CN100447053C

CN100447053C - Sheet type flexible board strip packaging method

Info

Publication number: CN100447053C
Application number: CNB2005101275411A
Authority: CN
Inventors: 钟金福
Original assignee: KEYAN TECHNICAL ADVISORY CO Ltd
Current assignee: Suzhou Master System Technology Co., Ltd.
Priority date: 2005-12-05
Filing date: 2005-12-05
Publication date: 2008-12-31
Anticipated expiration: 2025-12-05
Also published as: CN1978280A

Abstract

This invention relates to a packing method for slice and strip soft sheets, which adheres a single-face adhesive tape on a strip soft plate in advance to cut it to independent semiconductor loading plates fixed by the strip then to be adhered on a tiny viscous anti-heat board along the borders of the loading plates on the soft plate to finish alignment so as to carry out successive assembling of spare parts to replace artificial alignment and adhesion.

Description

The fixing means of semiconductor carrier plate

Technical field

The invention relates to a kind of method of fixedly semiconductor carrier plate.

Background technology

SMT (Surface Mounting Technology) is kind of the english abbreviation of electron surface mounting technology of new generation.It is collapsed into about 1/10th of original volume with traditional electronic devices and components, and has realized electronic product stack-mounted high density, highly reliable, miniaturization, low cost, becomes the basis of electronic information industry.

Simple, SMT is made up of Surface Mount Component, (SMD), mounting technology, three parts of mounting device.Because the packing density height of SMD, make existing electronic product, system on volume, dwindle 40%-60%, alleviate 60%-80% on the weight, reduce 30%-50% on the cost, also have simultaneously characteristics such as the high and high-frequency performance of the reliability of SMD is good, so the selection of SMT surface mount process technology and equipment thereof and be configured as the key of electronic product, mass of system assurance.

In order to carry out surface mount, before carrying out SMT, still need to carry out the contraposition program.Just, traditional contraposition mode too relies on manually carries out, and causes having many shortcomings to exist.

See also Figure 1A～1C, Figure 1A～1C is the scheme drawing of known contraposition program.Shown in Figure 1A, at first be ready to have the carrier 1 of a plurality of groove 1a, and the size of this groove 1a is offered according to the soft board 2 that is about to carrying all.Then, the soft board 2 that completes is in advance put into the groove 1a of carrier 1, shown in Figure 1B.Then, on the edge at let-in soft board two ends about in the of 2,3,4, paste with heat resistant

adhesive tape

8a, 8b shown in Fig. 1 C and to fix.After fixing, just can begin to carry out the SMT program.

Yet, in the contraposition program shown in Figure 1B,, after finishing the SMT program, still need to remove the fixation adhesive tape of original attaching except must

soft board

2,3,4 being put into the carrier 1 by manual type.So not only cost is higher for traditional contraposition program, efficient is also low.

Summary of the invention

Main purpose of the present invention is to provide a kind of fixing means of semiconductor carrier plate, mainly banded soft board is attached on the refractory plate by the single face adhesive tape, and replace artificial contraposition, attach those semiconductor carrier plates to refractory plate, and cost-cutting, raising output and accuracy rate.

Based on above-mentioned purpose, the fixing means of semiconductor carrier plate of the present invention, mainly be banded soft board to be attached on the refractory plate by the single face adhesive tape, and those semiconductor carrier plates border each other on the banded soft board, cut into separately independently support plate, and separately independently each semiconductor carrier plate still be fixed on the refractory plate by the single face adhesive tape.

Description of drawings

Can be about the advantages and spirit of the present invention by following detailed Description Of The Invention and appended graphic being further understood.

Figure 1A～1C is the scheme drawing of known contraposition program.

Fig. 2 A～2D is the scheme drawing of the fixing means of semiconductor carrier plate of the present invention.

Fig. 3 for semiconductor carrier plate of the present invention after fixing schematic side view.

Among the figure:

1 carrier, 1a groove, 2,3,4 soft boards, 8a, 8b heat resistant adhesive tape, 10 banded soft boards, 10a support plate, 10b border, 10c perforation, 10d finedraw, 12 refractory plates, 13 emplastics, 14 single face adhesive tapes

The specific embodiment

See also Fig. 2 A～2D, Fig. 2 A～2D is the scheme drawing of the fixing means of semiconductor carrier plate of the present invention.Shown in Fig. 2 A, before carrying out contraposition program of the present invention, at first provide banded soft board 10 (before not die-cut, it has a plurality of support plates as semiconductor carrier plate 10a), refractory plate 12, and on refractory plate 12, be coated with emplastic 13.A plurality of dashed rectangle on banded soft board 10 (shown in the 10b of border) only are used for being illustrated in square frame inside and belong to the support plate that has circuit, do not represent and must indicate the frame line on banded soft board 10.

