CN113905542A - Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof - Google Patents
Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof Download PDFInfo
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- CN113905542A CN113905542A CN202111161093.2A CN202111161093A CN113905542A CN 113905542 A CN113905542 A CN 113905542A CN 202111161093 A CN202111161093 A CN 202111161093A CN 113905542 A CN113905542 A CN 113905542A
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- circuit board
- flexible
- copper foil
- rigid
- protective film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a soft and hard combined circuit board for solving air expansion of a cavity during plasma cleaning and a processing technology thereof, and relates to the technical field of printed circuit boards, wherein the circuit board comprises a circuit board body, the circuit board body comprises a flexible substrate, the flexible substrate is symmetrically provided with first copper foil layers, covering films are attached to the first copper foil layers, and strippable protective films are attached to the outer sides of the covering films; laminating and laser depth control cutting are respectively carried out on the circuit board body corresponding to the positions of the two sides of the strippable protective film to form flexible regions; according to the invention, the non-flowing prepreg used for interlayer lamination is hollowed out by 1mm close to the flexible area in advance, and the prepregs in other areas are reserved so as to be used for filling the cavity area. Because the strippable protective film is pasted between the prepreg and the flexible substrate, after the lamination, the low-flow glue of the prepreg fills the hollow area, so that the problem of air residue is solved in a complete filling state of the cavity area, and the phenomenon of cavity layering caused by air pressure difference in the plasma process is avoided.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a rigid-flexible circuit board for solving air expansion of a cavity during plasma cleaning and a processing technology thereof.
Background
The rigid-flex circuit board is also called a flexible-rigid circuit board, and is widely applied by arbitrary bending and three-dimensional installation
In all flex-rigid circuit board laminate structures, No Flow prepregs are required. In the structure of the rigid-flex circuit, the No Flow prepreg is adjacent to the flexible substrate, and meanwhile, the No Flow prepreg in the flexible bending area is removed by laser or machinery, so that the aim of preventing the prepreg from being bonded with the flexible substrate during high-temperature lamination is mainly achieved. After the prepreg of the flexible area is removed, the area will form a cavity after lamination, and the larger the flexible area is, the larger the cavity is.
In the process of manufacturing the rigid-flex circuit board, the flexible substrate is a PI (polyimide) film, so that hole wall drilling dirt and resin residues are caused by hole wall fibrosis of a drilled hole. Therefore, the walls of the holes must be cleaned using plasma, which is a process of removing all organic substances from the surface of the material using an ionized gas called plasma, typically oxygen and argon in a vacuum chamber. The prepreg can form the cavity after the pressfitting, and the residual atmosphere air in its cavity can make the air lead to the inflation and lead to the layering phenomenon because of the pressure phase difference is big under plasma vacuum environment, in the circuit board, can lead to the conducting hole pore wall fracture to scrap after the layering, simultaneously, when chemical copper deposition, liquid medicine can be followed the conducting hole and passed through layering region and enter into the cavity in, when drying and washing, can't dry the liquid medicine in the cavity. If part of the pcs substrate is not layered, the liquid medicine remained in the cavity flows back to the plate to corrode the copper on the surface of the hole.
At present, two methods are mainly adopted to solve the problem:
the first method comprises the following steps: that is, before plasma, a vent hole is drilled in the cavity area, but after plasma, the hole needs to be sealed by an acid and alkali resistant liquid medicine adhesive tape, and 100% of the hole needs to be free of liquid medicine permeation, otherwise the liquid medicine enters the cavity from the vent hole. In addition, after the tape is attached, the thickness of the area is higher than that of the board surface, and when a photo-imaging film pressing and exposure are carried out, the hidden troubles of unreal film pressing and poor exposure are brought due to the fact that the board surface is uneven.
