JPH01192151A - Cooling device for electric heating element - Google Patents
Cooling device for electric heating elementInfo
- Publication number
- JPH01192151A JPH01192151A JP63017861A JP1786188A JPH01192151A JP H01192151 A JPH01192151 A JP H01192151A JP 63017861 A JP63017861 A JP 63017861A JP 1786188 A JP1786188 A JP 1786188A JP H01192151 A JPH01192151 A JP H01192151A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- insulator
- heating element
- heat sink
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005485 electric heating Methods 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 title claims description 18
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000003989 dielectric material Substances 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000000615 nonconductor Substances 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 25
- 239000004020 conductor Substances 0.000 abstract description 8
- 150000002739 metals Chemical class 0.000 abstract description 7
- 239000012212 insulator Substances 0.000 abstract 6
- 238000000034 method Methods 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この宅間は例えば半導体素子等の電気発熱体がの冷却装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to a cooling device for an electric heating element such as a semiconductor element, for example.
第５図および第６図は例えば東芝レビュー（昭和５５年
１１月１日拍行）のフォートニュースに開示されてわる
この種装置の従来の構成を示すもので第５図は正面断面
図、第６図は第５図■−■線における断面図である。こ
れら各図にお＾で、（１）はサイリスタ、トランジスタ
などの半導体素子等からなる電気発熱体がＣ以下、半導
体素子と称す）、（２）は半導体素子（１）に密接して
設けられ、半導体素子（１）から余熱した熱を吸熱する
吸熱部（２ａ）とその熱を周囲空気中に放熱する放熱部
（２ｂ）とからなるヒートシンクであシ、銅、アルミニ
ウム等の熱伝導性の良す金属で構成されて＾る。ヒート
シンク（２）の放熱部（２ｂ）は吸熱部（２ａ）に対し
放射状に複数配設されている。（３）はヒートシンク（
２）の放熱部（２ｂ）の一部に＠シ付けられた端子であ
〕、半導体素子（１）の電流を外部に取ル出す。尚、ヒ
ートシンク（２）の放熱部（２ｂ）ｔ：を通常図示しな
暦冷却ファンによシ冷風が供給されて冷却される０
次に動作について説明する。半導体素子（１） Ｋよっ
て発生された熱はヒートシンク（２）の吸熱部（２ａ）
に吸熱され、放熱部（２ｂ）Ｙ＠違される。放熱部（２
ｂ）Ｖｉ冷却ファンにより冷風が供給されておシ、放熱
部（２ｂ）に伝達された半導体素子（１）の熱はその冷
風中に放熱されて効率的に冷却される。又、半導体素子
（１）の電流はヒートシンク（２）の受熱部（２ａ）、
放熱部（２Ｎ 、端子（３）を経て外部に取り出す口
〔発明が解決しようとする課題〕
しかしながら上述した従来装置では、半導体素子【１）
の電流をヒートシンク（２）を通じて外部にａｈ出すよ
うにしてお夛、ヒートシンク（２）にも電位がかかる０
従って、ヒートシンク（２）の放熱部（２ｂ）には冷風
が供給されるため導電性のゴミなどの無す清浄な冷風を
必要とする課題がある。Figures 5 and 6 show the conventional configuration of this type of device as disclosed in Fort News, Toshiba Review (published November 1, 1980), and Figure 5 is a front sectional view; FIG. 6 is a sectional view taken along the line ■-■ in FIG. In each of these figures, (1) shows an electric heating element consisting of a semiconductor element such as a thyristor or transistor (hereinafter referred to as a semiconductor element), and (2) shows an electric heating element that is provided in close proximity to the semiconductor element (1). The heat sink consists of a heat absorption part (2a) that absorbs residual heat from the semiconductor element (1) and a heat radiation part (2b) that radiates the heat into the surrounding air. Constructed of high quality metal. A plurality of heat radiating parts (2b) of the heat sink (2) are arranged radially with respect to the heat absorbing part (2a). (3) is a heat sink (
2) is a terminal attached to a part of the heat dissipation part (2b)], and takes out the current of the semiconductor element (1) to the outside. Note that the heat dissipating portion (2b) t of the heat sink (2) is normally cooled by cooling air supplied by a cooling fan (not shown).Next, the operation will be described. The heat generated by the semiconductor element (1) K is transferred to the heat absorption part (2a) of the heat sink (2).
