CN109436416A - A kind of FPC packing method, FPC packing device and FPC product - Google Patents
A kind of FPC packing method, FPC packing device and FPC product Download PDFInfo
- Publication number
- CN109436416A CN109436416A CN201811332273.0A CN201811332273A CN109436416A CN 109436416 A CN109436416 A CN 109436416A CN 201811332273 A CN201811332273 A CN 201811332273A CN 109436416 A CN109436416 A CN 109436416A
- Authority
- CN
- China
- Prior art keywords
- fpc
- adhesion layer
- piece
- lower die
- slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000002699 waste material Substances 0.000 claims abstract description 21
- 238000000926 separation method Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 58
- 239000011241 protective layer Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/02—Attaching small articles, e.g. buttons, to cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/02—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for perforating, scoring, slitting, or applying code or date marks on material prior to packaging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
- B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
- B65B61/065—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting by punching out
Abstract
The present invention relates to flexible circuit board fields, disclose a kind of FPC packing method, comprising the following steps: fit in gummed paper on whole FPC；Whole FPC is punched out to obtain several single-piece FPC and waste material that are sticked together；Single-piece FPC is separated with waste material, passes through the single-piece FPC after adhesion layer adherency separation；Obtain the adhesion layer for posting single-piece FPC.A kind of FPC packing device, including upper die and lower die and adhesion layer are also disclosed, upper mold is equipped with the pressure head of evagination, and lower die is equipped with slot, and adhesion layer is affixed on the bottom of lower die, and after upper mold and lower die mold, pressure head be can extend into slot.A kind of FPC product is also disclosed, FPC product is made by above-mentioned FPC packing method, and FPC product includes adhesion layer and multiple single-piece FPC for being adhered on adhesion layer.Multiple single-piece FPC can once be completed to separate with waste material with device using the above method, and obtain the adhesion layer for posting multiple single-piece FPC, greatly improve the efficiency of FPC packaging.
Description
Technical field
The present invention relates to flexible circuit board fields more particularly to a kind of FPC packing method, FPC packing device and FPC to produce
Product.
Background technique
It improves with the continuous development of science and technology, the requirement to circuit board is also higher and higher, and especially digital product is pursued just
Victory and lightweight, have many advantages, such as can the flexible circuit board of immunity, ultra-thin property and light weight obtained greatly in electronic field
Development and application.Flexible circuit board be using polyimides or polyester film as made of substrate it is a kind of with height reliability can
Flexible print wiring board, abbreviation soft board or FPC.The manner of packing of flexible circuitry board finished product generally has that vacuum formed box is packed and whole viscous
Attached layer packs two kinds.Vacuum formed box packaging is primarily adapted for use in patch product, and packaging effect is good, but higher cost, and production efficiency
It is lower.Whole adhesion layer packaging is primarily adapted for use in the flexible circuit board of non-patch, and easy to operate, cost is relatively low.The prior art
In, when whole adhesion layer is packed, need that whole flexible circuit board is first punched to single-piece, then the product of single-piece is placed in adhesion layer
On, tear plate and single-piece is lower toward efficiency when putting on adhesion layer in entire technical process, after punching open, and tear plate open by hand easily to make
There are the hidden danger such as fold, surface scratching and pad pollution in product.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of FPC packing method, FPC packing device and FPC and produces
Multiple single-piece FPC once can be completed to separate by product with waste material, and obtain the adhesion layer for posting multiple single-piece FPC, be greatlyd improve
The efficiency of FPC packaging.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of FPC packing method is provided, is included the following steps,
S10 fits in gummed paper on whole FPC；
S20 is punched out to obtain several single-piece FPC and waste material that are sticked together the whole FPC；
S30 separates the single-piece FPC with the waste material, passes through the single-piece FPC after adhesion layer adherency separation；
S40 obtains the adhesion layer for posting the single-piece FPC.
As an improvement of the above technical solution, multiple single-piece FPC once complete to separate with the waste material.
