JPH01192149A - Cooling device for electric heating element - Google Patents
Cooling device for electric heating elementInfo
- Publication number
- JPH01192149A JPH01192149A JP1785988A JP1785988A JPH01192149A JP H01192149 A JPH01192149 A JP H01192149A JP 1785988 A JP1785988 A JP 1785988A JP 1785988 A JP1785988 A JP 1785988A JP H01192149 A JPH01192149 A JP H01192149A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heating element
- electric heating
- heat sink
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005485 electric heating Methods 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 title claims description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000003989 dielectric material Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 239000000615 nonconductor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 22
- 239000012212 insulator Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この宅間は例えば半導体素子等の電気発熱体の冷却装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to a cooling device for an electric heating element such as a semiconductor element, for example.
第２図および第３図は例えば東芝レビュー（昭和５５年
１１月１日箔行）の７オートニヱースに開示されている
この種装置の従来の！ｌｆ成を示すもので、第２図は正
面断面図、第３図は第２図■−■線における断面は１で
ある。これら各図にお＾で、（１）はサイリスタ、トラ
ンジスタなどの半導体素子等からなる電気余熱体Ｃ以下
、半導体素子と称す）、（２）は半導体素子（１）に密
接して設けられ、半導体素子（１）から発熱した熱を吸
熱する吸熱部（２ａ）とその熱を周囲空気中に放熱する
放熱部（２ｂ）とからなるヒートシンクであ＃）、銅、
アルミニウム等の熱伝導性の良ハ金属で構成されている
。ヒートシンク（２）の放熱部（２ｂ）は吸熱部（２ａ
）に対し放射状に複数配設されて＾る。（３）はヒート
シンク（２）の放熱部（２ｂ）の一部に取シ付けられた
端子であり、半導体素子（１）の電流を外部に＠Ｌシ出
す。尚、ヒートシンク【２）の放熱部（２ｂ）は通常図
示しなめ冷却ファンによシ冷風が供給されて冷却される
。Figures 2 and 3 show, for example, a conventional example of this type of device, which is disclosed in 7 Auto News of Toshiba Review (Haku Publishing, November 1, 1980). FIG. 2 is a front cross-sectional view, and FIG. 3 is a cross-sectional view taken along the line ■-■ in FIG. 2. In each of these figures, (1) is an electric preheating body C consisting of a semiconductor element such as a thyristor or a transistor (hereinafter referred to as a semiconductor element), (2) is provided in close proximity to the semiconductor element (1), A heat sink consisting of a heat absorption part (2a) that absorbs heat generated from the semiconductor element (1) and a heat radiation part (2b) that radiates the heat into the surrounding air, copper,
It is made of a metal with good thermal conductivity such as aluminum. The heat radiation part (2b) of the heat sink (2) is the heat absorption part (2a
) are arranged radially. (3) is a terminal attached to a part of the heat sink (2b) of the heat sink (2), and outputs the current of the semiconductor element (1) to the outside. The heat sink (2b) of the heat sink (2) is normally cooled by supplying cold air with a cooling fan (not shown).
次に動作について説明する。半導体素子（１）によって
余生された熱はヒートシンク【２）の吸熱部（２ａ）に
吸熱され、放熱部（２ｂ）に伝達される。放熱部（２ｂ
）ｄ冷却ファンにより冷風が供給されておシ、放熱部（
２ｂ）に伝達された半導体素子【１）の熱はその冷風中
に放熱されて効率的に冷却される０又、半導体素子【１
）の電流はヒートシンク（２）の受熱部（２ａ’１ｍ放
熱部（２に＋ ）、端子（３）を経て外部に＠９出す。Next, the operation will be explained. The residual heat generated by the semiconductor element (1) is absorbed by the heat absorbing part (2a) of the heat sink [2] and is transferred to the heat radiating part (2b). Heat dissipation part (2b
) d Cool air is supplied by the cooling fan, and the heat dissipation section (
The heat of the semiconductor element [1] transferred to the semiconductor element [1] is radiated into the cold air and is efficiently cooled.
