CN116209237B - Component dispensing paste and preparation process thereof - Google Patents
Component dispensing paste and preparation process thereof Download PDFInfo
- Publication number
- CN116209237B CN116209237B CN202211711412.7A CN202211711412A CN116209237B CN 116209237 B CN116209237 B CN 116209237B CN 202211711412 A CN202211711412 A CN 202211711412A CN 116209237 B CN116209237 B CN 116209237B
- Authority
- CN
- China
- Prior art keywords
- film
- component
- positioning
- carrier
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 61
- 239000010410 layer Substances 0.000 claims description 58
- 239000012790 adhesive layer Substances 0.000 claims description 54
- 238000005520 cutting process Methods 0.000 claims description 43
- 239000002131 composite material Substances 0.000 claims description 29
- 230000001681 protective effect Effects 0.000 claims description 27
- 238000004080 punching Methods 0.000 claims description 23
- 239000002313 adhesive film Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 14
- 239000002699 waste material Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 238000004064 recycling Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 description 23
- 229920000297 Rayon Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
Abstract
The application relates to the technical field of component film sticking, in particular to a component dispensing paste and a preparation process thereof. The component dispensing paste comprises a carrier film, a plurality of positioning holes are concavely formed in the carrier film, positioning points are connected to the hole walls of the positioning holes, positioning point glue is connected to the surfaces of the positioning points, component dispensing films are connected to the surfaces of the positioning point glue, a first dispensing film is connected to one surface of the positioning point away from the positioning point glue, and parts of the first dispensing film, which are not connected with the positioning point glue, are connected with the component dispensing films. The component dispensing paste can be provided with a plurality of component dispensing films, a plurality of component dispensing films can be accurately pasted at one time, the efficiency is high, when the device dispensing paste is used, the component dispensing films are aligned to components, positioning points are pressed against the directions of the components, the carrier films are torn in opposite directions, and the component dispensing films fall off from the positioning points under the action of external force and are pasted on the surfaces of the components, so that the device dispensing paste is convenient and quick.
Description
Technical Field
The application relates to the technical field of component film sticking, in particular to a component dispensing paste and a preparation process thereof.
Background
The electronic components are generally small and exquisite spare and accessory parts, various functional films are required to be adhered to the surfaces of the electronic components in the preparation process according to requirements, the electronic components are small in size, the corresponding functional films are small in area, and the adhesion process is inconvenient. In order to improve the high efficiency of pasting the functional films of electronic components, various film pasting devices are designed, such as a precise automatic film pasting machine, and the film pasting of the electronic components can be realized through the action of the film pasting machine, however, the film pasting device is often aimed at the functional films of a certain structure, can not be pasted on the functional films of various structures, and is often aimed at enterprises to have the functional films of different structures, so that different film pasting devices are correspondingly added, the purchase cost is high, and the maintenance cost is also high. On the other hand, the functional films are manually torn one by one and then attached to the surfaces of the components, but the efficiency of attaching the functional films in this way is low, and sometimes the functional films cannot be attached accurately.
Disclosure of Invention
In order to solve the problems of inconvenience and low efficiency in attaching the functional film to the electronic component, the application provides the component dispensing adhesive tape and the preparation process thereof, improves the attaching efficiency of the functional film and can quickly and accurately attach the functional film to the surface of the electronic component.
In a first aspect, the application provides a component dispensing paste, which adopts the following technical scheme:
the component dispensing paste comprises a carrier film, a plurality of positioning holes are concavely formed in the carrier film, positioning points are connected to the hole walls of the positioning holes, positioning point glue is connected to the surfaces of the positioning points, component dispensing films are connected to the surfaces of the positioning point glue, a first dispensing film is connected to one surface of the positioning point glue, which is far away from the positioning point glue, and parts, which are not connected with the positioning point glue, of the first dispensing film are connected with the component dispensing films.
Through adopting above-mentioned technical scheme for can be fast in the production process accurately the component point membrane easily follow carrier film and drop, paste to electronic components surface, efficient, the accuracy is good. According to the application, the component spot films are placed on the surface of the positioning point of the carrier film in advance according to a certain sequence, and the first spot adhesive film is used for fixing the component spot films, so that a component spot adhesive tape containing a plurality of component spot films is formed; when the device is used, the component point film is aligned to the component, then the positioning point is pressed against the direction of the component, the carrier film is torn in the opposite direction, the component point film falls off from the positioning point under the action of external force, and is adhered to the surface of the component, so that the device is convenient and quick. The component dispensing paste can be provided with a plurality of component dispensing films, and a plurality of component dispensing films can be precisely pasted at one time, so that the efficiency is high. The component point film is various functional films, can be various shapes and can be adjusted according to the needs of enterprises. No different film-sticking equipment is required. On the other hand, traditional functional films are scattered and single, need to be torn one by one, are stuck to the surface of a component, are low in efficiency, and are easy to stick inaccurately. The application can be directly adhered to the surface of an electronic component without tearing one by one, and has simple operation and high efficiency.
