CN112040670A - Uncovering method of ultrathin rigid-flex printed circuit board - Google Patents
Uncovering method of ultrathin rigid-flex printed circuit board Download PDFInfo
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- CN112040670A CN112040670A CN202011235660.XA CN202011235660A CN112040670A CN 112040670 A CN112040670 A CN 112040670A CN 202011235660 A CN202011235660 A CN 202011235660A CN 112040670 A CN112040670 A CN 112040670A
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- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Abstract
The invention relates to a cover uncovering method of an ultrathin rigid-flex printed circuit board, which comprises the steps of manufacturing a PP board by adopting a low-flow-glue prepreg, punching the PP board by an engraving grinding tool to enable the PP board to form a PP windowing position, wherein the PP windowing position is a flexible area; and an etching cover-uncovering method for etching copper on the flexible area at the position corresponding to the PP windowing at the same time of manufacturing the circuit is adopted. The cover uncovering method of the ultrathin rigid-flex printed circuit board has the advantages of high efficiency, good quality and the like.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a cover uncovering method of an ultrathin rigid-flex printed circuit board.
Background
In the production process of the rigid-flex printed circuit board, it is very difficult to manually remove the reinforcing material in the flexible region. In the prior art, a normal pressing procedure is adopted to perform normal pressing on a high flow prepreg (normal flow PP) which is washed by an inner groove once and is pressed on FCCL. This kind of current process flow pressfitting process PP flows gluey greatly, and when follow-up adoption gong sword gong PP windowing, covers the membrane and goes up the PP powder seriously, causes to take off the lid difficulty, and the product quality is difficult to guarantee, and the yield is low, seriously influences production efficiency simultaneously.
Disclosure of Invention
The cover uncovering method of the ultrathin rigid-flex printed circuit board is good in product quality and high in production efficiency.
In order to achieve the above purpose, the following technical solutions are provided.
A cover uncovering method for an ultrathin rigid-flex printed circuit board comprises the steps that a PP board is manufactured through a low-flow-glue prepreg, the PP board is punched through an engraving grinding tool to form a PP windowing position, the PP windowing position is a flexible area, after punching of the PP board is completed, the PP board punched with the PP windowing and a copper foil are sequentially stacked on the upper surface and the lower surface of the flexible board, and the copper foil, the PP board and the flexible board are pressed together; and an etching cover-uncovering method for etching copper on the flexible area at the position corresponding to the PP windowing at the same time of manufacturing the circuit is adopted. According to the uncovering method of the ultrathin rigid-flex printed circuit board, the low-flow-glue prepreg is selected as a PP material to manufacture the PP board, and the PP board is punched through the engraving grinding tool to form the PP windowing; after the product is pressed, copper in a flexible area is etched away during circuit manufacturing to complete uncovering, the uncovering method enables uncovering and circuit manufacturing to be carried out synchronously, the uncovering process is not limited by manual operation technology, the problems that manual uncovering is low in efficiency and uncovering quality is difficult to guarantee in the prior art are effectively solved, production efficiency and product quality are guaranteed, production efficiency is high, and the quality of the uncovered product is good.
Further, the cover uncovering method of the ultrathin rigid-flex printed circuit board comprises the following steps,
s1: cutting, namely cutting the flexible base material, the covering film, the copper foil and the PP into sheets respectively;
s2: manufacturing a flexible board, namely sequentially drilling a hole, plating copper, carrying out inner layer circuit and AOI inspection on a flexible base material according to a conventional process, and then attaching or pressing a cover film on the flexible base material to finish the manufacturing of the flexible board;
s3, manufacturing a PP plate: punching the cut single low-flow adhesive PP through a carving grinding tool to form a PP windowing hole and a PP positioning hole on the low-flow adhesive PP so as to finish the manufacturing of the PP plate, wherein the carving grinding tool is made of a rigid material, has high hardness and high surface smoothness, effectively ensures that punching is finished at one time, and further plays a role in improving the problem of PP powder;
s4: and (3) laminating: sleeving PIN on the flexible board, the PP board and the copper foil manufactured in the steps S2-S3, laminating and pressing to form a semi-finished rigid-flex printed circuit board, wherein the PP board manufactured by the low-flow prepreg is selected, so that the problem of PP flow is effectively solved in the pressing process, and the product quality is ensured;
s5: sequentially performing target shooting, edge cutting, fillet cutting, laser hole drilling, plate grinding, copper deposition and plate electrical treatment on the semi-finished rigid-flexible combined plate according to conventional procedures;
s6: outer layer circuit and uncovering: and etching the copper layer on the flexible region at the position corresponding to the PP windowing at the same time of the outer layer circuit, simultaneously compensating the copper layer of the rigid plate from the rigid-flex boundary line, wherein the distance between the compensated rigid plate and the boundary line is 0.2mm, and synchronously finishing the outer layer circuit and the cover uncovering manufacture.
