JPS6442135A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6442135A JPS6442135A JP19857987A JP19857987A JPS6442135A JP S6442135 A JPS6442135 A JP S6442135A JP 19857987 A JP19857987 A JP 19857987A JP 19857987 A JP19857987 A JP 19857987A JP S6442135 A JPS6442135 A JP S6442135A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- substrate
- electrode plate
- thickness
- dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To enhance a heat-dissipating effect, to prevent the occurrence of insulation defect and to shorten an assembly duration by a method wherein a recessed part is formed on the side where an electrode plate is bonded to an insulating substrate and the thickness of the substrate between the electrode plate and a heat-dissipating plate is set to be small as compared with other thicknesses of the substrate. CONSTITUTION:A recessed part where a metallized part 12 is formed on its bottom face is formed on the side where an electrode plate is bonded; a substrate thickness t1 of an insulating substrate 11 between the electrode plate 3a and a heat-dissipating plate 2 is set to be small as compared with a substrate thickness t2 in other parts. The substrate thickness t2 of the insulating substrate 11 is set to be larger than the thickness of the substrate 11; by this setup, a creeping distance between the electrode plate 3a and the heat-dissipating plate 2 can be set to be a large size. Accordingly, it is possible to shorten a heat- conduction route between a semiconductor element 5 and the heat-dissipating plate 2. By this setup, it is possible to enhance a heat-dissipating effect, to prevent the occurrence of an insulation defect due to a breakdown of the insulating substrate and to shorten an assembly duration.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19857987A JPS6442135A (en) | 1987-08-07 | 1987-08-07 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19857987A JPS6442135A (en) | 1987-08-07 | 1987-08-07 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6442135A true JPS6442135A (en) | 1989-02-14 |
Family
ID=16393524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19857987A Pending JPS6442135A (en) | 1987-08-07 | 1987-08-07 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6442135A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5305691A (en) * | 1992-02-10 | 1994-04-26 | Komori Corporation | Plate lockup device position detecting apparatus for printing press |
US5576578A (en) * | 1991-11-15 | 1996-11-19 | Siemens Aktiengesellschaft | High voltage insulating disk |
JP2002062125A (en) * | 2000-06-08 | 2002-02-28 | Komori Corp | Detector for movement amount of moving body |
US6601504B2 (en) | 2000-06-23 | 2003-08-05 | Komori Corporation | Cylinder apparatus for rotary printing press |
EP2327548A1 (en) | 2009-11-30 | 2011-06-01 | Komori Corporation | Register apparatus of printing press and register method for printing press |
JP2014146723A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | Power semiconductor device |
WO2018211751A1 (en) * | 2017-05-18 | 2018-11-22 | 三菱電機株式会社 | Semiconductor module and power conversion device |
-
1987
- 1987-08-07 JP JP19857987A patent/JPS6442135A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5576578A (en) * | 1991-11-15 | 1996-11-19 | Siemens Aktiengesellschaft | High voltage insulating disk |
US5305691A (en) * | 1992-02-10 | 1994-04-26 | Komori Corporation | Plate lockup device position detecting apparatus for printing press |
JP2002062125A (en) * | 2000-06-08 | 2002-02-28 | Komori Corp | Detector for movement amount of moving body |
US6601504B2 (en) | 2000-06-23 | 2003-08-05 | Komori Corporation | Cylinder apparatus for rotary printing press |
EP2327548A1 (en) | 2009-11-30 | 2011-06-01 | Komori Corporation | Register apparatus of printing press and register method for printing press |
JP2014146723A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | Power semiconductor device |
WO2018211751A1 (en) * | 2017-05-18 | 2018-11-22 | 三菱電機株式会社 | Semiconductor module and power conversion device |
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