Preferably, the component point film and the first point adhesive film have the same shape and size.
Through adopting above-mentioned technical scheme for first some glued membrane can be fixed in the setpoint surface with components and parts point glued membrane stability, guarantees when not using, components and parts point glued can not drop from the setpoint, protects components and parts point glued membrane not contaminated simultaneously.
Preferably, the carrier film is also symmetrically provided with a plurality of carrier sleeve holes, and the carrier sleeve holes are positioned at two sides of the positioning holes.
By adopting the technical scheme, when the component dispensing paste is convenient to use, the component dispensing paste is fixed. The fixed articles can penetrate through the carrier sleeve holes, such as the positioning columns, so that the carrier film is fixed, and only the positioning points are moved, so that the device point film can fall off from the positioning points under the action of external force and is adhered to the surface of the component.
In a second aspect, the application provides a component dispensing paste preparation tool, which adopts the following technical scheme:
a component dispensing paste preparation process comprises the following steps:
preparation of transfer film: firstly, arranging a transfer groove on a first transfer base film along the length direction of the transfer groove, arranging a first adhesive layer at the bottom of the transfer groove, covering the surface of the first adhesive layer with a first release film, and pressing to form a first composite film; punching the first composite film to obtain a plurality of first set of position holes, wherein the first set of position holes are positioned on two sides of the transfer groove; die cutting is carried out on the first release film, and waste materials of the first release film after die cutting are recovered, so that a plurality of first adhesive films are distributed on the surface of the first adhesive layer; punching the first transfer base film and the first adhesive layer to obtain a plurality of second set of position holes, wherein the second set of position holes are positioned at the bottom of the transfer groove, then attaching a first protective film, and winding to obtain a transfer film;
preparing a component film: firstly, a component substrate film is provided with a component groove along the length direction of the component substrate film, the component substrate film and a first component film are pressed together, the first component film is positioned in the component groove, the first component film is die-cut, and waste of the first component film after die-cutting is recovered, so that a plurality of component point films are distributed at the bottom of the component groove; punching the component substrate film and the first component film to form a third set of position holes, wherein the third set of position holes are positioned on two sides of the component groove; recovering the waste material of the first component film, attaching a third protective film, and rolling to obtain the component film;
the component point films are matched with the first point films one by one;
preparation of a carrier film: firstly laminating a carrier substrate film, a support film and a release film to form a third composite film, punching the third composite film to obtain a plurality of carrier sleeve position holes, die-cutting the support film and the release film, die-cutting to obtain a plurality of positioning points and a plurality of positioning holes, connecting hole walls on two opposite sides of the positioning holes with the positioning points, removing the support film and the release film waste part, enabling an adhesive layer of the release film to be on the surface of the support film to form a plurality of positioning point adhesives, and removing the carrier substrate film to obtain the carrier film;
component dispensing paste: tearing off a second protective film of the transfer film, aligning the second positioning holes with the carrier positioning holes one by one, aligning the positioning points with the first adhesive films one by one, and pressing;
tearing off the third protective film of the component film, so that the first set of position holes are aligned with the third set of position holes one by one, so that the second set of position holes are aligned with the carrier set of position holes one by one, positioning points are aligned with the component point films one by one, pressing and tearing off the transfer substrate film and the component substrate film, and obtaining the component dispensing adhesive tape.
Through adopting above-mentioned technical scheme, can the high-efficient preparation components and parts point gum subsides of full automatization, through the effect of transfer membrane with first point glued membrane accurate transfer to setpoint surface, the same way, through the effect of components and parts membrane with components and parts point glued membrane accurate transfer to the setpoint one side of keeping away from first point glued membrane. And full automation can be realized in the transfer process, and the efficiency of preparing component dispensing paste is improved. The component dispensing adhesive tape prepared by the process has a plurality of component dispensing films, and the component dispensing films are easy to fall off from the carrier film and are adhered to the surface of an electronic component, so that the efficiency is high and the accuracy is good.
The first transfer base film is provided with a transfer groove along the length direction of the first transfer base film so as to fix the first adhesive layer, so that the first adhesive layer is prevented from shifting during the preparation process, and each first adhesive layer can be ensured to be accurately transferred to the surface of the positioning point during the subsequent transfer of the first adhesive layer. The first positioning holes are used for dispensing and pasting components and parts in the subsequent preparation, so that the first transfer base film can be fixed and the first adhesive film can be transferred accurately. Meanwhile, the first set of positioning holes are also used for positioning the third set of positioning holes in alignment in the subsequent step, so that the preparation of the component dispensing paste is facilitated. The die cutting function is to cut the first release film to form a first adhesive film which is consistent with the shape and the size of the component point film. The second positioning holes are used for being aligned with the fourth positioning holes and the carrier positioning holes, so that alignment of the first transfer base film, the component point film and the carrier film is realized, the first point film is accurately transferred to the surface of the positioning point, and the component point film is accurately transferred to the positioning point.