Furthermore, a safe glue thickness distance of more than or equal to 5um is reserved between the E-stage glass fiber in the low-flow-glue prepreg and the upper copper foil and the lower copper foil.
Further, the punch of the engraving and grinding tool is of a sawtooth structure, and the sawtooth depth of the punch is 0.4mm deeper than the thickness of the low-flow glue PP.
Furthermore, the pressing adopts an electric hot press, and a pressing plate buffer material with the thickness of 300mm is adopted as a base plate on a machine table during pressing.
Further, when the rigid-flex printed circuit board with the rigid-flex printed circuit board has a rigid-flex printed circuit board with a rigid-flex printed circuit board, wherein the height difference of the rigid-flex printed circuit board rigid-flex printed circuit.
Furthermore, the corrosion-resistant ink is thermosetting corrosion-resistant ink and can be directly removed at a subsequent outer layer circuit film removing section.
Furthermore, the anti-corrosion ink is printed by a semi-automatic printing machine, and the printing screen is printed by a 36T character dot blocking screen.
Furthermore, the said stop point net film is made into engineering data with the size of PP window with one side shrinking inward by 0.4 mm.
Further, after uncovering the rigid-flex printed circuit board, performing AOI inspection, solder resistance, character curing, surface treatment in sequence according to a conventional manufacturing mode, and finally performing post-process treatment.
Compared with the prior art, the cover uncovering method of the ultrathin rigid-flex printed circuit board has the following beneficial effects:
according to the invention, the high-flow prepreg in the prior art is changed into the low-flow prepreg, and the routing and windowing of the screw driver in the prior art are changed into the punching of the engraving grinding tool to finish PP windowing at one time, so that the flow is effectively improved in the rigid-flex plate pressing process, the punching precision is high during PP windowing, the generation of PP powder is effectively improved, and the processing quality of subsequent products is further ensured; after the product is pressed, copper in a flexible area is etched away while the circuit is manufactured to complete uncovering, the uncovering method enables uncovering and circuit manufacturing to be carried out synchronously without manual uncovering, the uncovering process is not limited by manual operation technology, the problems that manual uncovering is low in efficiency and uncovering quality is difficult to guarantee in the prior art are effectively solved, production efficiency and product quality are guaranteed, production efficiency is high, and the product quality is good after uncovering.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment 1 of a cover uncovering method of an ultrathin rigid-flex printed circuit board according to the present invention;
fig. 2 is a schematic structural view of an embodiment 2 of the uncovering method of the ultrathin rigid-flex printed circuit board according to the present invention.
Detailed Description
The cover uncovering method of the ultrathin rigid-flex printed circuit board according to the invention will be described in further detail with reference to the following specific embodiments and the accompanying drawings.
Example 1
Referring to fig. 1, in a non-limiting embodiment of the present invention, a method for uncovering an ultra-thin rigid-flex printed circuit board includes manufacturing a PP plate by using a low flow prepreg, performing a punching process on the PP plate by using an engraving and grinding tool to form a PP window in the PP plate, wherein the PP window is a flexible area, and after the punching process of the PP plate is completed, sequentially stacking the PP plate and a copper foil punched with the PP window on the upper surface and the lower surface of the flexible plate, respectively, and pressing the copper foil, the PP plate, and the flexible plate together; and an etching cover-uncovering method for etching copper on the flexible area at the position corresponding to the PP windowing at the same time of manufacturing the circuit is adopted. In this embodiment, the low-flow prepreg is the duan 7402 low-flow prepreg, and the engraving abrasive tool is made of a rigid material, so that the processed engraving abrasive tool has high hardness and high smoothness. According to the uncovering method of the ultrathin rigid-flex printed circuit board, the low-flow-glue prepreg is selected as a PP material to manufacture the PP board, and the PP board is punched through the engraving grinding tool to form the PP windowing; after the product is pressed, copper in a flexible area is etched away while the circuit is manufactured to complete uncovering, the uncovering method enables uncovering and circuit manufacturing to be carried out synchronously without manual uncovering, the uncovering process is not limited by manual operation technology, the problems that manual uncovering is low in efficiency and uncovering quality is difficult to guarantee in the prior art are effectively solved, production efficiency and product quality are guaranteed, production efficiency is high, and the product quality is good after uncovering.
