CN113853109A - High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components - Google Patents
High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components Download PDFInfo
- Publication number
- CN113853109A CN113853109A CN202111053018.4A CN202111053018A CN113853109A CN 113853109 A CN113853109 A CN 113853109A CN 202111053018 A CN202111053018 A CN 202111053018A CN 113853109 A CN113853109 A CN 113853109A
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- Prior art keywords
- pasting
- finished product
- auxiliary material
- punching
- punch
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- 239000000463 material Substances 0.000 title claims abstract description 118
- 238000004080 punching Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000047 product Substances 0.000 claims abstract description 45
- 239000011265 semifinished product Substances 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 230000000712 assembly Effects 0.000 claims abstract description 3
- 238000000429 assembly Methods 0.000 claims abstract description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to an online shopping technology, and provides a high-utilization-rate punching and pasting process for pasting auxiliary materials on an FPC (flexible printed circuit) chip component, which comprises the following steps: s1, preparing a PI material required by punching and pasting, and paving a protective film on the surface of the PI material to obtain an auxiliary material semi-finished product; s2, cutting the designated protective film on the PI material by a circular knife according to the designated specification; s3, selecting punch assemblies with a plurality of different punch shapes for standby; s4, adopt and include the straight machine of pasting that dashes of drift subassembly is right the semi-manufactured goods of auxiliary material once dashes and pastes, obtain with the FPC chip components and parts that have a plurality of different parts article that the drift corresponds pastes the auxiliary material finished product, adopt the straight machine of pasting that dashes of a plurality of different drifts corresponding same drift, through once directly dashing directly to paste can realize making the auxiliary material finished product that pastes that has a plurality of different parts article, and remaining material reuse after cutting, can make full use of material like this, and reduce to make a round trip to change and shut down in dashing, improve the board utilization ratio, reduce the cost of labor.
Description
Technical Field
The invention relates to the technical field of punching and pasting processes, in particular to a high-utilization-rate punching and pasting process for an FPC chip component pasting auxiliary material.
Background
At present, as for the auxiliary materials for pasting the FPC chip components, the auxiliary materials are usually made of sheet PI (polyimide) materials, different components need the auxiliary materials for pasting in different sizes and shapes, in order to save materials in the market, the auxiliary materials are generally manufactured through a direct punching and direct pasting machine, and the auxiliary materials for pasting in different sizes and shapes are manufactured through different punch fittings and are directly pasted for multiple times or are realized through automatic machine suction pasting, so that the auxiliary materials are required to be repeatedly turned around and stopped to finish the pasting, the labor is wasted, the utilization rate of a machine table is low, the total cost of products is high, and the market product competitiveness is weak.
Disclosure of Invention
The invention mainly aims to provide a high-utilization-rate punching and pasting process for pasting auxiliary materials of FPC chip components and aims to solve the technical problem of low equipment utilization rate in the prior art.
Based on the purpose, the invention provides a high-utilization-rate punching and pasting process for pasting auxiliary materials of an FPC chip component, which comprises the following steps:
s1, preparing a PI material required by punching and pasting, and paving a protective film on the surface of the PI material to obtain an auxiliary material semi-finished product;
s2, cutting the designated protective film on the PI material by a circular knife according to the designated specification;
s3, selecting punch assemblies with a plurality of different punch shapes for standby;
and S4, performing one-time punching and pasting on the auxiliary material semi-finished product by adopting a direct punching and direct pasting machine comprising the punch assembly to obtain an FPC chip component pasting auxiliary material finished product which corresponds to the punch and is provided with a plurality of different parts.
Further, the protection film includes from the type membrane and glues the protection film a little, in step S1, will lay from the type membrane in PI material surface just is located towards the one side of drift subassembly, will glue the protection film a little and lay in PI material surface just is located with the another side that the drift subassembly is relative.
Further, the step S4 includes:
starting the equipment, and setting punching parameters on a control interface;
feeding, namely feeding the auxiliary material semi-finished product into a feeding table of the direct punching and direct sticking machine;
positioning and feeding, namely conveying the auxiliary material semi-finished product to the lower part of the punch assembly and positioning;
punching and pasting, wherein the punch assembly is controlled to punch the auxiliary material semi-finished product to form a pasting auxiliary material finished product;
discharging, and conveying the finished product of the pasting auxiliary materials out of a feeding table.