As a further improvement of the above technical scheme, the method single-piece FPC separated with the waste material are as follows: setting
Upper mold and lower die, the upper mold are equipped with the pressure head of evagination, and the lower die is equipped with slot, and the upper mold and the lower die are closed
After mould, the single-piece FPC is pressed into the slot and separated with the waste material by the pressure head.
As a further improvement of the above technical scheme, the method for posting the adhesion layer of the single-piece FPC is obtained are as follows: by institute
The bottom that adhesion layer is affixed on the lower die is stated, is affixed on the adhesion layer after so that the single-piece FPC is passed through the slot.
As a further improvement of the above technical scheme, the shape of the pressure head and the shape of the single-piece FPC match,
The shape of the slot and the shape of the single-piece FPC match.
As a further improvement of the above technical scheme, release layer is set in the bottom of the lower die, by the adhesion layer
It is affixed on the release layer.
A kind of FPC packing device, including upper die and lower die and adhesion layer are additionally provided, the upper mold is equipped with the pressure of evagination
Head, the lower die are equipped with slot, and the adhesion layer is affixed on the bottom of the lower die, after the upper mold and the lower die mold,
The pressure head can extend into the slot.
As a further improvement of the above technical scheme, the bottom of the lower die is fixed with release layer, the adhesion layer patch
In on the release layer.
As a further improvement of the above technical scheme, the adhesion layer includes band glue-line and transparent protective layer, the band
Glue-line is separable to be fitted on the transparent protective layer.
A kind of FPC product is additionally provided, the FPC product is made by above-mentioned FPC packing method, and the FPC product includes
Adhesion layer and the multiple single-piece FPC being adhered on the adhesion layer.
The beneficial effects of the present invention are: can once complete to separate with waste material by multiple single-piece FPC, and obtains and post multiple lists
The adhesion layer of part FPC greatly improves the efficiency of FPC packaging.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples:
Fig. 1 is the schematic diagram of the assembled position of FPC packing device in one embodiment of the invention；
Fig. 2 is the schematic diagram of the upper mold of FPC packing device in one embodiment of the invention；
Fig. 3 is the schematic diagram of whole FPC after being punched in one embodiment of the invention；
Fig. 4 is the schematic diagram of the lower die of FPC packing device in one embodiment of the invention；
Fig. 5 is the schematic diagram of the adhesion layer in one embodiment of the invention；
Fig. 6 is the flow chart of the operating procedure in one embodiment of the invention.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to design of the invention, specific structure and generation clear
Chu, complete description, to be completely understood by the purpose of the present invention, scheme and effect.It should be noted that the case where not conflicting
Under, the features in the embodiments and the embodiments of the present application can be combined with each other.
It should be noted that unless otherwise specified, when a certain feature referred to as " fixation ", " connection " are in another feature,
It can directly fix, be connected to another feature, and can also fix, be connected to another feature indirectly.In addition, this
The descriptions such as up, down, left, right, before and after used in invention are only relative to the mutual of each component part of the invention in attached drawing
For positional relationship.
In addition, unless otherwise defined, the technology of all technical and scientific terms used herein and the art
The normally understood meaning of personnel is identical.Term used in the description is intended merely to description specific embodiment herein, without
It is to limit the present invention.Term " and or " used herein includes the arbitrary of one or more relevant listed items
Combination.
Referring to figs. 1 to Fig. 6, one embodiment of the present of invention is carried out as described below.It is first that single-piece FPC21 well in advance is whole
Layout through sawing sheet, drilling, copper facing, route forming, fits over film, changes the processes such as gold, silk-screen character, Hi-pot test and be made into
Gummed paper state to be fit.
FPC packing device includes upper mold 1, lower die 3 and adhesion layer 4.Upper mold 1 is equipped with the pressure head 11 of evagination, in lower die 3 with
11 corresponding position of pressure head is equipped with slot 31.The shape of pressure head 11 and slot 31 and the shape of single-piece FPC21 match.Upper mold 1
It is set with the position of each single-piece FPC21 in the layout of the positions of multiple pressure heads and slot in lower die 3 according to whole FPC
It sets.The size of pressure head 11 in upper mold 1 is smaller than the size of single-piece FPC21, and the size of the slot 31 in lower die 3 is than single-piece FPC21
Size it is big.Upper mold 1 is positioned with lower die 3 by positioning column.
