CN108207078A - Improve the manufacture craft that rigid-flex combined board takes off lid leak - Google Patents
Improve the manufacture craft that rigid-flex combined board takes off lid leak Download PDFInfo
- Publication number
- CN108207078A CN108207078A CN201711473602.9A CN201711473602A CN108207078A CN 108207078 A CN108207078 A CN 108207078A CN 201711473602 A CN201711473602 A CN 201711473602A CN 108207078 A CN108207078 A CN 108207078A
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- China
- Prior art keywords
- knife
- rigid
- prepreg
- flex combined
- combined board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention proposes a kind of manufacture craft for improving rigid-flex combined board and taking off lid leak, and step is as follows：(1) prepreg pre-treatment：Prepreg sawing sheet, back of the body isolation film, drilling and punching are carried out successively；(2) fine copper pre-treatment：Sawing sheet and drilling processing are carried out to fine copper；(3) rigid-flex combined board makes：Sawing sheet is carried out successively, drilling, patch dry film, exposure, development, is etched, is moved back film, paste epiphragma, false folded, lamination, X Ray, drilling, PTH, copper facing, patch dry film, exposure, development, etch, moves back film, AOI, welding resistance pre-treatment, welding resistance printing, welding resistance exposure, welding resistance development, curing, first time stamp, second of stamp, takes off lid, surface treatment, lettering symbol, external form, patch steel disc, pressing, electrical measurement, the operation of FQC, packaging, it can effectively prevent half cutting depth is too deep to hurt flexible electric circuit board, water is made to be not easy to penetrate into below isolation film, has saved cost.
Description
Technical field
The present invention relates to a kind of manufacture crafts, and in particular to a kind of manufacture craft for improving rigid-flex combined board and taking off lid leak.
Background technology
As electronic product is towards frivolous, short and small, multifunction development, the wiring board needed should rigid printed board
Welding stability, have flexible printed wiring flexible again, such rigid-flex combined board is main development trend.It is but flexible
Printed wiring board meeting ground pad or other component pads usually on flexible electric circuit board.Ground pad or other members
Device bonding pad covers pad on otherwise flex plate and can be eclipsed doing the protection of outer-layer circuit needs in the middle layer positioned at layer structure
Quarter is fallen.Protection cap accomplishes to fall protection cap, but plate thickness≤0.3mm rigid-flex combined boards half with tearing with after laser hemisection during finished product again
Cured thickness≤0.05mm makes, and because laser hemisection tolerance is ± 0.02mm, the too shallow protection cap of half cutting depth is taken off, half cutting-in
It spends deeply and easily occurs being broken when cut wound flex plate is bent to assembling.And this cut wound can not detect before assembling.
Invention content
The present invention proposes a kind of manufacture craft for improving rigid-flex combined board and taking off lid leak regarding to the issue above, can be effective
It prevents half cutting depth is too deep from hurting flexible electric circuit board, water is made to be not easy to penetrate into below isolation film, has saved cost.
Specific technical solution is as follows：
Improve the manufacture craft that rigid-flex combined board takes off lid leak, step is as follows：
(1) prepreg pre-treatment：Prepreg sawing sheet, back of the body isolation film, drilling and punching are carried out successively, wherein, punching
It is rushed to carry out half to prepreg by cutting die self-isolation film, cutting die includes high knife and low knife, and low knife is high for thrusting isolation film
Knife is used to thrust prepreg；
(2) fine copper pre-treatment：Sawing sheet and drilling processing are carried out to fine copper；
(3) rigid-flex combined board makes：Sawing sheet is carried out successively, drilling, patch dry film, exposure, development, is etched, is moved back film, pastes lid
Film, X-Ray, drilling, PTH, copper facing, patch dry film, exposure, development, etches, moves back film, AOI, welding resistance pre-treatment, resistance false folded, lamination
Weldering printing, welding resistance exposure, welding resistance development, curing, first time stamp, second of stamp, take off lid, surface treatment, lettering accord with, outside
Type, patch steel disc, pressing, electrical measurement, the operation of FQC, packaging.