The second method comprises the following steps: in the process, before plasma is removed, a rigid layer of a copper foil or a flexible area is removed in a depth-controlled laser cutting or mechanical mode, although the method solves the problem of air expansion of a cavity area in a plasma process, a polyimide tape and a part of a covering film attached to the covering film are exposed, the distance between the area where the polyimide tape is attached by the method and a soft and hard joint is 0.2mm-1.0mm, therefore, an actual covering film is exposed at the outer 0.2mm-1.0mm, and the covering film in the area is bitten when plasma removes glue and chemical copper, so that potential reliability hazards are caused. In addition, the polyimide tape is a strippable protective tape, and the protective tape and the cover film have no binding force, so that in a chemical treatment process after plasma, liquid medicine can permeate between the polyimide tape and the cover film and cannot be dried by drying equipment of a cleaning line, and secondary corrosion to the surface of the cover film for a long time is caused. Meanwhile, due to the fact that the copper foil of the flexible area is removed in advance, a pit is formed in the area, in the light imaging film pressing process, the dry film is broken due to the drop at the edge of the pit, and therefore connection open circuit and a bonding pad gap are caused due to dry film residues, and serious hidden danger is caused to quality.
Disclosure of Invention
In order to solve the problems in the prior art, the invention solves the problem of cavity area layering caused by air pressure difference in the plasma process by performing laser cutting and hollowing on two side surfaces of the non-flowing semi-immobilized sheet for 1mm before pressing each layer structure of the circuit board. The invention specifically adopts the following technical scheme:
the circuit board comprises a circuit board body, wherein the circuit board body comprises a flexible substrate, first copper foil layers are symmetrically arranged on the front surface and the back surface of the flexible substrate, cover films are attached to the outer sides of the two first copper foil layers, and peelable protective films are attached to the outer sides of the two cover films;
laminating and laser depth control cutting are respectively carried out on the circuit board body corresponding to the positions of the two sides of the peelable protective film to form flexible regions, and the circuit board body positioned on the two sides of the flexible regions forms rigid regions;
after the peelable protective film is peeled off and the circuit board body of the flexible area is removed, the cover film positioned in the flexible area can be exposed.
Further, the distance between each side of the peelable protective film and the joint of the flexible area and the rigid area on the same side of the peelable protective film is 0.5mm-1 mm.
The outer sides of the two first copper foil layers are respectively provided with a non-flowing prepreg layer, the outer sides of the two non-flowing prepreg layers are respectively provided with a second copper foil layer, the outer sides of the two second copper foil layers are respectively provided with an FR-4 substrate layer, and the outer sides of the two FR-4 substrate layers are respectively provided with a third copper foil layer;
the flexible substrate, the first copper foil layer, the no-flow prepreg layer, the second copper foil layer, the FR-4 substrate layer and the third copper foil layer are sequentially overlapped from bottom to top and then are firmly combined through lamination.
According to a further scheme, two side faces of the two non-flowing prepreg layers are hollowed along the height direction of the two non-flowing prepreg layers, and the hollowed width is 1mm.
The strippable protective film is a polyimide strippable protective film.
The invention also provides a processing technology of the circuit board, which comprises the following steps:
s1: browning the circuit board body after covering films are attached to the outer sides of the two first copper foil layers;
s2: attaching peelable protective films to the outer sides of the two cover films;
s3: cutting the strippable protective film in a laser control depth mode;
s4: cutting off the rigid plate in the flexible area in a laser control deep cutting mode, wherein the laser cutting depth is three quarters of that of the FR-4 substrate;
s5: using laser cutting to make the non-flowing prepreg close to the rigid area hollow by 1 mm:
s6: the flexible substrate, the first copper foil layer, the no-flow prepreg layer, the second copper foil layer, the FR-4 substrate layer and the third copper foil layer are sequentially overlapped from bottom to top and then are firmly combined through lamination;
s7: after pressing, the cavity area is filled with prepreg.
Further, the peelable protective film described in S3 may not be cut to the cover film.
Further, when the rigid plate of the flexible region is cut off by laser controlled depth cutting as described in S4, it is necessary to confirm the cutting of the first piece.