Gummed paper is posted in the top surface of whole FPC2, therefore, after being punched out using punching block to whole FPC2, since gummed paper has
Viscosity, therefore, multiple single-piece FPC21 of formation will be sticked together with waste material.The multiple single-piece FPC and waste material being bonded together
It is attached at the land area of lower die, when fitting makes to post the one side of gummed paper upward.
Adhesion layer 4 is affixed on the bottom of lower die 3.Neutral viscosity material can be used in adhesion layer 4.Adhesion layer 4 include band glue-line with
Transparent protective layer, transparent protective layer can anti-stop-band glue-line it is exposed and be contaminated, band glue-line can tear from transparent protective layer.Under
The bottom of mould 3 is fixed with release layer, and adhesion layer 4 is equipped with location hole 41, and the band glue-line of adhesion layer 4 is torn from transparent protective layer
After lower, it will be affixed on glue-line according to the position of location hole 41 on the release layer of the bottom of lower die 3.
Specific steps are as follows: gummed paper to be affixed on to the top surface of whole FPC2 after completing layout, punching block pair is then used
Whole FPC2 is punched out.Since gummed paper is posted in the top surface of whole FPC2, be punched multiple single-piece FPC21 for being formed will with it is useless
Material is sticked together.It drills on adhesion layer 4 according to the position of preset location hole 41, in order to make when subsequent positioning
With.
And then, production upper mold 1 and lower die 3, produced in upper mold 1 according to the appearance profile of single-piece FPC match it is outer
Convex pressure head 11, slot 31 corresponding with pressure head 11 is produced in corresponding position in lower die 3, and falls to pressure head 11 and slot 31
Angle.Release layer is sticked in the bottom of lower die 3, the transparent protective layer of adhesion layer 4 is torn from band glue-line stand-by, and will be with glue-line
It is affixed on the release layer of the bottom of lower die 3.
The multiple single-piece FPC21 and waste material that bond together after punching are affixed at the land area of lower die.Make upper mold 1 under
Mould 3 molds, and single-piece FPC21 will be pressed downward by the pressure head 11 in upper mold 1, and the slot 31 passed through in lower die 3 is affixed on adhesion layer 4
On band glue-line, and waste material is then left between upper mold 1 and lower die 3.
Upper mold 1 is separated with lower die 3, that is, can be taken off the whole waste material between upper mold 1 and lower die 3.By adhesion layer 4
It tears from the release layer of the bottom of lower die 3 with glue-line, at this point, multiple single-piece FPC21 will be arranged on adhesion layer 4.Again by this
Before tear stand-by transparent protective layer be attached to again adhesion layer 4 band glue-line on after, that is, complete entire packaging process.
Pass through the above method and device, it may be convenient to once be attached to multiple single-piece FPC on adhesion layer, packaging efficiency obtains
It is also whole to the waste material for greatling improve, and obtaining, is easily handled.
It is to be illustrated to what preferable implementation of the invention carried out, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (10)
1. a kind of FPC packing method, includes the following steps,
S10 fits in gummed paper on whole FPC；
S20 is punched out to obtain several single-piece FPC and waste material that are sticked together the whole FPC；
S30 separates the single-piece FPC with the waste material, passes through the single-piece FPC after adhesion layer adherency separation；
S40 obtains the adhesion layer for posting the single-piece FPC.
2. FPC packing method according to claim 1, which is characterized in that multiple single-piece FPC and the waste material are primary
Complete separation.
3. FPC packing method according to claim 1, which is characterized in that separate the single-piece FPC with the waste material
Method are as follows: setting upper mold and lower die, the upper mold are equipped with the pressure head of evagination, and the lower die is equipped with slot, by the upper mold
After lower die molding, the single-piece FPC is pressed into the slot and separated with the waste material by the pressure head.
