CN117580260A - Connecting process of PCB radiating fins - Google Patents

Connecting process of PCB radiating fins Download PDF

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Publication number
CN117580260A
CN117580260A CN202311682679.2A CN202311682679A CN117580260A CN 117580260 A CN117580260 A CN 117580260A CN 202311682679 A CN202311682679 A CN 202311682679A CN 117580260 A CN117580260 A CN 117580260A
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CN
China
Prior art keywords
pcb
heat sink
adhesive
radiating fin
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311682679.2A
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Chinese (zh)
Inventor
李鸿辉
曹振兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kalex MultiLayer Circuit Board Zhongshan Ltd
Original Assignee
Kalex MultiLayer Circuit Board Zhongshan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kalex MultiLayer Circuit Board Zhongshan Ltd filed Critical Kalex MultiLayer Circuit Board Zhongshan Ltd
Priority to CN202311682679.2A priority Critical patent/CN117580260A/en
Publication of CN117580260A publication Critical patent/CN117580260A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application relates to a PCB circuit board with radiating fins and a manufacturing method thereof. During manufacturing, the heat sink is covered with an adhesive, which is not tacky. Then, the binder is cured by light, and the binder forms a semi-cured state and has viscosity after light irradiation. And in the state that the adhesive is semi-cured, arranging one side of the radiating fin with the adhesive opposite to the surface of the PCB, and then pressing the PCB and the radiating fin to form the PCB with the radiating fin. Because the radiating fin is pressed with the PCB under the semi-solidification state of the binder, the radiating fin and the PCB are tightly pressed, and a gap is not generated in the pressing process, so that the phenomenon of board explosion is avoided, and the reliability of connection between the radiating fin and the PCB and the heat dissipation performance of the PCB are improved.

Description

Connecting process of PCB radiating fins
Technical Field
The application relates to the technical field of PCB circuit board production, in particular to a PCB circuit board and a connection method of the PCB circuit board and a radiating fin.
Background
With the rapid development of electronic industry and communication technology, the power of each electronic component in the electronic product is continuously increased, but the electronic product is more refined and miniaturized, so that the heat dissipation problem of the electronic product becomes a great problem.
PCB (PrintedCircuitBoard) the circuit board is one of the main devices of electronic products, can guarantee that electronic products stably and reliably operate. In order to solve the heat dissipation problem of the PCB, the common practice is to arrange adhesive tape on the heat sink, then remove the protective layer of the adhesive tape, and finally press the heat sink and the PCB. However, in the lamination process, gaps are easily generated between the adhesive tape and the PCB, and the phenomenon of board explosion is easily caused.
Disclosure of Invention
Based on this, it is necessary to provide a PCB and a method for connecting the PCB and the heat sink, so as to avoid the board explosion.
A method for manufacturing a PCB with a heat sink comprises the following steps:
covering the heat sink with an adhesive;
light curing the adhesive to render the adhesive semi-cured and tacky;
arranging one side of the radiating fin with the adhesive opposite to the board surface of the PCB;
and pressing the radiating fin and the PCB.
In the method for manufacturing the PCB with the radiating fins, the radiating fins are covered with the adhesive, and the adhesive is not sticky. Then, the binder is cured by light, and the binder forms a semi-cured state and has viscosity after light irradiation. And in the state that the adhesive is semi-cured, arranging one side of the radiating fin with the adhesive opposite to the surface of the PCB, and then pressing the PCB and the radiating fin to form the PCB with the radiating fin. Because the radiating fin is pressed with the PCB under the semi-solidification state of the binder, the radiating fin and the PCB are tightly pressed, and a gap is not generated in the pressing process, so that the phenomenon of board explosion is avoided, and the reliability of connection between the radiating fin and the PCB and the heat dissipation performance of the PCB are improved.
In one embodiment, the adhesive is a photosensitive adhesive; and in the step of photo-curing the adhesive to enable the adhesive to be in a semi-cured state and to be sticky, ultraviolet light is adopted for photo-curing the photosensitive adhesive.