) is output to the outside via the heat receiving part (2a'1m heat dissipating part (2)) of the heat sink (2) and the terminal (3).
〔発明が解決しようとする課題〕
しかしながら上述した従来装置では、半導体素子（１）
の電流をヒートシンク（２）を通じて外部に取り出すよ
うにしておシ、ヒートシンク（２）にも電位がかかる。[Problem to be solved by the invention] However, in the above-mentioned conventional device, the semiconductor element (1)
The current is taken out to the outside through the heat sink (2), and a potential is also applied to the heat sink (2).
従って、ヒートシンク（２）の放熱部（２１））Ｋは冷
風が供給されるため導電性のゴミなどの無い清浄な冷風
を必要とする課題がある〇
この発明は上記のような課題を解消するためになされた
本のであシ、ヒートシンクに電位が伝わらない電気発熱
体の冷却装置を提供するものである。Therefore, since cold air is supplied to the heat dissipating part (21)) K of the heat sink (2), there is a problem in that it requires clean cold air free of conductive dust. This invention solves the above problems. This book was created for the purpose of providing a cooling device for an electric heating element in which no potential is transmitted to the heat sink.
この発明に係る電気発熱体の冷却装置は、電気発熱体と
ヒートシンクとの間に高熱伝導性電気絶縁体を配設した
ものである。A cooling device for an electric heating element according to the present invention has a highly thermally conductive electric insulator disposed between the electric heating element and a heat sink.
この発明Ｖｃおける電気発熱体の冷却装置は、高熱伝導
性電気絶縁体によシミ気毎熱体の熱をヒートシンクに伝
えると共に電気発熱体の電位をヒートシンクに伝えず電
気絶縁とする〇
〔実施例〕
以下、との発明の一実施例を第１図に基づいて説明する
。第１図は正面断面図である。第１図において、【１）
は半導体素子、〔２）はヒートシンク、（２ａ）は受熱
部、 （２ｂ”）は放熱部言４）は半導体素子（１）
とヒートシンク（２）との間に配設され、半導体素子（
１）の電流を外部に取り出す端子であり、導電性金属か
らなる。（５）は半導体素子（１）とヒートシンク（２
）の受熱部（２ａ）との間、即ち、端子（４）とヒート
シンク（２）の受熱部（２ａ）との間に配設された高熱
伝導性電気絶縁体であり１例えばセラミックペーパーに
樹脂を含浸させたプリプレグシートを積層し加熱硬化さ
せて形成されておシ、半導体素子（１）が篭生じた熱を
ヒートシンク（２）の受熱部（２ａ）に伝えると共に半
導体素子（１）の電位をヒートシンク（２）に伝えず電
気絶縁する。The cooling device for an electric heating element according to this invention Vc uses a highly thermally conductive electric insulator to transfer the heat of the heating element to the heat sink, and does not transfer the electric potential of the electric heating element to the heat sink, making it electrically insulated. ] Hereinafter, one embodiment of the invention will be described based on FIG. 1. FIG. 1 is a front sectional view. In Figure 1, [1]
is the semiconductor element, [2] is the heat sink, (2a) is the heat receiving part, (2b'') is the heat dissipation part. 4) is the semiconductor element (1)
and the heat sink (2), and the semiconductor element (
This is a terminal for extracting the current from 1) to the outside, and is made of conductive metal. (5) is a semiconductor element (1) and a heat sink (2).
), that is, between the terminal (4) and the heat receiving part (2a) of the heat sink (2). It is formed by laminating prepreg sheets impregnated with and heating and curing.The semiconductor element (1) is trapped and the generated heat is transferred to the heat receiving part (2a) of the heat sink (2), and the potential of the semiconductor element (1) is Electrically insulate the heat sink (2) without transmitting it to the heat sink (2).
次に動作について説明する。半導体素子（１）から発生
じた熱は端子（４）、高熱伝導性電気絶縁体（５）を通
じてヒートシンク（２）シ受熱部（２ａ）！ＩＣ伝達さ
れる。Next, the operation will be explained. Heat generated from the semiconductor element (1) passes through the terminal (4) and the highly thermally conductive electric insulator (5) to the heat sink (2) and the heat receiving part (2a)! IC transmitted.
その後の熱伝達機能は従来のものと同様であるため説明
を省略する。又、半導体素子（１）に流れる電流は端子
（４）よ〕外部へ取り出される。そして、高熱伝導性電
気絶縁体（５）によりヒートシンク（２）は半導体素子
【１）、端子（４）と電気的に絶縁されておシミ位がか
からな−０従って、ヒートシンク〔２）の放熱部（２ｂ
）には電位がかからないので、導電性のゴミなどの無い
冷風を必ずしも供給しなくてもよ＾。The subsequent heat transfer function is the same as that of the conventional one, so a description thereof will be omitted. Further, the current flowing through the semiconductor element (1) is taken out to the outside through the terminal (4). The heat sink (2) is electrically insulated from the semiconductor element [1] and the terminals (4) by the highly thermally conductive electric insulator (5), so that there is no staining. Heat dissipation part (2b
) has no potential applied to it, so it is not necessary to supply cold air that is free of conductive debris.
尚、上記実施例では高熱伝導性電気絶縁体（５）ハセラ
ミックペーパーに樹脂を含浸させたプリプレグシートを
積層し加熱硬化させて形成した場合について述べたが、
セラミックペーパーをヒートシンク（２）と半導体素子
（１）との間に挿着した後、セラミックペーパーに樹脂
を滴下し浸透させ硬化させて形成するようにしてもよい
。Incidentally, in the above embodiment, a case was described in which the highly thermally conductive electric insulator (5) was formed by laminating prepreg sheets impregnated with resin on ceramic paper and curing them by heating.
The ceramic paper may be inserted between the heat sink (2) and the semiconductor element (1), and then resin may be dropped onto the ceramic paper to permeate and harden.
又、セラミックペーパーとしては、例えばアルミナ短繊
維と有機バインダーとしてミクロフィブリル化セルロー
スとを用＾て成形され、たアルミナペーパーとしてもよ
く、熱伝導性大、電気絶縁性大、防錆大、耐環境性大、
耐圧接強度大などの優れた利点を有してハる０尚、セラ
ミックペーパーとしてアルミナペーパーに限定されるも
のではなく類似のものも含むことは勿論のことである。Ceramic paper may also be alumina paper, which is formed using short alumina fibers and microfibrillated cellulose as an organic binder, and has high thermal conductivity, high electrical insulation, high rust resistance, and environmental resistance. big sex,
It has excellent advantages such as high pressure resistance and welding strength. However, it goes without saying that the ceramic paper is not limited to alumina paper, but also includes similar materials.
又、セラミックペーパーに樹脂を含浸させたプリプレグ
シートを積層して積層板構造の高熱伝導性電気絶縁体と
し、エポキシ、ナイロン樹脂等の接着剤を塗布し、圧接
時に電気発熱体あるいけヒートシンクに貼付するように
してもよめ。In addition, prepreg sheets made of ceramic paper impregnated with resin are laminated to create a highly thermally conductive electrical insulator with a laminate structure, coated with an adhesive such as epoxy or nylon resin, and affixed to an electric heating element or heat sink during pressure bonding. You may do as you please.
又、電気発熱体としては半導体累子に限らず各ｉｉ子部
品、素子などに適用し得るものである。Further, the electric heating element is applicable not only to semiconductor components but also to various II component parts, elements, etc.
この発明は以上説明した通り、電気発熱体とヒートシン
クとの間に配設した高熱伝導性電気絶縁体により、電気
発熱体の熱をヒートシンクに伝えると共に電気発熱体の
電位をヒートシンクに伝えず電気絶縁するようにしたの
で、経済的な冷却装置を得ることができる。As explained above, this invention uses a highly thermally conductive electric insulator disposed between the electric heating element and the heat sink to conduct the heat of the electric heating element to the heat sink and to prevent the electric potential of the electric heating element from being transferred to the heat sink. As a result, an economical cooling device can be obtained.
第１図はこの発明の一実施例による電気発熱体の冷却装
置を示す正面断面図、第２図は従来の電気発熱体の冷却
装置を示す正面断面□□□Ｓ第３図は第２図■−■線に
おける断面図である。
図におｈで、（１）は電気発熱体、（２）はヒートシン
ク、（２ａ）け受熱部、（２ｂ）は放熱部、（５）は高
熱伝導性電気絶縁体である。
尚１図中同一符号は同−又は相当部分を示す。Fig. 1 is a front sectional view showing a cooling device for an electric heating element according to an embodiment of the present invention, and Fig. 2 is a front sectional view showing a conventional cooling device for an electric heating element. It is a sectional view taken along the line ■-■. In the figure, (1) is an electric heating element, (2) is a heat sink, (2a) is a heat receiving part, (2b) is a heat dissipating part, and (5) is a highly thermally conductive electric insulator. Note that the same reference numerals in Figure 1 indicate the same or equivalent parts.
Claims (4)
した熱を吸熱する吸熱部とその熱を放熱する放熱部とか
らなるヒートシンクと、上記ヒートシンクと上記電気発
熱体との間に配設された高熱伝導性電気絶縁体とを備え
たことを特徴とする電気発熱体の冷却装置。(1) A heat sink to which an electric heating element is attached and comprising a heat absorption part that absorbs heat generated from the electric heating element and a heat radiation part that radiates the heat, and a heat sink that is disposed between the heat sink and the electric heating element. 1. A cooling device for an electric heating element, comprising: a highly thermally conductive electric insulator;
樹脂を含浸させたプリプレグシートを積層し加熱硬化さ
せて形成されたことを特徴とする特許請求の範囲第１項
記載の電気発熱体の冷却装置。(2) The cooling device for an electric heating element according to claim 1, wherein the highly thermally conductive electric insulator is formed by laminating prepreg sheets made of ceramic paper impregnated with resin and curing them by heating. .
金属ブロックと端子との間に挿着した後、セラミックペ
ーパーに樹脂を滴下し侵透させ硬化させて形成されたこ
とを特徴とする特許請求の範囲第１項記載の電気発熱体
の冷却装置。(3) The highly thermally conductive electrical insulator is formed by inserting ceramic paper between a metal block and a terminal, and then dripping resin onto the ceramic paper to penetrate and harden it. A cooling device for an electric heating element according to scope 1.
ることを特徴とする特許請求の範囲第２項又は第３項に
記載の電気発熱体の冷却装置。(4) The cooling device for an electric heating element according to claim 2 or 3, wherein the ceramic paper is made of alumina paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1785988A JPH01192149A (en) | 1988-01-28 | 1988-01-28 | Cooling device for electric heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1785988A JPH01192149A (en) | 1988-01-28 | 1988-01-28 | Cooling device for electric heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01192149A true JPH01192149A (en) | 1989-08-02 |
Family
ID=11955382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1785988A Pending JPH01192149A (en) | 1988-01-28 | 1988-01-28 | Cooling device for electric heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01192149A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0456187A (en) * | 1990-06-21 | 1992-02-24 | Mitsubishi Electric Corp | Manufacture of printed-wiring board |
| WO2008120421A1 (en) * | 2007-03-28 | 2008-10-09 | Ishizuka Electronics Corporation | Thermistor for limiting inrush current |
| US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
-
1988
- 1988-01-28 JP JP1785988A patent/JPH01192149A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0456187A (en) * | 1990-06-21 | 1992-02-24 | Mitsubishi Electric Corp | Manufacture of printed-wiring board |
| US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
| WO2008120421A1 (en) * | 2007-03-28 | 2008-10-09 | Ishizuka Electronics Corporation | Thermistor for limiting inrush current |
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