GB0809270D0 - Printed circuit board with co-planar plate - Google Patents

Printed circuit board with co-planar plate

Info

Publication number
GB0809270D0
GB0809270D0 GB0809270A GB0809270A GB0809270D0 GB 0809270 D0 GB0809270 D0 GB 0809270D0 GB 0809270 A GB0809270 A GB 0809270A GB 0809270 A GB0809270 A GB 0809270A GB 0809270 D0 GB0809270 D0 GB 0809270D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
planar plate
planar
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0809270A
Other versions
GB2460124A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRU LON PRINTED CIRCUITS ROYST
Nujira Ltd
Original Assignee
TRU LON PRINTED CIRCUITS ROYST
Nujira Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRU LON PRINTED CIRCUITS ROYST, Nujira Ltd filed Critical TRU LON PRINTED CIRCUITS ROYST
Priority to GB0809270A priority Critical patent/GB2460124A/en
Publication of GB0809270D0 publication Critical patent/GB0809270D0/en
Priority to PCT/EP2009/056199 priority patent/WO2009141413A1/en
Publication of GB2460124A publication Critical patent/GB2460124A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
GB0809270A 2008-05-21 2008-05-21 Printed circuit board with co-planar plate Withdrawn GB2460124A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0809270A GB2460124A (en) 2008-05-21 2008-05-21 Printed circuit board with co-planar plate
PCT/EP2009/056199 WO2009141413A1 (en) 2008-05-21 2009-05-21 Printed circuit board with co-planar plate and method of manufacturing therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0809270A GB2460124A (en) 2008-05-21 2008-05-21 Printed circuit board with co-planar plate

Publications (2)

Publication Number Publication Date
GB0809270D0 true GB0809270D0 (en) 2008-06-25
GB2460124A GB2460124A (en) 2009-11-25

Family

ID=39596293

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0809270A Withdrawn GB2460124A (en) 2008-05-21 2008-05-21 Printed circuit board with co-planar plate

Country Status (2)

Country Link
GB (1) GB2460124A (en)
WO (1) WO2009141413A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8797103B2 (en) 2010-12-07 2014-08-05 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8587377B2 (en) 2010-12-13 2013-11-19 Skyworks Solutions, Inc. Apparatus and methods for biasing a power amplifier
US8598950B2 (en) 2010-12-14 2013-12-03 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
WO2012083256A2 (en) 2010-12-17 2012-06-21 Skyworks Solutions, Inc. Apparatus and methods for oscillation suppression
FR2969899B1 (en) * 2010-12-23 2012-12-21 Valeo Sys Controle Moteur Sas PRINTED CIRCUIT WITH INSULATED METAL SUBSTRATE
EP2673881B1 (en) 2011-02-07 2019-02-06 Skyworks Solutions, Inc. Apparatus and methods for envelope tracking calibration
WO2012125657A2 (en) 2011-03-15 2012-09-20 Skyworks Solutions, Inc. Apparatus and methods for capacitive load reduction
US8718188B2 (en) 2011-04-25 2014-05-06 Skyworks Solutions, Inc. Apparatus and methods for envelope tracking
KR101738730B1 (en) 2013-04-23 2017-05-22 스카이워크스 솔루션즈, 인코포레이티드 Apparatus and methods for envelope shaping in power amplifier systems
US9445371B2 (en) 2014-08-13 2016-09-13 Skyworks Solutions, Inc. Apparatus and methods for wideband envelope tracking systems
US9602056B2 (en) 2014-09-19 2017-03-21 Skyworks Solutions, Inc. Amplifier with base current reuse
CN104918424B (en) * 2015-07-03 2018-01-12 深圳市迅捷兴科技股份有限公司 Circuit board size antihunt means with different-thickness core plate
US10103693B2 (en) 2015-09-30 2018-10-16 Skyworks Solutions, Inc. Power amplifier linearization system and method
US10110169B2 (en) 2016-09-14 2018-10-23 Skyworks Solutions, Inc. Apparatus and methods for envelope tracking systems with automatic mode selection
EP3310140B1 (en) * 2016-10-14 2021-07-14 Vitesco Technologies GmbH Mounting assembly with a heatsink
US10236831B2 (en) 2017-05-12 2019-03-19 Skyworks Solutions, Inc. Envelope trackers providing compensation for power amplifier output load variation
US10516368B2 (en) 2017-06-21 2019-12-24 Skyworks Solutions, Inc. Fast envelope tracking systems for power amplifiers
US10615757B2 (en) 2017-06-21 2020-04-07 Skyworks Solutions, Inc. Wide bandwidth envelope trackers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413016A1 (en) * 1977-12-26 1979-07-20 Radiotechnique Compelec Multilayer printed circuits with heat dissipation collector - has thermal drain attached to semiconductor substrate pressed into hole in collector plate
DE4220966C2 (en) * 1992-06-25 1995-12-21 Siemens Ag Method for producing a carrier plate for electrical components
DE19601649A1 (en) * 1996-01-18 1997-07-24 Telefunken Microelectron Electronic component heat extracting apparatus for e.g. electronics of motor vehicle
SE9702593D0 (en) * 1997-07-04 1997-07-04 Electrolux Ab Device on a circuit board
DE19919781A1 (en) * 1999-04-30 2000-11-09 Wuerth Elektronik Gmbh Printed circuit board and method of mounting it
EP1480269A1 (en) * 2003-05-13 2004-11-24 Agilent Technologies Inc Printed Circuit Board with improved cooling of electrical component
DE102005014605A1 (en) * 2005-03-31 2006-10-05 Conti Temic Microelectronic Gmbh Printed circuit board assembly

Also Published As

Publication number Publication date
GB2460124A (en) 2009-11-25
WO2009141413A1 (en) 2009-11-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)