Wherein, offer the components and parts recess with components and parts substrate membrane along its length direction in order to fix components and parts substrate membrane, prevent in the in-process of follow-up cross cutting that components and parts membrane appears shifting the phenomenon. Wherein, carrier substrate membrane plays a supporting and guard action, reduces to cause the injury to the backing film at the in-process that punches a hole, and the in-process that punches a hole, outside has the friction to the backing film, is easy to be the backing film surface and scrapes the flower, influences the use of carrier film, and the backing film is the carrier film main part, receives the effect of external force in the preparation process, appears scraping the flower easily, and carrier substrate can fine protection backing film.
The positioning points are aligned with the first adhesive dispensing films one by one, the first positioning holes are aligned with the third positioning holes one by one, the fourth positioning holes are aligned with the carrier positioning holes one by one, the positioning points are aligned with the component dispensing films one by one, and the accuracy of transferring the first adhesive dispensing films and the component dispensing films is improved.
Preferably, the first transfer substrate film includes a first transfer substrate layer and a first transfer film layer; the first release film comprises a first release layer and a first release adhesive layer.
The first transfer substrate film is formed by the first transfer substrate layer and the first transfer film layer, so that slotting is convenient, and if slotting is performed by only one film, the technical difficulty is high, so that slotting is convenient and slotting efficiency is high by combining the two films.
Preferably, the preparation of the transfer film comprises the following preparation steps:
the preparation of the transfer film comprises the following preparation steps:
1) Cutting the first transfer film layer along the length direction to form a transfer groove, arranging a first adhesive layer at the bottom of the transfer groove, and attaching the first release adhesive layer to the surface of the first adhesive layer to form a first composite film;
2) Punching the first composite film to obtain a plurality of first set of position holes, wherein the first set of position holes are positioned on two sides of the transfer groove; die cutting is carried out on the first release film, and waste materials of the first release film after die cutting are recovered, so that a plurality of first positioning points are distributed on the surface of the first adhesive layer;
3) Covering the first positioning point with a second fixing film, pressing, and tearing off the second fixing film; covering the first locating point with a second release film, tearing off the second release film again, so that the second release film of the first locating point is removed, and the first release adhesive is left on the surface of the first adhesive layer to form a first adhesive film;
4) And covering the first adhesive film with a first protective film, punching again to obtain a plurality of second locating holes, tearing off the first protective film, sticking a second protective film, and winding to obtain the transfer film.
By adopting the technical scheme, the full-automatic preparation of the transfer film can be realized, so that the surface of the transfer film is provided with a plurality of first adhesive films corresponding to the positioning points, and the component adhesive films can be conveniently fixed. The second fixing film covers the first locating point, the second fixing film is torn off to fix the first locating point, and the second locating point of the second release film is prevented from being torn off in the subsequent step.
Preferably, the adhesive force of the first release adhesive layer is smaller than that of the first adhesive layer.
Through adopting above-mentioned technical scheme for first from the type glue easily drops from first viscose layer and shifts to the setpoint surface, and the adhesion of first viscose layer is little simultaneously, only can glue the protection film, and first is from the type glue easily drops from first family layer simultaneously, is favorable to first from the type glue to shift from first viscose layer.
Preferably, the component substrate film includes a first component substrate layer and a second component substrate layer.
The component substrate film is prepared through the first component substrate layer and the second component substrate layer, so that grooves are conveniently formed in the preparation process, and if only one layer of film is used for grooving, the technical difficulty is high, so that the grooving is convenient due to the combination of the two layers of films, and the grooving efficiency is high.
Preferably, the preparation of the component film comprises the following preparation steps:
s1: symmetrically cutting the second component substrate layer along the length direction of the second component substrate layer, tearing off a cutting part to form a component groove, pressing the first component film and the groove bottom of the component groove, and attaching a third release film to the first component film to form a second composite film;
s2: punching the second composite film to obtain a plurality of third set of position holes and a plurality of fourth set of position holes, wherein the third set of position holes are positioned on two sides of the component groove, and the fourth set of position holes are positioned at the bottom of the component groove; performing die cutting on the third release film and the first component film, and removing waste materials of the third release film and the first component film after die cutting, so that a plurality of component point films are arranged at the bottom of the component groove;
s3: and covering the component point film with a third protective film, and rolling to obtain the component film.
Through adopting above-mentioned technical scheme, can high-efficient swift preparation obtain the transfer membrane, improve production efficiency, this transfer membrane upper surface has a plurality of first point glued membrane corresponding with the setpoint, is favorable to transferring first transfer point glued membrane to the setpoint.
Preferably, in the step of preparing the carrier film, the carrier substrate film sequentially includes a carrier substrate and a first supporting adhesive layer; the support film comprises a protective layer and a support layer; the release layer comprises a second adhesive layer and a release paper layer.