The invention has the beneficial effects that:
according to the invention, the non-flowing prepreg used for interlayer lamination is hollowed out by 1mm close to the flexible area in advance, and the prepregs in other areas are reserved so as to be used for filling the cavity area. After the lamination, the hollow area is filled with the low-flow glue of the prepreg, and the strippable protective film is attached between the prepreg and the flexible substrate, so that the problem of air residue is solved in a complete filling state of the cavity area, and the phenomenon of cavity layering caused by air pressure difference in a plasma process is avoided.
And after finishing all manufacturing processes of the circuit board and before finishing the finished product, removing the outer layer FR-4 of the flexible region by depth control cutting to finish the manufacturing of the rigid-flexible combined circuit board.
Drawings
FIG. 1 is a schematic structural view of a circuit board without processing in accordance with the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
FIG. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present invention after being processed by the processing technology of the embodiment;
the attached drawings are marked as follows: 1-a rigid region; 2-a flexible zone; 10-a flexible substrate; 11-a first copper foil layer; 12-no flow prepreg layer; 13-a second copper foil layer; 14-FR-4 substrate layer; 15-a third copper foil layer; 3-covering the membrane; and 4, stripping the protective film.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1 to 3, an embodiment 1 of the present invention discloses a rigid-flex circuit board for solving air expansion of a cavity when plasma cleaning is performed, including a circuit board body;
the circuit board body comprises a flexible substrate 10, first copper foil layers 11 are symmetrically arranged on the front surface and the back surface of the flexible substrate 10, cover films 3 are attached to the outer sides of the two first copper foil layers 11, and peelable protective films 4 are attached to the outer sides of the two cover films 3;
laminating and laser depth control cutting are respectively carried out on the positions of the circuit board body corresponding to the two sides of the peelable protective film 4 to form flexible regions 2, and rigid regions 1 are formed on the circuit board body positioned on the two sides of the flexible regions 2;
after the peelable protective film 4 is peeled off and the circuit board body of the flexible region is removed, the cover film in the flexible region is exposed.
Since the lamination temperature is at least 200 ℃ or higher, a peelable protective film that can resist high temperature and has low viscosity needs to be selected. The high temperature resistance of the protective film is over 400 ℃, and the required characteristics of the strippable protective film in the embodiment are completely met, but the strippable protective film in the application is not limited to the polyimide strippable protective film. The peelable protective film of this embodiment needs to be completely attached to the cover film.
In this embodiment 1, in order to avoid the phenomenon that the peelable protective film cannot be removed due to the deviation when the rigid segment of the flexible region is removed by depth control cutting or mechanical routing, the distance between both sides of the peelable protective film 4 and the joint of the flexible region 2 and the rigid region 1 on the same side thereof is 0.5mm to 1mm.
In this embodiment 1, the external sides of two first copper foil layers 11 are respectively provided with a no-flow prepreg layer 12, the external sides of two no-flow prepreg layers 12 are respectively provided with a second copper foil layer 13, the external sides of two second copper foil layers 13 are respectively provided with FR-4 substrate layers 14, and the external sides of two FR-4 substrate layers 14 are respectively provided with a third copper foil layer 15;
the flexible substrate 10, the first copper foil layer 11, the no-flow prepreg layer 12, the second copper foil layer 13, the FR-4 substrate layer 14, and the third copper foil layer 15 are laminated in this order from the bottom to the top, and then are firmly bonded by lamination.
In example 1, both side surfaces of both the no-flow prepreg layers 12 were hollowed out in the height direction thereof. In the embodiment, the flexible region forms a cavity after lamination by hollowing out the two sides of the non-flowing prepreg layer.
An embodiment 2 of the invention discloses a processing technology of a soft and hard combined circuit board for solving the air expansion of a cavity during plasma cleaning based on the embodiment 1, and the whole process of the processing technology comprises the steps of flexible substrate cutting, internal light imaging, internal layer etching, internal layer AOI (argon oxygen ion) pretreatment, covering film pasting, covering film quick pressing, browning, uncovering film cutting, uncovering film laminating, drilling, plasma, copper deposition, negative film electroplating, external light imaging, external layer etching, external layer AOI (argon oxygen ion) printing and resistance welding imaging, characters, gold deposition, laser controlled depth cutting, uncovering film uncovering, appearance, electric measurement, final inspection and packaging.