In one embodiment, in the step of curing the photosensitive adhesive by irradiation with ultraviolet light, the wavelength of the ultraviolet light is 365mm, and the irradiation intensity of the ultraviolet light is 500Mw/cm 2 The illumination time of the ultraviolet light is 9 s-11 s.
In one embodiment, in the step of pressing the heat sink and the PCB, the pressing pressure is 115N/cm 2 ～125N/cm 2 The pressing time is 18 s-22 s; after the step of pressing the radiating fin and the PCB, the method further comprises the steps of: and horizontally standing the cooling fin and the PCB.
In one embodiment, the PCB is provided with a bonding area and an overflow area, the bonding area and the overflow area are both positioned on the same board surface of the PCB, the bonding area is arranged in the middle of the PCB, the overflow area surrounds the bonding area, and the overflow area is used for preventing the adhesive from flowing out of the board surface of the PCB.
In one embodiment, the step of pressing the heat sink and the PCB includes the steps of:
aligning the radiating fin and the PCB;
detecting the alignment condition of the radiating fin and the PCB by adopting an alignment detection device, and judging whether offset exists between the radiating fin and the PCB;
and if no offset exists between the radiating fin and the PCB, pressing the radiating fin and the PCB.
In one embodiment, the alignment detection device detects the alignment condition of the heat sink and the PCB, and in the step of determining whether there is an offset between the heat sink and the PCB, if there is an offset between the heat sink and the PCB, the PCB is controlled to move by a corresponding offset amount until the PCB and the heat sink are completely aligned.
In one embodiment, the heat sink has a size less than or equal to the size of the PCB circuit board.
The PCB circuit board with the cooling fin is manufactured by adopting the manufacturing method of the PCB circuit board with the cooling fin, and the PCB circuit board with the cooling fin comprises the following components:
a PCB circuit board; the method comprises the steps of,
and the radiating fin is covered with an adhesive layer, and one side of the radiating fin with the adhesive layer is correspondingly adhered to the surface of the PCB.
When the PCB with the radiating fins is manufactured, the radiating fins are covered with the adhesive, and the adhesive is not sticky. Then, the binder is cured by light, and the binder forms a semi-cured state and has viscosity after light irradiation. And in the state that the adhesive is semi-cured, arranging one side of the radiating fin with the adhesive opposite to the surface of the PCB, and then pressing the PCB and the radiating fin to form the PCB with the radiating fin. Because the radiating fin is pressed with the PCB under the semi-solidification state of the binder, the radiating fin and the PCB are tightly pressed, and a gap is not generated in the pressing process, so that the phenomenon of board explosion is avoided, and the reliability of connection between the radiating fin and the PCB and the heat dissipation performance of the PCB are improved.
In one embodiment, the adhesive layer is a photosensitive adhesive layer.
Drawings
Fig. 1 is an exploded view of a PCB with heat sink according to an embodiment of the present application.
Fig. 2 is a top view of the PCB circuit board shown in fig. 1.
Fig. 3 is a flowchart of a method for manufacturing a PCB with a heat sink according to an embodiment of the present application.
Reference numerals illustrate:
10. a heat sink; 20. a PCB circuit board; 21. a bonding region; 22. an overflow area; 30. and (3) a binder.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
Referring to fig. 1 and 3, fig. 1 is a structural exploded view of a PCB with a heat sink according to an embodiment of the present application, and fig. 3 is a flowchart illustrating a method for manufacturing a PCB with a heat sink according to an embodiment of the present application. The method for manufacturing the PCB 20 with the heat sink 10 according to an embodiment of the present application includes the following steps:
s100, the heat sink 10 is covered with the adhesive 30.
Alternatively, the heat sink 10 is an aluminum heat sink, a copper heat sink, or other metal heat sink with heat dissipation function.
There are various methods for coating the heat sink 10 with the adhesive 30, for example, a screen printer is used to print the adhesive 30 on the heat sink 10. Of course, in other embodiments, the adhesive 30 may be coated on the heat sink 10 by painting, which is not limited thereto.
S200, light curing the adhesive 30 to enable the adhesive 30 to be in a semi-cured state and to be sticky.
The adhesive 30 was not tacky before being cured by light, and the adhesive 30 was tacky after being cured by light.