The heat is absorbed by the heat radiating part (2b). Heat dissipation part (2
b) Cold air is supplied by the Vi cooling fan, and the heat of the semiconductor element (1) transferred to the heat radiating section (2b) is radiated into the cold air and efficiently cooled. In addition, the current of the semiconductor element (1) is transferred to the heat receiving part (2a) of the heat sink (2),
Heat dissipation part (2N), opening for taking out to the outside through terminal (3) [Problem to be solved by the invention] However, in the above-mentioned conventional device, the semiconductor element [1]
The current is outputted to the outside through the heat sink (2), and the potential is also applied to the heat sink (2).
Therefore, since cold air is supplied to the heat dissipation part (2b) of the heat sink (2), there is a problem in that clean cold air free from conductive dust and the like is required.
との発明は上記のような課題を解消するためになされた
ものであシ、ヒートシンクＩＩｃ電位が伝わらな＾電気
発熱体の冷却装置を提供するものである。The invention was made in order to solve the above-mentioned problem and provides a cooling device for an electric heating element in which the heat sink IIc potential is not transmitted.
この発明に係る電気発熱体の冷却装置は、電気発熱体と
ヒートシンクとの間に高熱伝導性電気絶縁体を配設し、
高熱伝導性電気絶縁体の両面に一体的に導体金属を配設
したものである。A cooling device for an electric heating element according to the present invention includes a highly thermally conductive electric insulator disposed between the electric heating element and the heat sink,
Conductive metal is integrally arranged on both sides of a highly thermally conductive electric insulator.
この発明における電気発熱体の冷却装置Ｔｆｉ、高熱伝
導性電気絶縁体によシミ気宅熱体の熱をヒートシンクに
伝えると共に電気余熱体の電位をヒートシンクに伝えず
電気絶縁とする。又、高熱伝導性電気絶縁体の両面に一
体的に配設した導体金属によシ接触熱抵抗を低減する。The cooling device Tfi for an electric heating element according to the present invention uses a highly thermally conductive electric insulator to transmit the heat of the stained home heating element to the heat sink, and to provide electrical insulation without transmitting the electric potential of the electric residual heating element to the heat sink. In addition, the contact thermal resistance is reduced by the conductive metal integrally disposed on both sides of the highly thermally conductive electric insulator.
以下、この発明の一実施例を第１図に基づいて説明する
０第１図は正面断面図である。第１図において、（１）
は半導体素子、（２）はヒートシンク、（２Ｉ！Ｌ）は
受熱部、 （２’ｂ）は放熱部、（４）は半導体素子
【１）とヒートシンク【２）との間に配設され、半導体
素子ｒｌ）の電流を外部に叡シ出す端子であり、導電性
金属からなる。（５）は半導体素子（１）、即ち、端子
（４）とヒートシンク（２）の受熱部（２ａ）との間に
配設された高熱伝導性電気絶縁体であり％例えばセラミ
ックペーパーに樹脂を含浸させたプリプレグシートを積
層し加熱硬化させて形成されてお９．半導体素子（１）
が発生した熱をヒートシンク（２）の受熱部（２ａ）に
伝えると共〈半導体素子（１）の電位をヒートシンク（
２）に伝えず電気絶縁するり（６ａＬ（６ｂ）は高熱伝
導性電気絶縁体（５）の両面に一体的に配設された導体
金属であシ、高熱伝導性電気絶縁体（５）の端子（４）
側の接触面並びに高熱伝導性電気絶縁体（５）のヒート
シンク（２）側の接触面に設けている。Hereinafter, one embodiment of the present invention will be described based on FIG. 1. FIG. 1 is a front sectional view. In Figure 1, (1)
is a semiconductor element, (2) is a heat sink, (2I!L) is a heat receiving part, (2'b) is a heat radiating part, (4) is arranged between the semiconductor element [1] and the heat sink [2], This is a terminal that sends the current of the semiconductor element (rl) to the outside, and is made of a conductive metal. (5) is a highly thermally conductive electric insulator disposed between the semiconductor element (1), that is, the terminal (4) and the heat receiving part (2a) of the heat sink (2). 9. It is formed by laminating impregnated prepreg sheets and curing them by heating. Semiconductor element (1)
The generated heat is transferred to the heat receiving part (2a) of the heat sink (2) and the potential of the semiconductor element (1) is transferred to the heat sink (2).