The invention is characterized in that the invention comprises the following steps of browning, pasting and uncovering a cover film, cutting and laminating the cover film, controlling depth by laser, uncovering and uncovering the cover film, and the rest processes adopt the conventional methods in the field.
The specific implementation processes of the procedures of browning, pasting and uncovering the cover film, cutting, laminating, laser depth control cutting, uncovering the cover film and the like are as follows:
s1: browning the circuit board body after covering films are attached to the outer sides of the two first copper foil layers; the purpose of browning is to clean the surface of a circuit board before lamination, roughen the copper surface, increase the binding force between a non-flowing prepreg and the copper surface during pressing, and in the conventional circuit board process, because certain control requirements are provided for time and environmental temperature after browning, the process needs to be carried out before lamination. However, in this embodiment, the peelable protective film needs to be attached to the flexible substrate, and when the peelable protective film passes through the browning horizontal production line after being attached, the peelable protective film may fall off due to the water pressure flushing.
S2: attaching peelable protective films to the outer sides of the two cover films; the size of the strippable protective film is 0.5mm-1.0mm larger than the single side of the cover film.
S3: cutting the strippable protective film in a laser control depth mode; and cutting the strippable protective film in a depth control mode, but not cutting the covering film, so that the energy and parameters of laser cutting are adjusted, and inspection is well performed in the cutting process.
S4: cutting off the rigid plate in the flexible area in a laser control deep cutting mode, wherein the laser cutting depth is three quarters of that of the FR-4 substrate; when depth control cutting is performed, the first piece needs to be sliced and confirmed, and meanwhile, corresponding adjustment is performed according to structures of different types.
S5: using laser cutting to make the non-flowing prepreg close to the rigid area hollow by 1 mm: the non-flowing prepreg mainly comprises glass fibers and epoxy resin glue, and is convenient for preventing the glass fibers from tearing at the joint of the flexible substrate and the rigid edge due to pulling when the outer surface is controlled to be deep and covered, so that the glass fibers are milled to be 1mm in advance.
S6: the flexible substrate, the first copper foil layer, the no-flow prepreg layer, the second copper foil layer, the FR-4 substrate layer and the third copper foil layer are sequentially overlapped from bottom to top and then are firmly combined through lamination; the lamination process comprises the processes of browning pretreatment, lamination, riveting, lamination of a front board, pressing and the like;
since the browning process is performed before the peelable protective film is attached, this process is skipped before lamination.
S7: after pressing, the cavity area is filled with prepreg.
According to the invention, the non-flowing prepreg used for interlayer lamination is hollowed out by 1mm close to the flexible area in advance, and the prepregs in other areas are reserved so as to be used for filling glue in the cavity area. The strippable protective film is adhered between the prepreg and the flexible substrate. After the lamination, the hollow area is filled with the low-flow glue of the prepreg, so that the problem of air residue is solved in a complete filling state of the cavity area, and the phenomenon of cavity layering caused by air pressure difference in a plasma process is avoided.
According to the invention, after all manufacturing processes of the circuit board are completed and before a finished product is obtained, the outer layer FR-4 of the flexible region is removed through depth control cutting, so that the rigid-flexible combined circuit board is manufactured.
Finally, only specific embodiments of the present invention have been described in detail above. The invention is not limited to the specific embodiments described above. Equivalent modifications and substitutions by those skilled in the art are also within the scope of the present invention. Accordingly, equivalent alterations and modifications are intended to be included within the scope of the invention, without departing from the spirit and scope of the invention.