And further, removing the protective film at the position corresponding to the part on the finished product of the pasting auxiliary material, cutting the finished product of the pasting auxiliary material after the protective film is removed according to a preset specification, and remaining the reusable semi-finished product of the auxiliary material.
Furthermore, a specified positioning hole is arranged in the finished product of the pasting auxiliary material.
Further, the punch assembly comprises a punch and a plurality of punches with different shapes, and a plurality of punch slide ways matched with the punches are arranged inside the punch.
The invention has the beneficial effects that: the direct punching and direct sticking machine is characterized in that a plurality of different punches correspond to the same punch, products with various parts can be manufactured through one-time direct punching and direct sticking, namely, finished sticking auxiliary materials with parts with various sizes and shapes can be manufactured through one-time direct punching and direct sticking, and residual materials of the finished products after cutting can be reused.
Drawings
FIG. 1 is a schematic structural diagram of a finished product of a pasting auxiliary material in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a semi-finished product of the auxiliary bonding material according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a punch according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solution of the present invention will be described in further detail with reference to specific embodiments.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present patent and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The high-utilization-rate punching and pasting process for the auxiliary materials for pasting the FPC chip components in the embodiment comprises the following steps of:
s1, preparing the needed PI material 22, and paving a protective film on the surface of the PI material 22 to obtain an auxiliary material semi-finished product;
s2, cutting the designated protective film on the PI material 22 by a circular knife according to the designated specification;
s3, selecting a punch head 31 assembly with a plurality of different punch shapes for standby;
and S4, performing one-time punching and pasting on the auxiliary material semi-finished product by adopting a direct punching and direct pasting machine comprising the punch 31 assembly to obtain the FPC chip component pasting auxiliary material finished product 1 which corresponds to the punch and is provided with a plurality of different parts 11.
The finished product 1 of the auxiliary pasting material may include a plurality of different parts 11 or a plurality of identical parts 11 or one part 11, and the present invention is not limited thereto, in this embodiment, the process may manufacture a plurality of different parts 11 each time, the plurality of different parts 11 are all concentrated in the finished product 1 of the auxiliary pasting material, each part 11 is also a product of the auxiliary pasting material, and each product of the auxiliary pasting material corresponds to one FPC chip component.
Firstly, preparing a PI material 22 required for punching and pasting, wherein the PI material 22 is in a sheet shape, then respectively paving protective films on two sides of the sheet PI material 22 to prevent the PI material 22 from being polluted and polluted or scraping, referring to fig. 2, the protective films can comprise a release film 21 and a slight-adhesion protective film 23, and the release film 21 and the slight-adhesion protective film 23 are respectively paved on two sides of the sheet PI material 22 to obtain the auxiliary material semi-finished product.
Through the cutter cut the protection film according to appointed specification or level, in this embodiment, the accessible circular knife is to cutting from type membrane 21, and above-mentioned appointed specification can set up according to actual conditions, for example set up according to 11 size numbers of parts etc. or set up according to the condition of reuse surplus auxiliary material semi-manufactured goods.
And then selecting a punch 31 assembly provided with a plurality of different punch shapes for standby, wherein the punch 31 assembly is an accessory for manufacturing the auxiliary material finished product 1 by a direct punching and direct sticking machine, and the direct punching and direct sticking machine punches the auxiliary material semi-finished product by controlling the punch 31 assembly so that the PI material 22 is attached to the micro-adhesive protective film 23 to obtain the auxiliary material finished product 1. Referring to fig. 1, the auxiliary material product 1 includes a plurality of components 11 corresponding to the shape of the punch, and the shape and size of each of the different components 11 can be set according to the actual situation. After selecting a proper punch 31 component, the auxiliary material semi-finished product is subjected to one-step punching and pasting through a direct punching and direct pasting machine, and the FPC chip component pasting auxiliary material finished product 1 with a plurality of different parts 11 is obtained.
