JPS56111253A - Mounting of heat-radiating fin to thick film integrated power circuit - Google Patents

Mounting of heat-radiating fin to thick film integrated power circuit

Info

Publication number
JPS56111253A
JPS56111253A JP1368880A JP1368880A JPS56111253A JP S56111253 A JPS56111253 A JP S56111253A JP 1368880 A JP1368880 A JP 1368880A JP 1368880 A JP1368880 A JP 1368880A JP S56111253 A JPS56111253 A JP S56111253A
Authority
JP
Japan
Prior art keywords
radiating fin
heat
ceramic plate
double side
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1368880A
Other languages
Japanese (ja)
Inventor
Kenji Kinji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1368880A priority Critical patent/JPS56111253A/en
Publication of JPS56111253A publication Critical patent/JPS56111253A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make compacter the thick film IC with double side wirig substrate, by inserting a ceramic plate of good thermal conductivity and electric insulating characteristic between the double side wiring substrate and a heat radiating fin to form an insulating layer thereto.
CONSTITUTION: A ceramic plate 3 made of alumina-beryllia is inserted between a double side wiring substrate 1 and a metallic heat-radiating fin 2. On one side of the substrate 1 which faces the ceramic plate 3, a thick glass paste film is printed and the ceramic plate 3 is bonded thereon and annealed, and attached by the glass layer 4. Then the ceramic plate 3 and the heat-radiating fin 2 is bonded by a resinous adhesives 5 of good thermal conductivity. With such an arrangement, a layer with good thermal conductivity and electric insulating characteristic can be formed between the double side wiring substrate and the heat-radiating fin, and a compacter IC with double side wiring can be obtained.
COPYRIGHT: (C)1981,JPO&Japio
JP1368880A 1980-02-08 1980-02-08 Mounting of heat-radiating fin to thick film integrated power circuit Pending JPS56111253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1368880A JPS56111253A (en) 1980-02-08 1980-02-08 Mounting of heat-radiating fin to thick film integrated power circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1368880A JPS56111253A (en) 1980-02-08 1980-02-08 Mounting of heat-radiating fin to thick film integrated power circuit

Publications (1)

Publication Number Publication Date
JPS56111253A true JPS56111253A (en) 1981-09-02

Family

ID=11840121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1368880A Pending JPS56111253A (en) 1980-02-08 1980-02-08 Mounting of heat-radiating fin to thick film integrated power circuit

Country Status (1)

Country Link
JP (1) JPS56111253A (en)

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