JPS56111253A - Mounting of heat-radiating fin to thick film integrated power circuit - Google Patents
Mounting of heat-radiating fin to thick film integrated power circuitInfo
- Publication number
- JPS56111253A JPS56111253A JP1368880A JP1368880A JPS56111253A JP S56111253 A JPS56111253 A JP S56111253A JP 1368880 A JP1368880 A JP 1368880A JP 1368880 A JP1368880 A JP 1368880A JP S56111253 A JPS56111253 A JP S56111253A
- Authority
- JP
- Japan
- Prior art keywords
- radiating fin
- heat
- ceramic plate
- double side
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To make compacter the thick film IC with double side wirig substrate, by inserting a ceramic plate of good thermal conductivity and electric insulating characteristic between the double side wiring substrate and a heat radiating fin to form an insulating layer thereto.
CONSTITUTION: A ceramic plate 3 made of alumina-beryllia is inserted between a double side wiring substrate 1 and a metallic heat-radiating fin 2. On one side of the substrate 1 which faces the ceramic plate 3, a thick glass paste film is printed and the ceramic plate 3 is bonded thereon and annealed, and attached by the glass layer 4. Then the ceramic plate 3 and the heat-radiating fin 2 is bonded by a resinous adhesives 5 of good thermal conductivity. With such an arrangement, a layer with good thermal conductivity and electric insulating characteristic can be formed between the double side wiring substrate and the heat-radiating fin, and a compacter IC with double side wiring can be obtained.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1368880A JPS56111253A (en) | 1980-02-08 | 1980-02-08 | Mounting of heat-radiating fin to thick film integrated power circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1368880A JPS56111253A (en) | 1980-02-08 | 1980-02-08 | Mounting of heat-radiating fin to thick film integrated power circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56111253A true JPS56111253A (en) | 1981-09-02 |
Family
ID=11840121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1368880A Pending JPS56111253A (en) | 1980-02-08 | 1980-02-08 | Mounting of heat-radiating fin to thick film integrated power circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56111253A (en) |
-
1980
- 1980-02-08 JP JP1368880A patent/JPS56111253A/en active Pending
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