And S300, arranging one side of the radiating fin 10 with the adhesive 30 opposite to the surface of the PCB 20.
And S400, pressing the radiating fin 10 and the PCB 20.
In the above method for manufacturing the PCB 20 with the heat sink 10, the adhesive 30 is coated on the heat sink 10, and the adhesive 30 is not tacky. Then, the adhesive 30 is cured by light, and the adhesive 30 is cured in a semi-cured state and has tackiness after light irradiation. In a state where the adhesive 30 is semi-cured, a side of the heat sink 10 having the adhesive 30 is disposed opposite to the board surface of the PCB 20, and then the PCB 20 and the heat sink 10 are pressed together to form the PCB 20 with the heat sink 10. Because the radiating fin 10 is pressed with the PCB 20 in the semi-solidified state of the adhesive 30, the radiating fin 10 is tightly pressed with the PCB 20, and a gap is not generated in the pressing process, so that the phenomenon of board explosion is avoided, and the reliability of connection between the radiating fin 10 and the PCB 20 and the heat dissipation performance of the PCB 20 are improved.
In one embodiment, the PCB 20 with the heat sink 10 is manufactured in a predetermined working environment, for example, a working environment having a temperature of 20-30 ℃ and a dust content (particles having a diameter greater than 1.0 μm) of less than 100K. Thus, the PCB 20 with the heat sink 10 is manufactured in the above environment, which is beneficial to improving the production quality of the PCB 20 with the heat sink 10.
In one embodiment, the adhesive 30 is a photosensitive adhesive. Further, in step S200, the photosensitive adhesive 30 is cured by ultraviolet irradiation.
The photosensitive adhesive 30 was not tacky before being irradiated with ultraviolet light, but was fluid. The photosensitive adhesive 30 forms a semi-cured state on the heat sink 10 after being irradiated with ultraviolet light and has viscosity, and the photosensitive adhesive 30 can last for a period of time. When the photosensitive adhesive 30 is in a semi-cured state, the heat sink 10 and the PCB 20 are pressed tightly, so that the heat sink 10 and the PCB 20 are pressed tightly, no gap is generated in the pressing process, the explosion of the PCB is avoided, and the reliability of the connection between the heat sink 10 and the PCB 20 and the heat dissipation performance of the PCB 20 are improved.
Further, the wavelength of the ultraviolet light was 365mm, and the illumination intensity of the ultraviolet light was 500Mw/cm 2 The illumination time of the ultraviolet light is 9 s-11 s. With a wavelength of 365mm and an illumination intensity of 500Mw/cm 2 After the light-sensitive adhesive 30 is irradiated with ultraviolet light for 9 to 11 seconds, the light-sensitive adhesiveThe agent 30 is changed from a state of non-tackiness and having a certain fluidity to a state of tackiness and semi-curing so that the heat sink 10 and the PCB 20 are bonded into a whole after being pressed together.
In one embodiment, in step S400, the pressing pressure is 115N/cm 2 ～125N/cm 2 The pressing time is 18 s-22 s. By the arrangement, the radiating fins 10 and the PCB 20 can be better pressed, the firmness of connection between the radiating fins 10 and the PCB 20 is guaranteed, and meanwhile, the phenomenon that the PCB 20 is damaged and the photosensitive adhesive 30 overflows to generate a dirty plate due to overlarge pressure and overlong pressing time can be avoided.
In one embodiment, after step S400, the method for manufacturing the PCB circuit board 20 with the heat sink 10 further includes:
and S500, horizontally standing the cooling fin 10 and the PCB 20.
After the cooling fin 10 and the PCB 20 are pressed, the cooling fin 10 and the PCB 20 are horizontally placed, so that the cooling fin 10 and the PCB 20 are better bonded, and the connection firmness between the cooling fin 10 and the PCB 20 is ensured.