Preferably, the preparation of the carrier film comprises the following preparation steps:
a: laminating the support layer on the first support adhesive layer, recycling the protective layer, and laminating the second adhesive layer on the surface of the support layer to form a third composite film;
b: punching and die cutting are carried out on the third composite film, a plurality of carrier sleeve position holes are obtained through punching, a plurality of positioning points and a plurality of positioning holes are obtained through die cutting, hole walls on two opposite sides of the positioning holes are connected with the positioning points, then the carrier transfer film is attached to the third composite film, and the attaching position is consistent with the die cutting position; tearing the carrier transfer film to take away the release paper layer, so that the adhesive layer on the surface of the release paper is left on the surface of the positioning point to form a plurality of positioning point adhesives;
c: and attaching a fourth protective film layer to the surface of the positioning point adhesive, and removing the carrier substrate film to obtain the carrier film.
Through adopting above-mentioned technical scheme, can high-efficient swift preparation obtain the carrier membrane, wherein the carrier substrate membrane includes carrier substrate and first support adhesive layer in proper order, is in order to prepare the carrier membrane, and carrier substrate membrane and support membrane can stably glue, protection support membrane, be convenient for follow-up tearing carrier substrate and first support adhesive layer simultaneously, and first support adhesive layer is from gluing, tear relatively easily.
The die cutting is used for obtaining a plurality of positioning points and positioning holes, the positioning points are only required to be pressed towards the direction of the component, the carrier film is torn towards the opposite direction, the component point film falls off from the positioning points under the action of external force, and the component point film is adhered to the surface of the component, so that the die cutting device is convenient and quick. The protective film is torn off and then the functional film is attached to the electronic component. The structure that the hole walls on two opposite sides of the locating hole are connected with the locating points can directly attach the component point film to the electronic component, and the working efficiency is high.
In summary, the application has the following beneficial effects:
1. according to the application, the carrier film is concavely provided with a plurality of positioning holes, the hole walls of the positioning holes are connected with positioning points, the component point films are placed on the surface of the positioning points of the carrier film in advance according to a certain sequence, and the first point adhesive film is used for fixing the component point films, so that the component point adhesive tape containing a plurality of component point films is formed. When the component point film is subjected to external force, the component point film can fall off from the positioning point and is adhered to the surface of the component, so that the efficiency is high, the accuracy is good, and the convenience and the rapidness are realized.
2. The method comprises the steps of respectively preparing a transfer film, a component film and a carrier film, wherein a plurality of first point adhesive films are prepared on the surface of the carrier film, a plurality of component point films are prepared on the surface of the component film, a plurality of positioning points are arranged on the surface of the carrier film, positioning point adhesives are arranged on the surface of the positioning points, the component point films are connected with the positioning points through the positioning point adhesives, the first point adhesive films are connected with one surface of the positioning points far away from the positioning point adhesives, and the part of the first point adhesive films which is not connected with the positioning point adhesives is connected with the component point films, so that the component point adhesive films can be stably attached to the positioning points and are not easy to loosen; the positioning points are required to be pressed towards the directions of the components, the carrier film is torn towards the opposite directions, the component point film falls off from the positioning points under the action of external force, and the component point film is adhered to the surfaces of the components, so that the method is convenient and quick.
Drawings
Fig. 1 is a schematic structural diagram of a component dispensing part in this embodiment.
Fig. 2 is a schematic structural diagram of another part of the dispensing sticker for components in this embodiment.
Fig. 3 is a sectional view taken along the direction A-A in fig. 2.
Reference numerals: 1. a carrier film; 2. positioning holes; 3. positioning points; 4. positioning point glue; 5. component spot film; 6. a first adhesive film; 7. and a carrier sleeve hole.
Detailed Description
Examples
The application is described in further detail below with reference to fig. 1-3.
The embodiment of the application discloses a component dispensing paste, referring to fig. 1, the component dispensing paste comprises a carrier film 1, a plurality of positioning holes 2 are concavely formed in the carrier film 1, positioning points 3 are connected to the wall of the positioning holes 2, and positioning point glue 4 is connected to the surface of the positioning points 3. Referring to fig. 2 and 3, the surface of the positioning point glue 4 is connected with a component point film 5, the area of the positioning point 3 is smaller than that of the component point film 5, one surface of the positioning point 3 far away from the positioning point glue 4 is connected with a first point glue film 6, wherein the shape and the size of the first point glue film 6 are the same as those of the component point film 5, the part of the first point glue film 6 which is not connected with the positioning point glue 4 is connected with the component point film 5, a plurality of carrier sleeve position holes 7 are symmetrically formed in the carrier film 1, and the carrier sleeve position holes 7 are positioned on two sides of the positioning hole 2.