Claims (8)
1. The utility model provides a solve plasma cleaning time cavity air inflation's soft or hard combination circuit board, includes the circuit board body, its characterized in that:
the circuit board body comprises a flexible substrate (10), wherein first copper foil layers (11) are arranged on the front surface and the back surface of the flexible substrate (10), cover films (3) are attached to the outer sides of the two first copper foil layers (11), and peelable protective films (4) are attached to the outer sides of the two cover films (3);
laminating and laser depth control cutting are respectively carried out on the circuit board body corresponding to the positions of two sides of the peelable protective film (4) to form flexible regions (2), and the circuit board body positioned on two sides of the flexible regions (2) forms rigid regions (1);
after the peelable protective film (4) is peeled off and the circuit board body of the flexible region (2) is removed, the cover film (3) located on the flexible region (2) can be exposed.
2. The flexible-rigid printed circuit board for solving air expansion of the air cavity during plasma cleaning according to claim 1, wherein:
the distance between the two sides of the strippable protective film (4) and the joint of the flexible area (2) and the rigid area (1) on the same side of the strippable protective film is 0.5-1 mm.
3. The flexible-rigid printed circuit board for solving air expansion of the air cavity during plasma cleaning according to claim 1, wherein:
non-flowing prepreg layers (12) are respectively arranged on the outer sides of the two first copper foil layers (11), second copper foil layers (13) are respectively arranged on the outer sides of the two non-flowing prepreg layers (12), FR-4 substrate layers (14) are respectively arranged on the outer sides of the two second copper foil layers (13), and third copper foil layers (15) are respectively arranged on the outer sides of the two FR-4 substrate layers (14);
the flexible substrate (10), the first copper foil layer (11), the no-flow prepreg layer (12), the second copper foil layer (13) and the third copper foil layer (15) above the upper FR-4 substrate layer (14) are sequentially overlapped from bottom to top and then are firmly combined through lamination.
4. The flexible-rigid combined circuit board and the processing method thereof for solving the air expansion of the air cavity during the plasma cleaning according to claim 3 are characterized in that:
and both side surfaces of the two non-flowing prepreg layers (12) are hollowed along the height direction of the two non-flowing prepreg layers, and the hollowed width is 1mm.
5. The rigid-flexible circuit board and the processing method thereof according to claim 4, wherein the rigid-flexible circuit board is used for solving the air expansion of the air cavity during plasma cleaning, and the processing method comprises the following steps:
the strippable protective film (4) is a polyimide strippable protective film.
6. A processing technology of a rigid-flexible circuit board for solving air expansion of an air cavity during plasma cleaning is based on any one of claims 1 to 5, and is characterized in that: the method comprises the following steps:
s1: browning the circuit board body after covering films are attached to the outer sides of the two first copper foil layers;
s2: attaching peelable protective films to the outer sides of the two cover films;
s3: cutting the strippable protective film in a laser control depth mode;
s4: cutting off the rigid plate in the flexible area in a laser control deep cutting mode, wherein the laser cutting depth is three quarters of that of the FR-4 substrate;
s5: using laser cutting to make the non-flowing prepreg close to the rigid area hollow by 1 mm:
s6: the flexible substrate, the first copper foil layer, the no-flow prepreg layer, the second copper foil layer, the FR-4 substrate layer and the third copper foil layer are sequentially overlapped from bottom to top and then are firmly combined through lamination;
s7: after pressing, the cavity area is filled with prepreg.
7. The process of claim 6, wherein:
the peelable protective film described in S3 was not cut to the cover film.
8. The process of claim 6, wherein:
when the rigid plate of the flexible region is cut off by the laser controlled depth cutting method described in S4, it is necessary to confirm the cutting of the first piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111161093.2A CN113905542A (en) | 2021-09-30 | 2021-09-30 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111161093.2A CN113905542A (en) | 2021-09-30 | 2021-09-30 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
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| CN113905542A true CN113905542A (en) | 2022-01-07 |
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| CN202111161093.2A Withdrawn CN113905542A (en) | 2021-09-30 | 2021-09-30 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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