Above-mentioned improvement rigid-flex combined board takes off the manufacture craft of lid leak, wherein, the cutting die in step (1) is included in cuboid
The low knife of frame structure setting, several high knives of setting being respectively separated in two long sides of low knife, in two long sides of low knife
High knife is staggered.
Above-mentioned improvement rigid-flex combined board takes off the manufacture craft of lid leak, wherein, high knife and the low knife of the cutting die in step (1)
Between difference in height h1 be equal to prepreg thickness h 2.
Above-mentioned improvement rigid-flex combined board takes off the manufacture craft of lid leak, wherein, step (3) first time stamp rushes for second
Type obtains protection cap, and there are the punching gaps of 0.1mm between the high knife place of thrusting and protection cap on prepreg.
Above-mentioned improvement rigid-flex combined board takes off the manufacture craft of lid leak, wherein, the exposure area in step (3) is located at protection
The lower section of lid.
Above-mentioned improvement rigid-flex combined board takes off the manufacture craft of lid leak, wherein, the difference in height h1 between high knife and low knife is
0.06mm。
Beneficial effects of the present invention are：
The glass in prepreg is thrust using the high knife in part, by gap being met to close by what is gone out again after pressing glue fusing
It closes, such water is just not easy to penetrate into below isolation film；
Increase the pulling force of protection cap to punching gap extension 0.1mm with the copper in protection cap, avoid taking plate in production process
It gaps and splits, water is made to penetrate into below isolation film；
It is rushed with cutting die half, is significantly improved than laser cutting efficiency.
In conclusion the present invention can effectively prevent half cutting depth is too deep to hurt flexible electric circuit board, make water be not easy to penetrate into every
From below film, cost has been saved.
Description of the drawings
Fig. 1 is punched schematic diagram for prepreg.
Fig. 2 is exposure area schematic diagram.
Fig. 3 is first time stamp schematic diagram.
Fig. 4 is second of stamp schematic diagram.
Fig. 5 is A portions protection cap magnified partial view in Fig. 2.
Fig. 6 is cutting die vertical view.
Fig. 7 is cutting die side view.
Specific embodiment
For technical scheme of the present invention is made to be more clear clearly, the present invention is described further below in conjunction with the accompanying drawings,
Any technical characteristic to technical solution of the present invention carries out the scheme that equivalencing is obtained with conventional reasoning and each falls within guarantor of the present invention
Protect range.
Reference numeral
Prepreg 1, back of the body isolation film 2, low knife 3, high knife 4, protection cap 5.
As shown in the figure, improving the manufacture craft that rigid-flex combined board takes off lid leak, step is as follows：
(1) prepreg pre-treatment：1 sawing sheet of prepreg, back of the body isolation film 2, drilling and punching are carried out successively, wherein, punching
It is cut to and half punching is carried out to prepreg by cutting die self-isolation film, cutting die includes high knife and low knife, as shown in Figure 1, low knife 3 is used for
Isolation film is thrust, high knife 4 is used to thrust prepreg；
(2) fine copper pre-treatment：Sawing sheet and drilling processing are carried out to fine copper；
(3) rigid-flex combined board makes：Sawing sheet is carried out successively, drilling, patch dry film, exposure, development, is etched, is moved back film, pastes lid
Film, X-Ray, drilling, PTH, copper facing, patch dry film, exposure, development, etches, moves back film, AOI, welding resistance pre-treatment, resistance false folded, lamination
Weldering printing, welding resistance exposure, welding resistance development, curing, first time stamp, second of stamp, take off lid, surface treatment, lettering accord with, outside
Type, patch steel disc, pressing, electrical measurement, the operation of FQC, packaging.
As shown in Figure 6, Figure 7, the cutting die in step (1) include in cuboid framework structure setting low knife, the two of low knife
Several high knives of setting being respectively separated in a long side, the high knife in two long sides of low knife are staggered.
Difference in height h1 between the high knife and low knife of cutting die in step (1) is equal to the thickness h 2 of prepreg；High knife with
Difference in height h1 between low knife is 0.06mm.
As shown in Fig. 3, Fig. 4, Fig. 5, step (3) first time stamp, second of stamp obtain protection cap 5, on prepreg
The high knife place of thrusting and protection cap between there are 0.1mm punching gap.