The component dispensing paste is prepared by the following process:
preparation of transfer film: 1) Taking a first transfer base film, wherein the first transfer base film comprises a first transfer base layer and a first transfer film layer. The first transfer film layer is cut along the length direction to form a transfer groove, and a first adhesive layer is arranged at the bottom of the transfer groove. And taking a first release film, wherein the first release film comprises a first release layer and a first release adhesive layer. Attaching a first release adhesive layer to the surface of the first adhesive layer to form a first composite film; wherein the adhesive force of the first release adhesive layer is smaller than that of the first adhesive layer.
2) Punching the first composite film to obtain a plurality of first sleeve position holes, wherein the first sleeve position holes are positioned on two sides of the transfer groove; die cutting is carried out on the first release film, and waste materials of the first release film after die cutting are recovered, so that a plurality of first positioning points are distributed on the surface of the first adhesive layer;
3) Covering the first positioning point with the second fixing film, pressing, and tearing off the second fixing film; covering the first locating point with the second release film, tearing off the second release film again, so that the first release paper of the first locating point is removed, and leaving the first release adhesive on the surface of the first adhesive layer to form a first adhesive film;
4) And covering the first adhesive points with the first protective film, punching again to obtain a plurality of second sleeve position holes, tearing off the first protective film at the bottom of the transfer groove, pasting the second protective film, and rolling to obtain the transfer film.
Preparing a component film, wherein S1: taking a component substrate film, wherein the component substrate film comprises a first component substrate layer and a second component substrate layer, firstly symmetrically cutting the second component substrate layer along the length direction of the second component substrate layer, tearing off a cutting part to form a component groove, pressing the first component film and the groove bottom of the component groove, and attaching a third release film to the first component film to form a second composite film;
s2: punching the second composite film to obtain a plurality of third set of position holes and a plurality of fourth set of position holes, wherein the third set of position holes are positioned at two sides of the component groove, and the fourth set of position holes are positioned at the bottom of the component groove; die-cutting the third release film and the first component film, and removing waste materials of the third release film and the first component film after die-cutting to enable a plurality of component point films to be arranged at the bottom of the component groove;
s3: and covering the component point film with a third protective film, and rolling to obtain the component film.
Preparation of a carrier film, a: and taking a carrier substrate film, wherein the carrier substrate film sequentially comprises a carrier substrate and a first supporting adhesive layer, and taking a supporting film, wherein the supporting film comprises a protective layer and a supporting layer. The support layer is pressed on the first support adhesive layer, and then the protection layer is recovered. Taking a release film, wherein the release film comprises a second adhesive layer and a release paper layer, and pressing the second adhesive layer on the surface of the supporting layer to form a third composite film;
b: punching and die cutting are carried out on the third composite film, a plurality of carrier sleeve position holes are obtained through punching, a plurality of positioning points and a plurality of positioning holes are obtained through die cutting, hole walls on two opposite sides of the positioning holes are connected with the positioning points, the transfer film is attached to the third composite film, and the attaching position is consistent with the die cutting position; tearing the transfer film to take away the release paper layer, so that the adhesive layer on the surface of the release paper is left on the surface of the positioning point to form a plurality of positioning point adhesives;
c: and then attaching the fourth protective film layer to the surface of the positioning point adhesive, and removing the carrier substrate film to obtain the carrier film.
Component dispensing paste: tearing off the first protective film of the transfer film, tearing off the third protective film of the carrier substrate film, enabling the second positioning holes to be aligned with the carrier positioning holes one by one, enabling the positioning points to be aligned with the first adhesive films one by one, and pressing;
tearing off the second protective film of the component film, enabling the first set of position holes to be aligned with the third set of position holes one by one, enabling the fourth set of position holes to be aligned with the carrier set of position holes one by one, enabling positioning points to be aligned with the component point film one by one, laminating, tearing off the first transfer substrate layer, the first transfer film layer, the first component substrate layer and the second component substrate layer, and winding to obtain the component point adhesive tape.
The present embodiment is only for explanation of the present application and is not to be construed as limiting the present application, and modifications to the present embodiment, which may not creatively contribute to the present application as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present application.
Claims (10)
1. A component dispensing paste is characterized in that: the component dispensing paste comprises a carrier film (1), a plurality of positioning holes (2) are concavely formed in the carrier film, positioning points (3) are connected to the hole walls of the positioning holes (2), positioning point glue (4) are connected to the surfaces of the positioning points (3), component dispensing films (5) are connected to the surfaces of the positioning point glue (4), a first dispensing film (6) is connected to one surface of the positioning point glue (4) away from the positioning point (3), and the first dispensing film (6) is not connected with the parts connected with the positioning point glue (4) and the component dispensing film (5).
2. The component dispensing sticker of claim 1, wherein: the shape and the size of the component point film (5) are consistent with those of the first point film (6).
3. The component dispensing sticker of claim 1, wherein: the carrier film (1) is also symmetrically provided with a plurality of carrier sleeve position holes (7), and the carrier sleeve position holes (7) are positioned at two sides of the positioning holes (2).