Referring to fig. 1, a non-limiting embodiment of the present invention, the cover uncovering method of the ultra-thin flex-rigid board according to the present invention includes the following steps,
s1: cutting, namely cutting the flexible base material, the covering film, the copper foil and the PP into sheets respectively;
s2: manufacturing a flexible board, namely sequentially drilling a hole, plating copper, carrying out inner layer circuit and AOI inspection on the flexible base material according to a conventional process, and then laminating or pressing a cover film on the flexible base material to manufacture the flexible base material with a pattern to finish the manufacturing of the flexible board;
s3, manufacturing a PP plate: the cut single low-flow adhesive PP is punched through a carving grinding tool, so that a PP windowing and a PP positioning hole are formed in the low-flow adhesive PP, and the manufacturing of a PP plate is completed, wherein the PP positioning hole is designed on a process edge, the other PP windowing positions are flexible areas, the punching tool carving grinding tool is made of a rigid material, the rigidity is high, the surface smoothness is high, punching is effectively guaranteed to be completed at one time, and the problem of PP powder is solved.
S4: and (3) laminating: sleeving PIN on the flexible board, the PP board and the copper foil manufactured in the steps S2-S3, laminating and pressing to form a semi-finished rigid-flex printed circuit board, wherein the PP board manufactured by the low-flow prepreg is selected, so that the problem of PP flow is effectively solved in the pressing process, and the product quality is ensured;
s5: sequentially performing target shooting, edge cutting, fillet cutting, laser hole drilling, plate grinding, copper deposition and plate electrical treatment on the semi-finished rigid-flexible combined plate according to conventional procedures;
s6: outer layer circuit and uncovering: and etching the copper layer on the flexible area at the corresponding position of the PP windowing at the same time of the outer layer circuit, simultaneously compensating the copper layer of the rigid plate from the rigid-flex boundary line, wherein the distance from the edge of the compensated rigid plate to the rigid-flex boundary line is 0.2mm, and synchronously finishing the outer layer circuit and the cover uncovering manufacture. The distance between the edge of the rigid plate after compensation and the rigid-flex boundary line is 0.2mm, namely the edge of the rigid plate protrudes outwards by 0.1mm relative to the edge of the PP windowing, so that the copper in the flexible area can be etched in the process of circuit etching, meanwhile, the edge of the rigid plate protrudes outwards by 0.1mm relative to the edge of the PP windowing because little glue is generated in the process of pressing the PP, and the rigid plate can be effectively ensured to cover the PP outside the flexible area after pressing, thereby ensuring the product quality.
Referring to fig. 1, in a non-limiting embodiment of the present invention, a safe glue thickness distance of not less than 5um is formed between the E-step glass fiber and the upper and lower copper foils in the low-flow prepreg. In the pressing process, the prepreg in the PP plate is melted at high temperature to enable the copper foil and the flexible plate to be combined together, the low-flow prepreg comprises the prepreg and E-stage glass fibers for bearing the prepreg, if the distance between the copper foil and the E-stage glass fibers is less than 5 microns, the copper foil is easy to bubble in a high-temperature state, the bubbles are easy to contact the E-stage glass fibers in the low-flow prepreg, and the E-stage glass fibers are conductors, namely the copper foil is in contact with the E-stage glass fibers, so that the electric leakage problem is caused, therefore, in the manufacturing process, the safe glue thickness distance which is more than or equal to 5 microns is ensured between the E-stage glass fiber conductors and the copper foil in the low-flow prepreg, and the safety performance of the product is further ensured.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the punch of the engraving and grinding tool has a saw-toothed structure, and the depth of the saw teeth of the punch is 0.4mm deeper than the thickness of the low flow adhesive PP, so that the engraving and grinding tool can break the PP plate at one time, complete PP punching, realize PP windowing and PP positioning holes, and improve the generation of PP powder.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the pressing uses an electric hot press, and a press plate buffer material with a thickness of 300mm is used as a backing plate on a machine table during pressing. And during pressing, pressing parameters are set according to the TG value of the plate and PP and the thickness of the pressing plate.