In this embodiment, referring to the punch 31 in fig. 3, the punch 31 assembly includes a punch 31 and a plurality of punches with different shapes, a plurality of punch slideways 32 adapted to correspond to the punches are arranged inside the punch 31, and during operation, the plurality of punches press downwards along the punch slideways 32, so that the sheet PI material 22 corresponding to the punch position is attached to the slightly-adhesive protective film 23 to form a plurality of parts 11, thereby obtaining the finished product 1 of the auxiliary adhesive material.
The step S4 includes:
starting the equipment, and setting punching parameters on a control interface;
feeding, namely feeding the auxiliary material semi-finished product into a feeding table of the direct punching and direct sticking machine;
positioning and feeding, namely conveying the auxiliary material semi-finished product to the position below the punch 31 component and positioning;
punching and pasting, wherein the punch 31 component is controlled to punch the auxiliary material semi-finished product to form the pasting auxiliary material finished product 1;
discharging, and sending the finished product 1 of the pasting auxiliary materials out of a feeding table.
In this embodiment, the device is a direct punching and direct sticking machine, after the device is started, the interface device is operated to punch and stick parameters, which include punching time, feeding speed, cycle pause time, feeding quantity, and the like, then the feeding is performed, that is, a semi-finished auxiliary material product is placed on a feeding table of the direct punching and direct sticking machine, the feeding table conveys the semi-finished auxiliary material product to the position below the punch 31, the position of the feeding table is adjusted to ensure that the semi-finished auxiliary material product is in a proper punching and sticking position, and then the punch 31 assembly of the control device punches the semi-finished auxiliary material product to form a finished adhesive auxiliary material product 1.
In this embodiment, the protective film corresponding to the position of the part 11 on the auxiliary material finished product 1 is removed, the auxiliary material finished product 1 from which the protective film is removed is cut according to a preset specification, that is, the auxiliary material product corresponding to each FPC chip component in the auxiliary material finished product 1 is cut, and auxiliary material semi-finished products without the part 11 are left, and these auxiliary material semi-finished products can be reused, that is, the auxiliary material semi-finished products are directly punched and directly attached by a direct punching and direct attaching machine, and then the corresponding auxiliary material finished product 1 is obtained, so that the material cost is saved. Further, the pasting auxiliary material finished product 1 is provided with a designated positioning hole 12 for accurate positioning.
The high-utilization-rate punching and pasting process for the FPC chip component pasting auxiliary materials adopts a direct punching and direct pasting machine with a plurality of different punches corresponding to the same punch 31, can manufacture products of various parts 11 through one-time direct punching and direct pasting, namely can manufacture finished products 1 of the pasting auxiliary materials of the parts 11 with various sizes and shapes through one-time direct punching and direct pasting, and the residual materials of the finished products after cutting can be reused, so that the materials can be fully utilized, the back-and-forth turnover and halt in punching and pasting can be reduced, the utilization rate of a machine table is improved, the labor cost is reduced, the cost is optimized to the lowest level, and the enterprise competitiveness is improved.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The high-utilization-rate punching and pasting process for the auxiliary materials for pasting the FPC chip component is characterized by comprising the following steps of:
s1, preparing a PI material required by punching and pasting, and paving a protective film on the surface of the PI material to obtain an auxiliary material semi-finished product;
s2, cutting the designated protective film on the PI material by a circular knife according to the designated specification;
s3, selecting punch assemblies with a plurality of different punch shapes for standby;
and S4, performing one-time punching and pasting on the auxiliary material semi-finished product by adopting a direct punching and direct pasting machine comprising the punch assembly to obtain an FPC chip component pasting auxiliary material finished product which corresponds to the punch and is provided with a plurality of different parts.
2. The high-utilization-rate punching and pasting process for the auxiliary materials for pasting the FPC chip component as claimed in claim 1, wherein the protective film comprises a release film and a micro-sticking protective film, in the step S1, the release film is laid on the surface of the PI material and positioned towards one surface of the punch assembly, and the micro-sticking protective film is laid on the surface of the PI material and positioned on the other surface opposite to the punch assembly.