4. A process for preparing a component dispensing sticker as claimed in any one of claims 1 to 3, comprising the steps of:
preparation of transfer film: firstly, arranging a transfer groove on a first transfer base film along the length direction of the transfer groove, arranging a first adhesive layer at the bottom of the transfer groove, covering the surface of the first adhesive layer with a first release film, and pressing to form a first composite film; punching the first composite film to obtain a plurality of first set of position holes, wherein the first set of position holes are positioned on two sides of the transfer groove; die cutting is carried out on the first release film, and waste materials of the first release film after die cutting are recovered, so that a plurality of first adhesive films are distributed on the surface of the first adhesive layer; punching the first transfer base film and the first adhesive layer to obtain a plurality of second set of position holes, wherein the second set of position holes are positioned at the bottom of the transfer groove, then attaching a first protective film, and winding to obtain a transfer film;
preparing a component film: firstly, a component substrate film is provided with a component groove along the length direction of the component substrate film, the component substrate film and a first component film are pressed together, the first component film is positioned in the component groove, the first component film is die-cut, and waste of the first component film after die-cutting is recovered, so that a plurality of component point films are distributed at the bottom of the component groove; punching the component substrate film and the first component film to form a third set of position holes, wherein the third set of position holes are positioned on two sides of the component groove; recovering the waste material of the first component film, attaching a third protective film, and rolling to obtain the component film;
the component point films are matched with the first point films one by one;
preparation of a carrier film: firstly laminating a carrier substrate film, a support film and a release film to form a third composite film, punching the third composite film to obtain a plurality of carrier sleeve position holes, die-cutting the support film and the release film, die-cutting to obtain a plurality of positioning points and a plurality of positioning holes, connecting hole walls on two opposite sides of the positioning holes with the positioning points, removing the support film and the release film waste part, enabling an adhesive layer of the release film to be on the surface of the support film to form a plurality of positioning point adhesives, and removing the carrier substrate film to obtain the carrier film;
component dispensing paste: tearing off a second protective film of the transfer film, aligning the second positioning holes with the carrier positioning holes one by one, aligning the positioning points with the first adhesive films one by one, and pressing;
tearing off the third protective film of the component film, so that the first set of position holes are aligned with the third set of position holes one by one, so that the second set of position holes are aligned with the carrier set of position holes one by one, positioning points are aligned with the component point films one by one, pressing and tearing off the transfer substrate film and the component substrate film, and obtaining the component dispensing adhesive tape.
5. The component dispensing paste manufacturing process according to claim 4, wherein the component dispensing paste manufacturing process comprises the following steps of: the first transfer base film includes a first transfer base layer and a first transfer film layer; the first release film comprises a first release layer and a first release adhesive layer.
6. The component dispensing paste manufacturing process according to claim 4, wherein the component dispensing paste manufacturing process comprises the following steps of: the preparation of the transfer film comprises the following preparation steps:
1) Cutting the first transfer film layer along the length direction to form a transfer groove, arranging a first adhesive layer at the bottom of the transfer groove, and attaching the first release adhesive layer to the surface of the first adhesive layer to form a first composite film;
2) Punching the first composite film to obtain a plurality of first set of position holes, wherein the first set of position holes are positioned on two sides of the transfer groove; die cutting is carried out on the first release film, and waste materials of the first release film after die cutting are recovered, so that a plurality of first positioning points are distributed on the surface of the first adhesive layer;
3) Covering the first positioning point with a second fixing film, pressing, and tearing off the second fixing film; covering the first locating point with a second release film, tearing off the second release film again, so that the second release film of the first locating point is removed, and the first release adhesive is left on the surface of the first adhesive layer to form a first point adhesive film;
4) And covering the first adhesive film with a first protective film, punching again to obtain a plurality of second locating holes, tearing off the first protective film, sticking a second protective film, and winding to obtain the transfer film.
7. The process for preparing the component dispensing sticker according to claim 4, wherein the process comprises the following steps: the component substrate film includes a first component substrate layer and a second component substrate layer.
8. The process for preparing the component dispensing sticker according to claim 7, wherein the process comprises the following steps: the preparation of the component film comprises the following preparation steps:
s1: symmetrically cutting the second component substrate layer along the length direction of the second component substrate layer, tearing off a cutting part to form a component groove, pressing the first component film and the groove bottom of the component groove, and attaching a third release film to the first component film to form a second composite film;
s2: punching the second composite film to obtain a plurality of third set of position holes and a plurality of fourth set of position holes, wherein the third set of position holes are positioned on two sides of the component groove, and the fourth set of position holes are positioned at the bottom of the component groove; performing die cutting on the third release film and the first component film, and removing waste materials of the third release film and the first component film after die cutting, so that a plurality of component point films are arranged at the bottom of the component groove;
s3: and covering the component point film with a third protective film, and rolling to obtain the component film.