Referring to fig. 1, according to a non-limiting embodiment of the present invention, after uncovering the rigid-flex printed circuit board, AOI inspection, solder mask, text, curing, surface treatment are sequentially performed according to a conventional manufacturing method, and finally post-process treatment is performed, wherein during AOI inspection, the flexible area is covered by AOI data, so that engineering data and the printed circuit board are prevented from being inconsistent and unable to be scanned; during solder mask, solder mask printing is performed by adopting a dot block network, and LDI exposure is performed in an exposure way without post curing; the characters are printed by adopting jet printing characters, and the printed characters can be directly cured, so that the binding force between the jet printing characters and the solder resist ink is ensured; during curing, if plug holes exist, continuous baking is carried out from a low-temperature section to a high-temperature section by adopting five-section parameters, so that the plug hole part is gradually cured, and the product quality is ensured; if no plug hole is formed, directly baking the plate at a high temperature of 150 ℃ for 2 hours; during surface treatment, the immersion gold needs to be sealed by an adhesive tape in the flexible uncovering area, so that the immersion gold is prevented from biting and eroding the covering film. And after the surface treatment is finished, carrying out post-procedure treatment according to a normal flow to finish the integral manufacture of the board.
Example 2
Referring to fig. 2, a non-limiting embodiment of the present invention, which is substantially the same as embodiment 1 in structure and principle, differs in that: the method is characterized in that the combination height difference of the rigid-flexible combination area of the rigid-flexible combination board is larger than 0.15mm, or the PP windowing size is larger than 2mm x 2mm, or when the rigid-flexible combination board with an opening covering film is arranged on the covering film of the flexible area to manufacture, the flexible area is printed with anti-corrosion ink before the pressing step, and the thickness of the anti-corrosion ink is set by reducing the height difference of the rigid-flexible combination by 20 um. When the height difference of the rigid-flex plate in the rigid-flex combination area is larger than 0.15mm, the PP is prone to sinking, when the size of the PP window is larger than 2mm x 2mm, the PP window is a large opening, the copper sheet is prone to sinking, similarly, when the opening is formed in the covering film, the PP can sink, therefore, when the openings are formed in the covering film, the anti-corrosion ink needs to be printed in the flexible area, the PP or the copper sheet is prevented from sinking, and the product quality is ensured. When the height difference of the rigid-flexible combination in the rigid-flexible combination area is larger than 0.15mm or the size of a PP window is larger than 2mm x 2mm, the anti-corrosion ink needs to be printed after the circuit board is browned. In this embodiment, the resist ink is a thermosetting resist ink, which can be directly removed at a subsequent outer layer circuit film removing section without separately removing the resist ink, thereby effectively ensuring the production efficiency. The anti-corrosion ink is silk-screened by a semi-automatic printing machine, and the printing screen is printed by a 36T character block dot net. The dot-screen film is used as engineering data with the size of PP window and the single side shrinking inwards by 0.4 mm.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. A cover uncovering method of an ultrathin rigid-flex printed circuit board is characterized by comprising the following steps: the method comprises the steps of manufacturing a PP plate by using a low-flow prepreg, punching the PP plate by using an engraving grinding tool to form a PP windowing position, wherein the PP windowing position is a flexible area, after the punching of the PP plate is finished, sequentially stacking the PP plate punched with the PP windowing and a copper foil on the upper surface and the lower surface of the flexible plate respectively, and pressing the copper foil, the PP plate and the flexible plate together; and an etching cover-uncovering method for etching copper on the flexible area at the position corresponding to the PP windowing at the same time of manufacturing the circuit is adopted.
2. The cover uncovering method of the ultra-thin rigid-flex printed circuit board according to claim 1, characterized by comprising the following steps,
s1: cutting, namely cutting the flexible base material, the covering film, the copper foil and the PP into sheets respectively;
s2: manufacturing a flexible board, namely sequentially drilling a hole, plating copper, carrying out inner layer circuit and AOI inspection on a flexible base material according to a conventional process, and then attaching or pressing a cover film on the flexible base material to finish the manufacturing of the flexible board;
s3, manufacturing a PP plate: punching the cut single piece of low-flow adhesive PP by using a carving grinding tool to form a PP windowing hole and a PP positioning hole on the low-flow adhesive PP so as to finish the manufacturing of the PP plate;
s4: and (3) laminating: performing PIN sleeving, plate stacking and pressing on the flexible board, the PP board and the copper foil manufactured in the steps S2-S3 to form a semi-finished rigid-flex printed circuit board;
s5: sequentially performing target shooting, edge cutting, fillet cutting, laser hole drilling, plate grinding, copper deposition and plate electrical treatment on the semi-finished rigid-flexible combined plate according to conventional procedures;
s6: outer layer circuit and uncovering: and etching the copper layer on the flexible region at the position corresponding to the PP windowing at the same time of the outer layer circuit, simultaneously compensating the copper layer of the rigid plate from the rigid-flex boundary line, wherein the distance between the compensated rigid plate and the boundary line is 0.2mm, and synchronously finishing the outer layer circuit and the cover uncovering manufacture.