As shown in Fig. 2, the exposure area in step (3) is located at the lower section of protection cap.
Claims (6)
1. improve the manufacture craft that rigid-flex combined board takes off lid leak, it is characterized in that, step is as follows：
(1) prepreg pre-treatment：Prepreg sawing sheet, back of the body isolation film, drilling and punching are carried out successively, wherein, it is punched to lead to
It crosses cutting die self-isolation film and carries out half punching to prepreg, cutting die includes high knife and low knife, and low knife is used to thrust isolation film, Gao Daoyong
In thrusting prepreg；
(2) fine copper pre-treatment：Sawing sheet and drilling processing are carried out to fine copper；
(3) rigid-flex combined board makes：Successively carry out sawing sheet, drilling, patch dry film, exposure, development, etch, move back film, paste epiphragma,
Vacation is folded, lamination, X-Ray, drilling, PTH, copper facing, patch dry film, exposure, development, etches, moves back film, AOI, welding resistance pre-treatment, welding resistance
Printing, welding resistance exposure, welding resistance development, curing, first time stamp, second of stamp, take off lid, surface treatment, lettering symbol, external form,
Paste steel disc, pressing, electrical measurement, the operation of FQC, packaging.
2. improve the manufacture craft that rigid-flex combined board takes off lid leak as described in claim 1, it is characterized in that, in step (1)
Cutting die includes the low knife in cuboid framework structure setting, and several high knives of setting being respectively separated in two long sides of low knife are low
High knife in two long sides of knife is staggered.
3. improve the manufacture craft that rigid-flex combined board takes off lid leak as described in claim 1, it is characterized in that, in step (1)
Difference in height h1 between the high knife and low knife of cutting die is equal to the thickness h 2 of prepreg.
4. improve the manufacture craft that rigid-flex combined board takes off lid leak as described in claim 1, it is characterized in that, step (3) first
Secondary stamp, second of stamp obtain protection cap, and there are the punchings of 0.1mm between the high knife place of thrusting and protection cap on prepreg
Gap.
5. improve the manufacture craft that rigid-flex combined board takes off lid leak as claimed in claim 4, it is characterized in that, in step (3)
Exposure area is located at the lower section of protection cap.
6. improving rigid-flex combined board as described in claim 1 takes off the manufacture craft of lid leak, it is characterized in that, high knife and low knife it
Between difference in height h1 be 0.06mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711473602.9A CN108207078A (en) | 2017-12-29 | 2017-12-29 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711473602.9A CN108207078A (en) | 2017-12-29 | 2017-12-29 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108207078A true CN108207078A (en) | 2018-06-26 |
Family
ID=62605095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711473602.9A Pending CN108207078A (en) | 2017-12-29 | 2017-12-29 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108207078A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN113905542A (en) * | 2021-09-30 | 2022-01-07 | 信丰迅捷兴电路科技有限公司 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Fabrication method for rigid-flex printed combination board of covering membrane window |
| CN104470251A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Manufacturing method of soft and hard combined board |
| CN105246274A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Preparation method for four layer rigid-flex combination board with thickness over 0.32 mm and plugging handle in middle |
| CN106535510A (en) * | 2016-11-15 | 2017-03-22 | 景旺电子科技(龙川)有限公司 | Method for producing rigid-flex PCB lid |
-
2017
- 2017-12-29 CN CN201711473602.9A patent/CN108207078A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Fabrication method for rigid-flex printed combination board of covering membrane window |
| CN104470251A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Manufacturing method of soft and hard combined board |
| CN105246274A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Preparation method for four layer rigid-flex combination board with thickness over 0.32 mm and plugging handle in middle |
| CN106535510A (en) * | 2016-11-15 | 2017-03-22 | 景旺电子科技(龙川)有限公司 | Method for producing rigid-flex PCB lid |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN112888200B (en) * | 2021-01-21 | 2023-03-14 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN113905542A (en) * | 2021-09-30 | 2022-01-07 | 信丰迅捷兴电路科技有限公司 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
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Application publication date: 20180626 |