102971A (en) Semiconductor device
JPS5656657A (en) Manufacture of hybrid integrated circuit
JPS55117254A (en) Fabrication of electronic device
JPS5776869A (en) Semiconductor device
JPS55103751A (en) Semiconductor device
JPS5772338A (en) Manufacture of semiconductor device
JPS647546A (en) Resin-sealed semiconductor device
JPS5521175A (en) Semiconductor device