Simple, in the fixing means of semiconductor carrier plate of the present invention, mainly be shown in Fig. 2 B, to paste fixing banded soft board 10 by single face adhesive tape 14, and those semiconductor carrier plates border 10b (dotted line shown in Fig. 2 A or Fig. 2 B) each other on the banded soft board 10, mode by continuous cutting cuts out finedraw 10d at the periphery (that is original 10b place, border) of support plate 10a, and semiconductor carrier plate 10a is cut into separately independently support plate, shown in Fig. 2 C.Thus, though semiconductor carrier plate 10a is separated from banded soft board 10, the single face adhesive tape 14 owing under semiconductor carrier plate 10a makes each semiconductor carrier plate still be fixed on the single face adhesive tape 14, shown in Fig. 2 D.

Banded soft board 10 shown in Fig. 2 A can make its dual-side have a plurality of holes as perforation 10c.This perforation 10c is the hole as film base, and its purposes is also roughly the same.Because therefore the material of banded soft board 10 before the making step that carries out shown in Fig. 2 B～2C, can roll up banded soft board 10 as film base as all very flexible as the film base.When needs carried out making step shown in Fig. 2 B～2C, special automated installation just can be extracted required length out from this winding shape soft board 10 by perforation 10c, and reaches the effect of automated job.Certain banded soft board 10 is not to have perforation 10c, is so more convenient automated job of design meeting.In addition, not that the part of those semiconductor carrier plates (as semiconductor carrier plate 10a) is the soft board rim charge in the banded soft board 10.

Particularly, in the fixing means of semiconductor carrier plate of the present invention, after as previously discussed banded soft board 10, refractory plate 12 are provided, just can extract the banded soft board 10 that on length, roughly meets refractory plate 12 out, and shown in Fig. 2 B, be attached on the single face adhesive tape 14.In order to make semiconductor carrier plate 10a independent from banded soft board 10, but wish that semiconductor carrier plate 10a still is fixed on the single face adhesive tape 14, so when border 10b is die-cut shown in Fig. 2 B, only cut off the part of banded soft board 10, and single face adhesive tape 14 is not cut (lateral plan as shown in Figure 3) as far as possible, shown in Fig. 2 C.Then, shown in Fig. 2 D, after removing the soft board rim charge, shown in Fig. 2 B the banded soft board 10 of next section is attached on the single face adhesive tape 14 for another example, and carries out the processing procedure shown in Fig. 2 C～2D as previously discussed, and reach automated job from single face adhesive tape 14.

Before will carrying out the SMT assembling operation, just will be shown in Fig. 2 D the side of single face adhesive tape 14 in the finished product (the single face adhesive tape 14 that combines with banded soft board 10 stickiness), change the refractory plate of pasting to as the tool of soft board 12.Because the adhesion between single face adhesive tape 14 and the refractory plate 12 is greater than the adhesion between single face adhesive tape 14 and the banded soft board 10, so can change the order ground of attaching accurately.

By the above detailed description of preferred embodiments, be to wish to know more to describe feature of the present invention and spirit, and be not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain being arranged in the protection domain that the present invention will apply for of various changes and tool equality.

Claims

1. the fixing means of a semiconductor carrier plate, this method comprises:

Banded soft board with a plurality of semiconductor carrier plates is provided;

Provide tool an adhesive refractory plate;

One single face adhesive tape is attached on the back side of this band shape soft board; And

Those semiconductor carrier plates border each other on this band shape soft board cuts into separately independently support plate, and separately independently each semiconductor carrier plate still fixed by this single face adhesive tape;

Removing the banded soft board from the single face adhesive tape is not the part of semiconductor carrier plate, the banded soft board that is pasted with semiconductor carrier plate changeed being pasted on the refractory plate by the single face adhesive tape, the adhesion between this single face adhesive tape and this refractory plate is greater than the adhesion between this single face adhesive tape and this band shape soft board.

2. the fixing means of semiconductor carrier plate as claimed in claim 1 is not that the part of those semiconductor carrier plates is a soft board rim charge in wherein should the band shape soft board.

3. the fixing means of semiconductor carrier plate as claimed in claim 1, wherein remove from the single face adhesive tape be not the part of semiconductor carrier plate the banded soft board after, the fixing means of this semiconductor carrier plate further comprises: this band shape soft board of next section is attached on this single face adhesive tape.

4. the fixing means of semiconductor carrier plate as claimed in claim 1, dual-side that wherein should the band shape soft board has perforation.