4. FPC packing method according to claim 3, which is characterized in that obtain the adhesion layer for posting the single-piece FPC
Method are as follows: the adhesion layer is affixed on to the bottom of the lower die, is affixed on the adherency after making the single-piece FPC pass through the slot
On layer.
5. FPC packing method according to claim 3, which is characterized in that the shape of the pressure head is with the single-piece FPC's
Shape matches, and the shape of the slot and the shape of the single-piece FPC match.
6. FPC packing method according to claim 4, which is characterized in that in the bottom of the lower die, release layer is set, it will
The adhesion layer is affixed on the release layer.
7. a kind of FPC packing device, including upper die and lower die and adhesion layer, which is characterized in that the upper mold is equipped with the pressure of evagination
Head, the lower die are equipped with slot, and the adhesion layer is affixed on the bottom of the lower die, after the upper mold and the lower die mold,
The pressure head can extend into the slot.
8. FPC packing device according to claim 7, which is characterized in that the bottom of the lower die is fixed with release layer, institute
Adhesion layer is stated to be affixed on the release layer.
9. FPC packing device according to claim 8, which is characterized in that the adhesion layer includes band glue-line and transparent guarantor
Sheath, the band glue-line is separable to be fitted on the transparent protective layer.
10. a kind of FPC product, which is characterized in that the FPC product is packed by FPC described in any one of claims 1 to 6
Method is made, and the FPC product includes adhesion layer and multiple single-piece FPC for being adhered on the adhesion layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811332273.0A CN109436416A (en) | 2018-11-09 | 2018-11-09 | A kind of FPC packing method, FPC packing device and FPC product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811332273.0A CN109436416A (en) | 2018-11-09 | 2018-11-09 | A kind of FPC packing method, FPC packing device and FPC product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109436416A true CN109436416A (en) | 2019-03-08 |
Family
ID=65550897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811332273.0A Pending CN109436416A (en) | 2018-11-09 | 2018-11-09 | A kind of FPC packing method, FPC packing device and FPC product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109436416A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114229084A (en) * | 2021-11-26 | 2022-03-25 | 珠海和正柔性线路板有限公司 | Whole circuit board packaging process |
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| CN202895050U (en) * | 2012-10-26 | 2013-04-24 | 昆山伟时电子有限公司 | Whole-board attachment |
| CN103997859A (en) * | 2014-06-03 | 2014-08-20 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
| JP2018089710A (en) * | 2016-11-30 | 2018-06-14 | 日昌株式会社 | Electronic component manufacturing apparatus and manufacturing method of the same |
| CN209337047U (en) * | 2018-11-09 | 2019-09-03 | 深圳市新宇腾跃电子有限公司 | A kind of FPC packing device |
-
2018
- 2018-11-09 CN CN201811332273.0A patent/CN109436416A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006055920A (en) * | 2004-08-18 | 2006-03-02 | Kosensha:Kk | Method and device for producing chip arrangement holding sheet |
| CN1870884A (en) * | 2005-05-27 | 2006-11-29 | 日本梅克特隆株式会社 | Mounting method of flexible circuit board |
| CN1978280A (en) * | 2005-12-05 | 2007-06-13 | 科研技术顾问有限公司 | Sheet type flexible board strip packaging method |
| CN202895050U (en) * | 2012-10-26 | 2013-04-24 | 昆山伟时电子有限公司 | Whole-board attachment |
| CN103997859A (en) * | 2014-06-03 | 2014-08-20 | 深圳市华大电路科技有限公司 | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof |
| JP2018089710A (en) * | 2016-11-30 | 2018-06-14 | 日昌株式会社 | Electronic component manufacturing apparatus and manufacturing method of the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114229084A (en) * | 2021-11-26 | 2022-03-25 | 珠海和正柔性线路板有限公司 | Whole circuit board packaging process |
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