JPS56122148A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56122148A
JPS56122148A JP2465680A JP2465680A JPS56122148A JP S56122148 A JPS56122148 A JP S56122148A JP 2465680 A JP2465680 A JP 2465680A JP 2465680 A JP2465680 A JP 2465680A JP S56122148 A JPS56122148 A JP S56122148A
Authority
JP
Japan
Prior art keywords
semiconductor device
placing plate
heat radiator
resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2465680A
Other languages
Japanese (ja)
Other versions
JPS5943094B2 (en
Inventor
Yasutoshi Kurihara
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2465680A priority Critical patent/JPS5943094B2/en
Publication of JPS56122148A publication Critical patent/JPS56122148A/en
Publication of JPS5943094B2 publication Critical patent/JPS5943094B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To simultaneously insulate and secure a semiconductor device by interposing a film having electric insulation and adhesive with thermoplastic resin at a heat radiator having a flat part for carrying a metal placing plate for placing a circuit element including a semiconductor element. CONSTITUTION:A composite resin film 12 formed by covering fluorine resin on both side surfaces of polyimide film as an insulator is integrally interposed between a heat radiator 16 formed of aluminum having flat surface at one side and comb- shaped fin 16 at the other and a copper placing plate 13 for carrying a circuit element 14. Thus, the electric insulation is obtained with the polyimide, and the placing plate and the heat radiator can be integrated with the resin. Accordingly, the semiconductor device thus formed has excellent heat dissipating and electric insuating properties.
JP2465680A 1980-03-01 1980-03-01 semiconductor equipment Expired JPS5943094B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2465680A JPS5943094B2 (en) 1980-03-01 1980-03-01 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2465680A JPS5943094B2 (en) 1980-03-01 1980-03-01 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS56122148A true JPS56122148A (en) 1981-09-25
JPS5943094B2 JPS5943094B2 (en) 1984-10-19

Family

ID=12144179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2465680A Expired JPS5943094B2 (en) 1980-03-01 1980-03-01 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5943094B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524708A1 (en) * 1982-04-02 1983-10-07 Mitsubishi Electric Corp DEVICE FOR COOLING SEMICONDUCTOR ELEMENTS
JPH0487211A (en) * 1990-07-31 1992-03-19 Furukawa Electric Co Ltd:The Aerial cable of low wind noise and low corona noise
US6436733B2 (en) * 1998-08-10 2002-08-20 Sony Corporation Bonding layer method in a semiconductor device
JP2012182413A (en) * 2011-02-10 2012-09-20 Jtekt Corp Control circuit structure
JP2013232445A (en) * 2012-04-27 2013-11-14 Toshiba Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524708A1 (en) * 1982-04-02 1983-10-07 Mitsubishi Electric Corp DEVICE FOR COOLING SEMICONDUCTOR ELEMENTS
JPH0487211A (en) * 1990-07-31 1992-03-19 Furukawa Electric Co Ltd:The Aerial cable of low wind noise and low corona noise
US6436733B2 (en) * 1998-08-10 2002-08-20 Sony Corporation Bonding layer method in a semiconductor device
JP2012182413A (en) * 2011-02-10 2012-09-20 Jtekt Corp Control circuit structure
JP2013232445A (en) * 2012-04-27 2013-11-14 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5943094B2 (en) 1984-10-19

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