3. The uncovering method of the ultrathin rigid-flex printed circuit board as claimed in claim 2, wherein a glue thickness safety distance of more than or equal to 5um is reserved between the E-step glass fiber in the low-flow glue prepreg and the upper and lower copper foils.
4. The cover uncovering method of the ultrathin rigid-flex printed circuit board as claimed in claim 2, wherein a punch of the engraving and grinding tool is of a sawtooth structure, and the sawtooth depth of the punch is 0.4mm deeper than the thickness of the low-flow glue PP.
5. The cover uncovering method of the ultrathin rigid-flex printed circuit board as claimed in claim 2, wherein an electric hot press is adopted for pressing, and a pressing plate buffer material with the thickness of 300mm is adopted as a base plate on a machine table during pressing.
6. The cover uncovering method of the ultrathin rigid-flexible printed circuit board as claimed in claim 2, wherein when the rigid-flexible printed circuit board with the rigid-flexible printed circuit board is manufactured, wherein the height difference of the rigid-flexible printed circuit board in the rigid-flexible printed circuit board is larger than 0.15mm, or the size of the PP window is larger than 2mm x 2mm, or the cover film in the flexible printed circuit board is provided with the cover film opening, the flexible printed circuit board is printed with the anti-corrosion ink before the pressing step.
7. The cover uncovering method of the ultrathin rigid-flex printed circuit board as claimed in claim 6, wherein the corrosion-resistant ink is a thermosetting etching-resistant ink which can be directly removed in a subsequent outer layer circuit film removing section.
8. The cover uncovering method of the ultrathin rigid-flex printed circuit board as claimed in claim 7, wherein the anti-corrosion ink is silk-screened by a semi-automatic printing machine, and a printing screen is printed by a 36T character dot screen.
9. The cover uncovering method of the ultra-thin rigid-flex printed circuit board as claimed in claim 8, wherein the dot-blocking net film is used as engineering data with a single-side shrinkage of 0.4mm according to the opening size of the PP window.
10. The cover uncovering method of the ultrathin rigid-flex printed circuit board according to any one of claims 7 to 9, wherein after the rigid-flex printed circuit board is uncovered, AOI inspection, solder resistance, characters, curing and surface treatment are sequentially carried out according to a conventional manufacturing mode, and finally, the post-processing is carried out.
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| CN202011235660.XA CN112040670A (en) | 2020-11-09 | 2020-11-09 | Uncovering method of ultrathin rigid-flex printed circuit board |
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Cited By (5)
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| CN112672510A (en) * | 2020-12-07 | 2021-04-16 | 高德（无锡）电子有限公司 | Processing method for resin hole plugging of ultrathin printed circuit rigid-flex board |
| CN112839453A (en) * | 2021-01-20 | 2021-05-25 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN114189998A (en) * | 2021-12-23 | 2022-03-15 | 江西荣晖电子有限公司 | Manufacturing method of zero-glue-overflow rigid-flex board product |
| CN114364148A (en) * | 2021-12-06 | 2022-04-15 | 龙南骏亚柔性智能科技有限公司 | Circuit board processing method for improving bonding force of character ink and solder resist ink of ink jet printer |
| CN114501862A (en) * | 2022-01-19 | 2022-05-13 | 博敏电子股份有限公司 | Production method for improving flatness of COB product of rigid-flex printed circuit board and COB product |
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| CN114501862A (en) * | 2022-01-19 | 2022-05-13 | 博敏电子股份有限公司 | Production method for improving flatness of COB product of rigid-flex printed circuit board and COB product |
| CN114501862B (en) * | 2022-01-19 | 2023-08-04 | 博敏电子股份有限公司 | Production method for improving flatness of COB (chip on board) product of rigid-flex printed circuit board and COB product thereof |
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Application publication date: 20201204 |