In one embodiment, referring to fig. 2, a pcb 20 is provided with an adhesive area 21 and an overflow area 22. The bonding area 21 and the overflow area 22 are both located on the same board surface of the PCB 20, the bonding area 21 is located in the middle of the PCB 20, the overflow area 22 is located around the bonding area 21, and the overflow area 22 is used for preventing the adhesive 30 from flowing out of the board surface of the PCB 20. In manufacturing, the portion of the heat sink 10 having the adhesive 30 corresponds to the bonding area 21 of the PCB 20, so that the adhesive 30 of the heat sink 10 is pressed onto the bonding area 21 of the PCB 20. Since the overflow area 22 is arranged at the periphery of the bonding area 21, the overflow area 22 can prevent the adhesive 30 from diffusing outwards from the bonding area 21, and avoid the phenomenon that the adhesive 30 flows out of the board surface of the PCB 20 to cause the board pollution.
It should be noted that the shape and the size of the bonding area 21 and the overflow area 22 may be set according to actual requirements, and are not particularly limited herein. For example, in the present embodiment, referring to fig. 2, the bonding area 21 is square, and the square bonding area 21 is located in the middle of the PCB 20; the overflow area 22 is also square, and the square overflow area 22 is arranged around the square bonding area 21.
Alternatively, the overflow region 22 may be an overflow trough, which is disposed around the periphery of the bonding region 21. Alternatively, the overflow area 22 is a flow blocking protrusion, which is arranged around the periphery of the bonding area 21.
In one embodiment, the heat sink 10 is smaller in size than the PCB 20. Since the size of the heat sink 10 is smaller than that of the PCB 20, the PCB 20 is not completely shielded by the heat sink 10, and the cooling air flow can directly act on the PCB 20 to dissipate heat of the PCB 20. In addition, the heat of the PCB 20 can be transferred to the heat sink 10, and the heat of the PCB 20 is dissipated through the heat sink 10. Thus, the PCB circuit board is favorable for better heat dissipation.
Of course, in other embodiments, the size of the heat sink 10 may be equal to the size of the PCB 20. Thus, the heat sink 10 completely covers the surface of the PCB 20, and the heat of the PCB 20 can be directly transferred to the heat sink 10, so that the heat sink 10 dissipates the heat of the PCB 20.
In one embodiment, the heat sink 10 and the PCB circuit board 20 are mounted using an automated mounting apparatus. Therefore, the automatic mounting equipment is adopted to replace manual mounting of the radiating fins 10 and the PCB 20, so that on one hand, the labor intensity of operators can be reduced, and on the other hand, accurate lamination can be realized, and the lamination quality is improved.
Further, in step S400, the steps include:
s410, aligning the heat sink 10 and the PCB 20.
Specifically, the automatic mounting device includes a mechanical arm, and the mechanical arm grabs the PCB 20 to align the PCB 20 with the heat sink 10.
S420, detecting the alignment condition of the radiating fin 10 and the PCB 20 by adopting an alignment detection device, and judging whether offset exists between the radiating fin 10 and the PCB 20.
Optionally, the alignment detection device is a CCD vision alignment device. The automatic mounting device has a mounting area, the heat sink 10 after step S200 is located in the mounting area, and the mechanical arm grabs the PCB 20 to the mounting area. Because the PCB 20 is provided with the positioning reference part, the CCD visual alignment device collects the image of the PCB 20 in the mounting area, and the offset of the cooling fin 10 and the PCB 20 in the XY direction is calculated through the positioning reference part.
S430, if no offset exists between the heat sink 10 and the PCB 20, the heat sink 10 and the PCB 20 are pressed together.
It should be noted that, if the offset of the heat sink 10 and the PCB 20 in the XY direction is 0, the automatic mounting device presses the heat sink 10 and the PCB 20.
Therefore, after the heat sink 10 and the PCB 20 are aligned, the heat sink 10 and the PCB 20 are pressed together, so that the accuracy of the heat sink 10 for pressing the PCB 20 is improved, and the production quality of the PCB 20 with the heat sink 10 is ensured.
Further, S440, if there is an offset between the heat sink 10 and the PCB 20, the PCB 20 is controlled to move by a corresponding offset amount until the PCB 20 and the heat sink 10 are completely aligned.