3. The high-utilization-rate punching and pasting process for the FPC chip component pasting auxiliary material according to claim 1, wherein the step S4 comprises the following steps:
starting the equipment, and setting punching parameters on a control interface;
feeding, namely feeding the auxiliary material semi-finished product into a feeding table of the direct punching and direct sticking machine;
positioning and feeding, namely conveying the auxiliary material semi-finished product to the lower part of the punch assembly and positioning;
punching and pasting, wherein the punch assembly is controlled to punch the auxiliary material semi-finished product to form a pasting auxiliary material finished product;
discharging, and conveying the finished product of the pasting auxiliary materials out of a feeding table.
4. The high-utilization-rate punching and pasting process for the FPC chip component pasting auxiliary material according to claim 3, wherein the protective film at the position of the corresponding part on the pasting auxiliary material finished product is removed, the pasting auxiliary material finished product with the protective film removed is cut according to a preset specification, and a reusable auxiliary material semi-finished product is remained.
5. The high-utilization-rate punching and pasting process for the FPC chip component pasting auxiliary material according to claim 1, wherein specified positioning holes are formed in a finished product of the pasting auxiliary material.
6. The high-utilization-rate punching and pasting process for the auxiliary materials for pasting the FPC chip component as claimed in claim 1, wherein the punch assembly comprises a punch and a plurality of punches in different shapes, and a plurality of punch slide ways matched with the punches are arranged inside the punch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053018.4A CN113853109A (en) | 2021-09-08 | 2021-09-08 | High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053018.4A CN113853109A (en) | 2021-09-08 | 2021-09-08 | High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components |
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| Publication Number | Publication Date |
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| CN113853109A true CN113853109A (en) | 2021-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111053018.4A Pending CN113853109A (en) | 2021-09-08 | 2021-09-08 | High-utilization-rate punching and pasting process for auxiliary materials for pasting FPC chip components |
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| CN (1) | CN113853109A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116209237B (en) * | 2022-12-29 | 2023-10-27 | 东莞市富颖电子材料有限公司 | Component dispensing paste and preparation process thereof |
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| JP2001052837A (en) * | 1999-08-13 | 2001-02-23 | Toshiba Corp | Sheet-pressed component and its manufacture |
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| CN209562937U (en) * | 2018-09-07 | 2019-10-29 | 苏州市东苏发五金粘胶制品有限公司 | A kind of fitting FPC plate rushes patch all-in-one machine |
| CN112829317A (en) * | 2019-11-25 | 2021-05-25 | 昊佰电子科技（上海）有限公司 | Die cutting piece processing system of accurate laminating is taken to shipment |
| CN112847549A (en) * | 2019-11-27 | 2021-05-28 | 昊佰电子科技（上海）有限公司 | Glue overflow-free punching method for double-sided adhesive tape product of ultrathin non-woven fabric substrate |
-
2021
- 2021-09-08 CN CN202111053018.4A patent/CN113853109A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10116858A (en) * | 1996-10-08 | 1998-05-06 | Mitsui High Tec Inc | Production of bga type semiconductor device |
| JP2001052837A (en) * | 1999-08-13 | 2001-02-23 | Toshiba Corp | Sheet-pressed component and its manufacture |
| CN105491802A (en) * | 2015-12-31 | 2016-04-13 | 深圳市鑫美威自动化设备有限公司 | Multi-head automatic switching type stamping and mounting system |
| CN206394191U (en) * | 2016-12-31 | 2017-08-11 | 深圳市腾鑫精密胶粘制品有限公司 | A kind of mould for plastics |
| CN209562937U (en) * | 2018-09-07 | 2019-10-29 | 苏州市东苏发五金粘胶制品有限公司 | A kind of fitting FPC plate rushes patch all-in-one machine |
| CN112829317A (en) * | 2019-11-25 | 2021-05-25 | 昊佰电子科技（上海）有限公司 | Die cutting piece processing system of accurate laminating is taken to shipment |
| CN112847549A (en) * | 2019-11-27 | 2021-05-28 | 昊佰电子科技（上海）有限公司 | Glue overflow-free punching method for double-sided adhesive tape product of ultrathin non-woven fabric substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116209237B (en) * | 2022-12-29 | 2023-10-27 | 东莞市富颖电子材料有限公司 | Component dispensing paste and preparation process thereof |
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Application publication date: 20211228 |
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