9. The process for preparing the component dispensing sticker according to claim 4, wherein the process comprises the following steps: in the preparation step of the carrier film, the carrier substrate film sequentially comprises a carrier substrate and a first supporting adhesive layer; the support film comprises a protective layer and a support layer; the release film comprises a second adhesive layer and a release paper layer.
10. The process for preparing the component dispensing paste according to claim 9, wherein the preparation of the carrier film comprises the following preparation steps:
a: laminating the support layer on the first support adhesive layer, recycling the protective layer, and laminating the second adhesive layer on the surface of the support layer to form a third composite film;
b: punching and die cutting are carried out on the third composite film, a plurality of carrier sleeve position holes are obtained through punching, a plurality of positioning points and a plurality of positioning holes are obtained through die cutting, hole walls on two opposite sides of the positioning holes are connected with the positioning points, then the carrier transfer film is attached to the third composite film, and the attaching position is consistent with the die cutting position; tearing the carrier transfer film to take away the release paper layer, so that the adhesive layer on the surface of the release paper is left on the surface of the positioning point to form a plurality of positioning point adhesives;
c: and attaching a fourth protective film layer to the surface of the positioning point adhesive, and removing the carrier substrate film to obtain the carrier film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211711412.7A CN116209237B (en) | 2022-12-29 | 2022-12-29 | Component dispensing paste and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211711412.7A CN116209237B (en) | 2022-12-29 | 2022-12-29 | Component dispensing paste and preparation process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116209237A CN116209237A (en) | 2023-06-02 |
| CN116209237B true CN116209237B (en) | 2023-10-27 |
Family
ID=86515356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211711412.7A Active CN116209237B (en) | 2022-12-29 | 2022-12-29 | Component dispensing paste and preparation process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116209237B (en) |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1249863A1 (en) * | 2000-08-25 | 2002-10-16 | Toray Industries, Inc. | Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it |
| JP2003282650A (en) * | 2002-03-27 | 2003-10-03 | Mitsui Mining & Smelting Co Ltd | Film carrier tape for mounting electronic component, method of manufacturing the same, device of manufacturing the same, protection tape used for the same method |
| TW586533U (en) * | 2002-04-12 | 2004-05-01 | Alliance Material Co Ltd | Protective adhesive film |
| JP2005352557A (en) * | 2004-06-08 | 2005-12-22 | Oji Tac Hanbai Kk | Layered body with circuit element, manufacturing method for ic tag, and manufacturing device |
| JP2007027410A (en) * | 2005-07-15 | 2007-02-01 | Shin Etsu Polymer Co Ltd | Fixed carrier for electronic component and its manufacturing method |
| CN202310465U (en) * | 2011-11-01 | 2012-07-04 | 深圳科宏健科技有限公司 | Connecting adhesive sheet used for automatic paster electronic component material belt |
| CN103200764A (en) * | 2012-01-05 | 2013-07-10 | 佳能元件股份有限公司 | Flexible printed circuit, illumination apparatus, capsule endoscope and vehicle lighting apparatus |
| CN203151939U (en) * | 2012-12-31 | 2013-08-21 | 深圳市一电通实业有限公司 | Connecting pasting sheet of electronic component packaging material tape of SMT automatic paster equipment |
| CN104904331A (en) * | 2012-12-27 | 2015-09-09 | 富士机械制造株式会社 | Splicing-tape feed device and feed method |
| JP2016111155A (en) * | 2014-12-04 | 2016-06-20 | 古河電気工業株式会社 | Tape for wafer processing |
| CN205621711U (en) * | 2016-03-24 | 2016-10-05 | 番禺得意精密电子工业有限公司 | A supporting component for bearing weight of wafer |
| JP6369884B1 (en) * | 2017-09-28 | 2018-08-08 | 株式会社 ベアック | Coverlay film piece sticking device |
| CN109790425A (en) * | 2016-10-03 | 2019-05-21 | 日立化成株式会社 | Conductive film, coiling body, connection structural bodies and connection structural bodies manufacturing method |
| CN211843270U (en) * | 2019-10-08 | 2020-11-03 | 兰考裕德环保材料科技有限公司 | Die cutting device |
| CN113853109A (en) * | 2021-09-08 | 2021-12-28 | 深圳市腾鑫精密电子芯材科技有限公司 | High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components |
| CN114348796A (en) * | 2021-12-31 | 2022-04-15 | 东莞市富颖电子材料有限公司 | Auxiliary bonding structure for silica gel tape and adhesive silica gel tape with auxiliary bonding structure |
| WO2022166663A1 (en) * | 2021-02-08 | 2022-08-11 | 深圳市蓝禾技术有限公司 | Film sticking apparatus and film sticking method |
-
2022