Specifically, if there is an offset between the heat sink 10 and the PCB 20, the controller of the automatic mounting apparatus controls the mechanical arm to move by a corresponding offset amount until the PCB 20 and the heat sink 10 are completely aligned.
It should be noted that the automatic mounting apparatus has an automatic compensation X, Y, Z, T axis BA angular positioning coordinate value.
Referring to fig. 1 and 2, the PCB 20 with the heat sink 10 according to an embodiment of the present application is manufactured by the method for manufacturing the PCB 20 with the heat sink 10 according to any one of the embodiments. The PCB 20 with the heat sink 10 comprises the PCB 20 and the heat sink 10, wherein the heat sink 10 is covered with an adhesive layer, and one side of the heat sink 10 with the adhesive layer is correspondingly adhered to the surface of the PCB 20.
In the above-described PCB 20, the adhesive 30 is coated on the heat sink 10 during manufacturing, and the adhesive 30 is not tacky. Then, the adhesive 30 is cured by light, and the adhesive 30 is cured in a semi-cured state and has tackiness after light irradiation. In a state where the adhesive 30 is semi-cured, a side of the heat sink 10 having the adhesive 30 is disposed opposite to the board surface of the PCB 20, and then the PCB 20 and the heat sink 10 are pressed together to form the PCB 20 with the heat sink 10. Because the radiating fin 10 is pressed with the PCB 20 in the semi-solidified state of the adhesive 30, the radiating fin 10 is tightly pressed with the PCB 20, and a gap is not generated in the pressing process, so that the phenomenon of board explosion is avoided, and the reliability of connection between the radiating fin 10 and the PCB 20 and the heat dissipation performance of the PCB 20 are improved.
In one embodiment, the adhesive layer is a photosensitive adhesive layer.
The photosensitive adhesive 30 was not tacky before being irradiated with ultraviolet light, but was fluid. The photosensitive adhesive 30 forms a semi-cured state on the heat sink 10 after being irradiated with ultraviolet light and has viscosity, and the photosensitive adhesive 30 can last for a period of time. When the photosensitive adhesive 30 is in a semi-cured state, the heat sink 10 and the PCB 20 are pressed tightly, so that the heat sink 10 and the PCB 20 are pressed tightly, no gap is generated in the pressing process, the explosion of the PCB is avoided, and the reliability of the connection between the heat sink 10 and the PCB 20 and the heat dissipation performance of the PCB 20 are improved.
The PCB 20 with the heat sink 10 manufactured by any of the above embodiments is tested by using the PCB 20 with the heat sink 10, specifically as follows:
1) Ultrasonic bubble inspection
10 PCB circuit boards with cooling fins 10 are selected, and a German PVA ultrasonic scanning microscope is adopted to scan each PCB circuit board with cooling fins 10, and the resolution is set to 20um.
2) Electrical performance test
And 10 PCB circuit boards with cooling fins 10 are selected for electrical performance test, wherein the resistance isolation test is more than or equal to 10MΩ, and the voltage test is more than or equal to 250V.
3) Tensile Strength test
10 PCB circuit boards with cooling fins 10 are selected for tensile strength test, and each PCB circuit board with cooling fins 10 meets the requirement of more than 20N/cm 2 。
In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.
In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. A method for manufacturing a PCB with a radiating fin is characterized by comprising the following steps:
covering the heat sink with an adhesive;
light curing the adhesive to render the adhesive semi-cured and tacky;
arranging one side of the radiating fin with the adhesive opposite to the board surface of the PCB;
and pressing the radiating fin and the PCB.
2. The method of manufacturing a finned PCB of claim 1 wherein the adhesive is a photosensitive adhesive;
and in the step of photo-curing the adhesive to enable the adhesive to be in a semi-cured state and to be sticky, ultraviolet light is adopted for photo-curing the photosensitive adhesive.
3. The method of manufacturing a printed circuit board with heat sink according to claim 2, wherein in the step of curing the photosensitive adhesive by ultraviolet light irradiation, the wavelength of the ultraviolet light is 365mm, and the irradiation intensity of the ultraviolet light is 500Mw/cm 2 The illumination time of the ultraviolet light is 9 s-11 s.
4. The method of manufacturing a printed circuit board with heat sink as claimed in claim 1, wherein in said step of bonding said heat sink and said printed circuit board, bonding pressure is 115N/cm 2 ～125N/cm 2 The pressing time is 18 s-22 s;
after the step of pressing the radiating fin and the PCB, the method further comprises the steps of:
and horizontally standing the cooling fin and the PCB.
5. The method for manufacturing a Printed Circuit Board (PCB) with cooling fins according to claim 1, wherein the PCB is provided with a bonding area and an overflow area, the bonding area and the overflow area are both positioned on the same board surface of the PCB, the bonding area is arranged in the middle of the PCB, the overflow area is arranged around the bonding area, and the overflow area is used for preventing the adhesive from flowing out of the board surface of the PCB.
6. The method for manufacturing a PCB with a heat sink according to claim 1, wherein the step of pressing the heat sink and the PCB comprises the steps of:
aligning the radiating fin and the PCB;
detecting the alignment condition of the radiating fin and the PCB by adopting an alignment detection device, and judging whether offset exists between the radiating fin and the PCB;
and if no offset exists between the radiating fin and the PCB, pressing the radiating fin and the PCB.
7. The method according to claim 6, wherein the step of detecting the alignment of the heat sink and the PCB by using an alignment detection device, and determining whether there is an offset between the heat sink and the PCB, if there is an offset between the heat sink and the PCB, controls the PCB to move by a corresponding offset amount until the PCB and the heat sink are completely aligned.
8. The method of manufacturing a finned PCB circuit board according to any one of claims 1 to 7, wherein the size of the heat sink is smaller than or equal to the size of the PCB circuit board.
9. A finned PCB circuit board manufactured by the method for manufacturing a finned PCB circuit board according to any one of claims 1 to 8, comprising:
a PCB circuit board; the method comprises the steps of,
and the radiating fin is covered with an adhesive layer, and one side of the radiating fin with the adhesive layer is correspondingly adhered to the surface of the PCB.
10. The PCB of claim 9, wherein the adhesive layer is a photosensitive adhesive layer.
CN202311682679.2A 2023-12-08 2023-12-08 Connecting process of PCB radiating fins Pending CN117580260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311682679.2A CN117580260A (en) 2023-12-08 2023-12-08 Connecting process of PCB radiating fins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311682679.2A CN117580260A (en) 2023-12-08 2023-12-08 Connecting process of PCB radiating fins

Publications (1)

Publication Number Publication Date
CN117580260A true CN117580260A (en) 2024-02-20

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CN202311682679.2A Pending CN117580260A (en) 2023-12-08 2023-12-08 Connecting process of PCB radiating fins

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050057906A1 (en) * 2003-09-12 2005-03-17 Seiichi Nakatani Connector sheet and wiring board, and production processes of the same
CN101313636A (en) * 2005-11-21 2008-11-26 松下电器产业株式会社 Method of manufacturing circuit board having electronic part
CN201270625Y (en) * 2008-11-04 2009-07-08 美锐电路(惠州)有限公司 Printed circuit board and adhering structure for heat radiation fin
CN101652027A (en) * 2009-09-07 2010-02-17 皆利士多层线路版(中山)有限公司 Making process of circuit board with radiation fins
CN103429000A (en) * 2012-10-10 2013-12-04 常州市超顺电子技术有限公司 Method for preparing radiator-based copper foil-clad printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050057906A1 (en) * 2003-09-12 2005-03-17 Seiichi Nakatani Connector sheet and wiring board, and production processes of the same
CN101313636A (en) * 2005-11-21 2008-11-26 松下电器产业株式会社 Method of manufacturing circuit board having electronic part
CN201270625Y (en) * 2008-11-04 2009-07-08 美锐电路(惠州)有限公司 Printed circuit board and adhering structure for heat radiation fin
CN101652027A (en) * 2009-09-07 2010-02-17 皆利士多层线路版(中山)有限公司 Making process of circuit board with radiation fins
CN103429000A (en) * 2012-10-10 2013-12-04 常州市超顺电子技术有限公司 Method for preparing radiator-based copper foil-clad printed circuit board

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