2) Electrical insulation (6aL (6b) is a conductive metal integrally arranged on both sides of the high thermal conductive electric insulator (5), Terminal (4)
and the contact surface of the highly thermally conductive electric insulator (5) on the heat sink (2) side.
次に動作につ＾て説明する０半導体素子（１）から晒生
した熱は端子（４）、導体金属（６ａ）、高熱伝導性電
気絶縁体（５）、導体金属（６ｂ）を通じてヒートシン
ク（２）の受熱部（２ａ）ＩＣ伝達される口その後の熱
伝達機能は従来のものと同様であるため説明を省略する
。又、半導体素子（１）に流れる電流は端子（４）よシ
外部へ取シ出される。そして、高熱伝導性電気絶縁体（
５）によりヒートシンク（２） ＩＩ′ｉ半導体素子（
１１、端子（４）と電気的に絶縁されており電位がかか
らな＾。The heat generated from the exposed semiconductor element (1), whose operation will be explained next, is transferred to the heat sink ( 2) The heat receiving part (2a) The heat transfer function after the IC transfer port is the same as that of the conventional one, so a description thereof will be omitted. Further, the current flowing through the semiconductor element (1) is taken out to the outside through the terminal (4). and a highly thermally conductive electrical insulator (
5) heat sink (2) II'i semiconductor element (
11. It is electrically insulated from terminal (4) and no potential is applied to it.
従って、ヒートシンク（２）の放熱部（２１））［Ｈ電
位がかからないので、導を性のゴミなどの無い冷風を必
ずしも供給しなくてもよい。Therefore, since no H potential is applied to the heat dissipating portion (21) of the heat sink (2), it is not necessary to supply cold air free of conductive dust.
尚、高熱伝導性電気絶縁体（５）と導体金属（６ａ）。In addition, a highly thermally conductive electrical insulator (5) and a conductive metal (6a).
（６１））との一体的構成は、例えばセラミックペーパ
ーに樹脂を含浸させたプリプレグシートを半硬化状態で
一方の導体金属（６ａ）に積層しさらに他方の導体金１
ｊＡ（６ｂ）を重ね合わせ、高熱伝導性電気絶縁体（５
）と導体金属（６ａ）、（６’ｂ）とを一体的ＶＣ構成
する。(61)), for example, a prepreg sheet made of ceramic paper impregnated with resin is laminated in a semi-hardened state on one conductor metal (6a), and then the other conductor metal 1
jA (6b) and high thermal conductive electrical insulator (5
) and conductive metals (6a) and (6'b) form an integral VC structure.
又、セラミックペーパーとしては１例えばアルミナ短繊
維と有機バインダーとしてミクロフィブリル化セルロー
スとを用いて成形されたアルミナペーパーとして本よく
、熱伝導性大、電気絶縁性大、防錆大、耐環境性大、耐
圧接強度大などの優れた利点を有してｂる。尚、セラミ
ックペーパーとしてアルミナペーパーに限定されるもの
ではなく類似のものも含むことは勿論のことである０又
、導体金属１ａ）、（６ｂ）に接着剤などを塗布して導
体金属（６ａ）に端子（４）、あるいけ半導体素子（１
）を含めて接合し、半導体金属（６ｂ）にヒートシンク
（２）を接合し、半導体素子（１）、端子（４）、導体
金属（６ａ ） 、 （６ｂ ）と高熱伝導性電気絶縁
体（５）との一体構成体、ヒートシンク（２）を一体構
成としたユニット化とすることにより、組立性向上、運
搬性向上等を図ることができる。父、導体金７１４ （
６ａ）、（６Ｎにより高熱伝導性電気絶縁体（５）と端
子（４）、ヒートシンク（２）との接触熱抵抗を低減す
ることができ、半導体素子〔１）から余生した熱のヒー
トシンク（２）への熱伝導性をさらに高めることができ
冷却特性もさらに向上する〇
又、第２図に示すように導体金属（６ａ）、（６Ｎの熱
通過面積を拡大して熱抵抗をさらに低減するようにして
もよい。さらに第３図、第４図にそれぞれ示すように導
体金属（６ａ）、（６Ｎの寸法を高熱伝導性電気絶縁体
（５）よシ小さくして沿面距離を長くすることも可能で
ある。Ceramic paper can be used, for example, as alumina paper formed using alumina short fibers and microfibrillated cellulose as an organic binder, and has high thermal conductivity, high electrical insulation, high rust prevention, and high environmental resistance. It has excellent advantages such as high pressure resistance and high welding strength. It goes without saying that the ceramic paper is not limited to alumina paper, but also includes similar materials.Also, conductor metals 1a) and (6b) can be coated with adhesive or the like to form conductor metals (6a). Terminal (4), semiconductor element (1)
), the heat sink (2) is joined to the semiconductor metal (6b), the semiconductor element (1), the terminal (4), the conductive metal (6a), (6b) and the highly thermally conductive electric insulator (5). ) and the heat sink (2) into a unit, it is possible to improve assembly and transportability. Father, conductor gold 714 (
6a), (6N can reduce the contact thermal resistance between the highly thermally conductive electric insulator (5), the terminal (4), and the heat sink (2), and the residual heat from the semiconductor element [1) can be transferred to the heat sink (2). ), which further improves the cooling properties.Also, as shown in Figure 2, the heat passing area of the conductor metal (6a) (6N) is expanded to further reduce the thermal resistance. Further, as shown in FIGS. 3 and 4, the dimensions of the conductive metal (6a) and (6N) may be made smaller than those of the highly thermally conductive electric insulator (5) to increase the creepage distance. is also possible.
又、！気発熱体としては半導体素子に限らず各種電子部
品、素子などに適用し得るものである。or,! The gas heating element is applicable not only to semiconductor devices but also to various electronic parts and devices.
この発明は以上説明した通＃）、電気発熱体とヒートシ
ンクとの間に配設した高熱伝導性電気絶縁体と、この高
熱伝導性電気絶縁体の両面に一体的に導体金属を設けた
ことにより、電気発熱体の熱をヒートシンクに伝えると
共に電気発熱体の電位をヒートシンクに伝えず電気絶縁
するようにしたので、経済的な冷却装置を得ることがで
きる。又、接触熱抵抗の低減も図ｒＬ、冷却特注が向上
する０This invention is based on the above-mentioned feature that a highly thermally conductive electrical insulator is provided between an electric heating element and a heat sink, and a conductive metal is integrally provided on both sides of this highly thermally conductive electrical insulator. Since the heat of the electric heating element is transferred to the heat sink and the electric potential of the electric heating element is not transferred to the heat sink and is electrically insulated, an economical cooling device can be obtained. In addition, contact thermal resistance is reduced, and cooling customization is improved.
第１図はこの発明の一実施例による電気発熱体の冷却装
置を示す正面断面図、第２図、第３図。
第４図はそれぞれこの発明の他の実施例による電気発熱
体の冷却装置を示す正面図％＠５図は従来の電気発熱体
の冷却装置を示す正面断面図％第６図は第５図Ｍ−ｗ線
における断面図である。
図にお＾で％（１）は電気発熱体、（２）はヒートシン
ク、 （２ａ）は受熱部、（２ｂ）ｔｆ放熱部、（５
）は高熱伝導性電気絶縁体、（６ａ）、（６ｂ）は導体
金属である。
尚１図中同一符号は同−又は相当部分を示す。FIG. 1 is a front sectional view, FIG. 2, and FIG. 3 showing a cooling device for an electric heating element according to an embodiment of the present invention. Figure 4 is a front view showing a cooling device for an electric heating element according to another embodiment of the present invention % @ Figure 5 is a front sectional view showing a conventional cooling device for an electric heating element % Figure 6 is Figure 5M It is a sectional view taken along the -w line. In the figure, % (1) is the electric heating element, (2) is the heat sink, (2a) is the heat receiving part, (2b) tf heat dissipation part, (5
) is a highly thermally conductive electrical insulator, and (6a) and (6b) are conductive metals. Note that the same reference numerals in Figure 1 indicate the same or equivalent parts.
Claims (4)
した熱を吸熱する吸熱部とその熱を放熱する放熱部とか
らなるヒートシンクと、上記ヒートシンクと上記電気発
熱体との間に配設された高熱伝導性電気絶縁体と、上記
高熱伝導性電気絶縁体の両面に一体的に配設された導体
金属とを備えたことを特徴とする電気発熱体の冷却装置
。(1) A heat sink to which an electric heating element is attached and comprising a heat absorption part that absorbs heat generated from the electric heating element and a heat radiation part that radiates the heat, and a heat sink that is disposed between the heat sink and the electric heating element. 1. A cooling device for an electric heating element, comprising: a highly thermally conductive electrical insulator; and a conductive metal integrally disposed on both surfaces of the highly thermally conductive electrical insulator.
，ヒートシンクを一体的に構成しユニツト化したことを
特徴とする特許請求の範囲第１項記載の電気発熱体の冷
却装置。(2) A cooling device for an electric heating element according to claim 1, characterized in that the electric heating element, a conductive metal, a highly thermally conductive electric insulator, and a heat sink are integrally formed into a unit.
樹脂を含浸させたプリプレグシートを積層し加熱硬化さ
せて形成されたことを特徴とする特許請求の範囲第１項
又は第２項記載の電気発熱体の冷却装置。(3) Electric heat generation according to claim 1 or 2, characterized in that the highly thermally conductive electric insulator is formed by laminating prepreg sheets in which ceramic paper is impregnated with resin and curing them by heating. Body cooling device.
ることを特徴とする特許請求の範囲第３項に記載の電気
発熱体の冷却装置。(4) The cooling device for an electric heating element according to claim 3, wherein the ceramic paper is made of alumina paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63017861A JPH01192151A (en) | 1988-01-28 | 1988-01-28 | Cooling device for electric heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63017861A JPH01192151A (en) | 1988-01-28 | 1988-01-28 | Cooling device for electric heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01192151A true JPH01192151A (en) | 1989-08-02 |
Family
ID=11955440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63017861A Pending JPH01192151A (en) | 1988-01-28 | 1988-01-28 | Cooling device for electric heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01192151A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008120421A1 (en) * | 2007-03-28 | 2008-10-09 | Ishizuka Electronics Corporation | Thermistor for limiting inrush current |
| US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
| WO2014094395A1 (en) * | 2012-12-18 | 2014-06-26 | 武汉光迅科技股份有限公司 | Heat control device for power equipment |
-
1988
- 1988-01-28 JP JP63017861A patent/JPH01192151A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
| WO2008120421A1 (en) * | 2007-03-28 | 2008-10-09 | Ishizuka Electronics Corporation | Thermistor for limiting inrush current |
| WO2014094395A1 (en) * | 2012-12-18 | 2014-06-26 | 武汉光迅科技股份有限公司 | Heat control device for power equipment |
| US10149410B2 (en) | 2012-12-18 | 2018-12-04 | Accelink Technologies Co., Ltd. | Heat control device for power equipment |
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