- 2022-12-29 CN CN202211711412.7A patent/CN116209237B/en active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1249863A1 (en) * | 2000-08-25 | 2002-10-16 | Toray Industries, Inc. | Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it |
| JP2003282650A (en) * | 2002-03-27 | 2003-10-03 | Mitsui Mining & Smelting Co Ltd | Film carrier tape for mounting electronic component, method of manufacturing the same, device of manufacturing the same, protection tape used for the same method |
| TW586533U (en) * | 2002-04-12 | 2004-05-01 | Alliance Material Co Ltd | Protective adhesive film |
| JP2005352557A (en) * | 2004-06-08 | 2005-12-22 | Oji Tac Hanbai Kk | Layered body with circuit element, manufacturing method for ic tag, and manufacturing device |
| JP2007027410A (en) * | 2005-07-15 | 2007-02-01 | Shin Etsu Polymer Co Ltd | Fixed carrier for electronic component and its manufacturing method |
| CN202310465U (en) * | 2011-11-01 | 2012-07-04 | 深圳科宏健科技有限公司 | Connecting adhesive sheet used for automatic paster electronic component material belt |
| CN103200764A (en) * | 2012-01-05 | 2013-07-10 | 佳能元件股份有限公司 | Flexible printed circuit, illumination apparatus, capsule endoscope and vehicle lighting apparatus |
| CN104904331A (en) * | 2012-12-27 | 2015-09-09 | 富士机械制造株式会社 | Splicing-tape feed device and feed method |
| CN203151939U (en) * | 2012-12-31 | 2013-08-21 | 深圳市一电通实业有限公司 | Connecting pasting sheet of electronic component packaging material tape of SMT automatic paster equipment |
| JP2016111155A (en) * | 2014-12-04 | 2016-06-20 | 古河電気工業株式会社 | Tape for wafer processing |
| CN205621711U (en) * | 2016-03-24 | 2016-10-05 | 番禺得意精密电子工业有限公司 | A supporting component for bearing weight of wafer |
| CN109790425A (en) * | 2016-10-03 | 2019-05-21 | 日立化成株式会社 | Conductive film, coiling body, connection structural bodies and connection structural bodies manufacturing method |
| JP6369884B1 (en) * | 2017-09-28 | 2018-08-08 | 株式会社 ベアック | Coverlay film piece sticking device |
| CN211843270U (en) * | 2019-10-08 | 2020-11-03 | 兰考裕德环保材料科技有限公司 | Die cutting device |
| WO2022166663A1 (en) * | 2021-02-08 | 2022-08-11 | 深圳市蓝禾技术有限公司 | Film sticking apparatus and film sticking method |
| CN113853109A (en) * | 2021-09-08 | 2021-12-28 | 深圳市腾鑫精密电子芯材科技有限公司 | High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components |
| CN114348796A (en) * | 2021-12-31 | 2022-04-15 | 东莞市富颖电子材料有限公司 | Auxiliary bonding structure for silica gel tape and adhesive silica gel tape with auxiliary bonding structure |
Non-Patent Citations (1)
| Title |
|---|
| 用于柔性液晶显示器件的粘结膜材料研究;董佳垚;许军;;复旦学报(自然科学版)(第06期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116209237A (en) | 2023-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109337600B (en) | Single-sided adhesive with adhesive surface locally free of adhesive and production method thereof | |
| MY128996A (en) | Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same. | |
| TW200920809A (en) | Double-faced pressure-sensitive adhesive sheet | |
| KR20100112117A (en) | Pressure-sensitive adhesive sheet, process for producing the same, and method of applying the same | |
| CN108713247B (en) | Substrate transfer method and substrate transfer apparatus | |
| CN108603077A (en) | Adhesive sheet and its application method | |
| CN114311145A (en) | Method for manufacturing foam die-cutting piece for preventing handle film from being stuck on material belt | |
| CN116209237B (en) | Component dispensing paste and preparation process thereof | |
| JP2002538975A (en) | Dieboard manufacturing method and material and apparatus for implementing the method | |
| JP5789305B2 (en) | Component carrier reel bonding tape | |
| CN113894867B (en) | Rubberizing method of flexible circuit board covering film | |
| KR100494954B1 (en) | Connection tape for square hole punch carrier type taping and method of manufacturing connection tape | |
| CN102009868A (en) | Cutting process of adhesive sticker material | |
| KR100869321B1 (en) | Apparatus for manufacturing protective film for pcb | |
| JP4374046B2 (en) | RFID label | |
| CN108140337B (en) | Label making method and self-coated label | |
| CN106800892B (en) | Foam adhesive tape and sticking jig and sticking method thereof | |
| JP2010260112A (en) | Punching die faceplate | |
| JPH0251756B2 (en) | ||
| CN104159396B (en) | A kind of novel base plate for packaging manufacture method | |
| CN108495900B (en) | Adhesive sheet and its application method | |
| CN114245580B (en) | Golden finger reinforcement manufacturing method of flexible region and reinforcement structure thereof | |
| CN114103189B (en) | Multilayer structure turnover type protective film and production process thereof | |
| JP2535728Y2 (en) | Double-sided adhesive tape | |
| JPS5991174A (en) | Preparation of tape with double-faced adhesive piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |