CN104853519A - Flexible conducting circuit and manufacturing method thereof - Google Patents
Flexible conducting circuit and manufacturing method thereof Download PDFInfo
- Publication number
- CN104853519A CN104853519A CN201510273157.6A CN201510273157A CN104853519A CN 104853519 A CN104853519 A CN 104853519A CN 201510273157 A CN201510273157 A CN 201510273157A CN 104853519 A CN104853519 A CN 104853519A
- Authority
- CN
- China
- Prior art keywords
- graphite film
- film
- conductive circuit
- preparation
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a flexible conducting circuit and a manufacturing method thereof. A graphite film is used as a conductive material in the conducting circuit. The method comprises: firstly, combining a conducting graphite film (1), double faced adhesive tapes (2), and insulating films (3), and then according to a designed circuit diagram, and using a die cutting proofing machine to perform die cutting on the combined film, so as to form a flexible conducting circuit. The flexible conducting circuit makes use of excellent conductive performance, excellent flexibility and bending performance of the graphite film. The graphite film is used in the flexible conducting circuit, and can greatly reduce volume and weight of an electronic product, so that the electronic product develops toward a high density, miniaturization, and high reliability direction.
Description
Technical field
The present invention relates to a kind of compliant conductive circuit and preparation method thereof.
Background technology
The present invention is mainly used in the connecting portion of electronic product, such as flex cable, liquid crystal module etc., compares PCB hardboard, and its volume is less, and weight is lighter, can realize bending flexure, the advantages such as stereoscopic three-dimensional assembling.
Flexible circuit is the conducting channel made with flexible insulating substrate.Flexible circuit provides excellent electrical property, can meet design needs that are more small-sized and more high-density installation, also contributes to reducing assembling procedure and strengthening reliability.Along with miniaturization of electronic products and lightening development, flexible PCB is the only solution meeting miniaturization of electronic products and movement requirement.Can free bend, winding, folding, the dynamic bending of millions of times can be born and do not damage wire, can require to arrange arbitrarily according to space layout, and move arbitrarily at three dimensions and stretch; Flexible PCB greatly can reduce the volume of electronic product and reduce weight, makes electronic product to high density, miniaturization, highly reliable future development.But flexible circuitry mainly utilizes the metal such as copper, silver as conductive materials at present, wherein exist a lot of not enough: mechanical strength is little, easily chaps; Prepare more difficult; Conducting metal in flexible circuitry is easily oxidized at normal temperatures, so electric conductivity is unstable; The cost of product is more high.
Summary of the invention
Technical barrier to be solved by this invention overcomes the deficiencies in the prior art, provides a kind of compliant conductive circuit and preparation method thereof.The electric conductivity that the present invention utilizes graphite film excellent and good flexibility, it can be used as electric conductor, makes compliant conductive circuit.The component substances of graphite film is charcoal, is difficult to react with water, air under normal temperature, so have good stability and corrosion-resistant high-temperature performance, bending property is good, low cost of manufacture.
Technical solution of the present invention is, is applied in conducting wire using graphite film as electric conducting material; First electrically conductive graphite film (3), double faced adhesive tape (2) and dielectric film (1) are carried out compound, then according to the line map of design, utilize cross cutting proof press to carry out cross cutting to composite membrane, thus form compliant conductive circuit.
The cross-sectional structure of its circuit is, electrically conductive graphite film (3) is positioned at the superiors, and dielectric film (1) is positioned at the bottom, and double faced adhesive tape (2) is intermediate layer; Electrically conductive graphite film (3) and insulating substrate (1) is made to be bonded as one by double faced adhesive tape (2).
Described electrically conductive graphite film (3) is artificial synthetic graphite film.
The thickness of described electrically conductive graphite film (3) is 10-70 μm;
Described Prof. Du Yucang graphite film, is prepared through charing, graphitization by polyimides macromolecule membrane; Wherein carbonization temperature is 1200-1400 DEG C, and graphitization temperature is 2800-3000 DEG C.
Described double faced adhesive tape (2) is bond plies, and the thickness of bond plies is 0.03-1mm.
Described dielectric film (1) is polyester (PET) film, polyimides (PI) film, the one of gathering in naphthalene ester (PEN) film.
drawing explanation
Fig. 1 is fabrication processing figure of the present invention.
Fig. 2 is structural representation of the present invention.
Number in the figure: 1-dielectric film, 2-double faced adhesive tape, 3-graphite film.
Embodiment
The polyimides macromolecule membrane by thickness being 50 μm, under high-purity argon gas and 30MPa pressure, carries out graphitization with following Technology for Heating Processing: 1 DEG C/min ramp to 500 DEG C, constant temperature 1 hour; 2 DEG C/min is warming up to 1300 DEG C, constant temperature 2 hours; 2 DEG C/min is warming up to 2850 DEG C, constant temperature 2 hours; Until body of heater naturally cools to room temperature; Sample is carried out 4-5 road calendering procedure, the horizontal conductive coefficient of prepared electrically conductive graphite film is that 1300 W/m.k are standby.
The bond plies (2) of electrically conductive graphite film (3) with 0.03mm is fitted, then fits with the PET dielectric film (1) of 70 μm.Utilize cross cutting proof press, carry out cross cutting according to the line map of design, finally obtain compliant conductive circuit.Entered test, the resistivity of compliant conductive circuit is 2 × 10
-5Ω * M.
The cross-sectional structure of obtained compliant conductive circuit is that electrically conductive graphite film (3) is positioned at the superiors, and PET dielectric film (1) is positioned at the bottom, and bond plies (2) is intermediate layer; Electrically conductive graphite film (3) and PET dielectric film (1) is made to be bonded as one by bond plies (2).
Claims (7)
1. compliant conductive circuit and preparation method thereof, is characterized in that: be applied in conducting wire using graphite film as electric conducting material; First electrically conductive graphite film (3), double faced adhesive tape (2) and dielectric film (1) are carried out compound, then according to the line map of design, utilize cross cutting proof press to carry out cross cutting to composite membrane, thus form compliant conductive circuit.
2. a kind of compliant conductive circuit as claimed in claim 1, is characterized in that: the cross-sectional structure of its circuit is, electrically conductive graphite film (3) is positioned at the superiors, and dielectric film (1) is positioned at the bottom, and double faced adhesive tape (2) is intermediate layer; Electrically conductive graphite film (3) and insulating substrate (1) is made to be bonded as one by double faced adhesive tape (2).
3. a kind of compliant conductive circuit as claimed in claim 1 and preparation method thereof, is characterized in that: described electrically conductive graphite film (3) is artificial synthetic graphite film.
4. a kind of compliant conductive circuit as claimed in claim 1 and preparation method thereof, is characterized in that: the thickness of described electrically conductive graphite film (3) is 10-70 μm.
5. a kind of compliant conductive circuit as claimed in claim 3 and preparation method thereof, is characterized in that: described Prof. Du Yucang graphite film, is prepared through charing, graphitization by polyimides macromolecule membrane; Wherein carbonization temperature is 1200-1400 DEG C, and graphitization temperature is 2800-3000 DEG C.
6. a kind of compliant conductive circuit as claimed in claim 1 and preparation method thereof, is characterized in that: described double faced adhesive tape (2) is bond plies, and the thickness of bond plies is 0.03-1mm.
7. a kind of compliant conductive circuit as claimed in claim 1 and preparation method thereof, is characterized in that: described dielectric film (1) is polyester (PET) film, polyimides (PI) film, the one of gathering in naphthalene ester (PEN) film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510273157.6A CN104853519A (en) | 2015-05-26 | 2015-05-26 | Flexible conducting circuit and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510273157.6A CN104853519A (en) | 2015-05-26 | 2015-05-26 | Flexible conducting circuit and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104853519A true CN104853519A (en) | 2015-08-19 |
Family
ID=53852767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510273157.6A Pending CN104853519A (en) | 2015-05-26 | 2015-05-26 | Flexible conducting circuit and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104853519A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304626A (en) * | 2016-10-25 | 2017-01-04 | 苏州汉纳材料科技有限公司 | A kind of nonmetal flexible wiring board and preparation method thereof |
| CN112188745A (en) * | 2020-09-30 | 2021-01-05 | 深圳光韵达激光应用技术有限公司 | Die-cutting conductor circuit manufacturing process |
| CN114305430A (en) * | 2022-01-06 | 2022-04-12 | 江苏正心智能科技有限公司 | Elastic electrocardio-electrode and manufacturing process thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4915984A (en) * | 1985-05-30 | 1990-04-10 | Reserach Development Corp. | Process for producing graphite films and fibers |
| US20080149371A1 (en) * | 2006-12-22 | 2008-06-26 | Angstrom Power Inc. | Flexible circuit |
| JP2010234556A (en) * | 2009-03-30 | 2010-10-21 | Ube Ind Ltd | Graphite-polyimide laminate |
| CN103906416A (en) * | 2014-04-11 | 2014-07-02 | 江苏悦达新材料科技有限公司 | Method for manufacturing artificial graphite radiating film with catalytic graphitization technology |
| CN104333975A (en) * | 2014-11-13 | 2015-02-04 | 中国科学院重庆绿色智能技术研究院 | Flexible circuit based on graphene |
| WO2015064519A1 (en) * | 2013-11-01 | 2015-05-07 | 東レ・デュポン株式会社 | Graphite laminate |
-
2015
- 2015-05-26 CN CN201510273157.6A patent/CN104853519A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4915984A (en) * | 1985-05-30 | 1990-04-10 | Reserach Development Corp. | Process for producing graphite films and fibers |
| US20080149371A1 (en) * | 2006-12-22 | 2008-06-26 | Angstrom Power Inc. | Flexible circuit |
| JP2010234556A (en) * | 2009-03-30 | 2010-10-21 | Ube Ind Ltd | Graphite-polyimide laminate |
| WO2015064519A1 (en) * | 2013-11-01 | 2015-05-07 | 東レ・デュポン株式会社 | Graphite laminate |
| CN103906416A (en) * | 2014-04-11 | 2014-07-02 | 江苏悦达新材料科技有限公司 | Method for manufacturing artificial graphite radiating film with catalytic graphitization technology |
| CN104333975A (en) * | 2014-11-13 | 2015-02-04 | 中国科学院重庆绿色智能技术研究院 | Flexible circuit based on graphene |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304626A (en) * | 2016-10-25 | 2017-01-04 | 苏州汉纳材料科技有限公司 | A kind of nonmetal flexible wiring board and preparation method thereof |
| CN112188745A (en) * | 2020-09-30 | 2021-01-05 | 深圳光韵达激光应用技术有限公司 | Die-cutting conductor circuit manufacturing process |
| CN114305430A (en) * | 2022-01-06 | 2022-04-12 | 江苏正心智能科技有限公司 | Elastic electrocardio-electrode and manufacturing process thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150819 |
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| WD01 | Invention patent application deemed withdrawn after publication |