CN106535507A - Novel de-cap method of rigid-flex board - Google Patents
Novel de-cap method of rigid-flex board Download PDFInfo
- Publication number
- CN106535507A CN106535507A CN201610945574.5A CN201610945574A CN106535507A CN 106535507 A CN106535507 A CN 106535507A CN 201610945574 A CN201610945574 A CN 201610945574A CN 106535507 A CN106535507 A CN 106535507A
- Authority
- CN
- China
- Prior art keywords
- hard board
- novel soft
- film
- washing oil
- uncovering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
Abstract
The invention relates to a novel de-cap method of a rigid-flex board. The method includes the following steps that: (1) after the inner layer covering film of the rigid-flex board is bonded, and the inner layer covering film is covered with a layer of PP prepregs, a layer of cleanable printing ink is printed through screen printing at interdigital windows or grounding points , and a cleanable printing ink protection film is formed; (2) a copper-clad film is laminated and pressed, the copper-clad film is pressed for 3 hours under 180 DEC C; (3) drilling, electroplating, dry film attachment, exposure and development are carried out after pressing and molding; (4) etching processing is carried out by means of an acid etching solution after the development; and (5) an alkaline solution is adopted to carry out film removal after etching is completed, and the cleanable printing ink protection film is dissolved. The novel de-cap method of the invention has the advantages of simple process, convenient operation and cost-saving performance.
Description
Technical field
The present invention relates to one kind takes off lid mode, and in particular to a kind of uncovering method of novel soft-hard board.
Background technology
Existing Rigid Flex type is in multifarious trend, and grafting, or ground connection are done in windowing at Rigid Flex internal layer soft board
Type it is more and more, protection internal layer windowing at golden finger or the technology at ground connection also become focus.
Former techniqueflow is：Internal layer soft board sawing sheet-drilling-pre-treatment-patch dry film-exposure-development-etching line
Road-paste epiphragma-print peelable glue (a kind of liquid ink, shield after solidification) or bar patch High temperature-resistanadhesive adhesive tape-outer stack
Plate pressure transmission.
Former technical disadvantages are：During printing peelable adhesive curing-lamination pressure transmission, product can be produced with the solidification process of peelable glue
Change shape, and this peelable glue non-refractory, after outer layer completes, needs to go to divest by hand.In strip, there is stripping unnet
Phenomenon, impacts to rear processing procedure.And paste High temperature-resistanadhesive adhesive tape：Artificial bar patch is needed, and has aligning accuracy to require.
The content of the invention
The present invention proposes a kind of uncovering method of novel soft-hard board for the problems referred to above, and operation is simple, operation side
Just, cost has been saved.
Specific technical scheme is as follows：
A kind of uncovering method of novel soft-hard board, its step is：
(1), after the internal layer cover layer of Rigid Flex is fitted and covers one layer of PP prepreg, at finger windowing or connect
At place, one layer is printed by screen printing mode and can move back washing oil ink, 30min is dried at a temperature of 150 DEG C formed to move back and washed
Ink diaphragm；
(2) pressing of copper membrane lamination, presses 3h at a temperature of 180 DEG C；
(3) carry out drilling after pressing and forming, electroplate, it is patch dry film, exposed and developed；
(4) process is etched using acid etching liquid medicine after developing；
(5) striping is carried out using alkaline medicinal liquid after the completion of etching, dissolving can move back washing oil ink diaphragm.
A kind of uncovering method of above-mentioned novel soft-hard board, wherein, the acid etching liquid medicine be hydrochloric acid solution, hydrochloric acid
The acid equivalent of solution is 2.0N, and temperature is 45 55 DEG C.
A kind of uncovering method of above-mentioned novel soft-hard board, wherein, the alkaline medicinal liquid be sodium hydroxide solution, hydrogen-oxygen
The weight percent concentration for changing sodium is 5%, and temperature is 50 60 DEG C.
A kind of uncovering method of above-mentioned novel soft-hard board, wherein, after the acid etching liquid medicine etching, copper ion
Content is 180 220g/L.
A kind of uncovering method of above-mentioned novel soft-hard board, wherein, the washing oil ink that moves back is purchased from Asahi Chemical Industry's strain formula
Commercial firm, which does not dissolve in acid solution, dissolves in alkaline solution.
A kind of uncovering method of above-mentioned novel soft-hard board, wherein, the thickness H1 of the PP prepregs is 18 25 μ
m。
A kind of uncovering method of above-mentioned novel soft-hard board, wherein, it is described to move back washing oil ink diaphragm and PP semi-solid preparations
Clearance distance L1 between piece is 0.8mm.
Beneficial effects of the present invention are：
Due in Rigid Flex preparation process, both having needed to be etched outer layer copper film, need again to protect internal layer copper
Film is injury-free, present invention uses not dissolving in acid solution, dissolves in the moved back washing oil ink of alkaline solution as diaphragm, leads to
The mode for crossing serigraphy is printed at finger windowing or at earth point, and thickness can be controlled in 18 25UM, and precision can be controlled in ±
Within 0.3, and postorder manually need not be divested during striping, high temperature resistant, protect product quality, and operation is simple, operation
It is convenient, save cost.
Description of the drawings
Fig. 1 is step of the present invention (2) schematic diagram.
Fig. 2 is step of the present invention (4) schematic diagram.
Fig. 3 is step of the present invention (5) schematic diagram.
Specific embodiment
To make technical scheme become apparent from clearly, the present invention is described further below in conjunction with the accompanying drawings,
Any technical characteristic to technical solution of the present invention carries out the scheme that equivalencing and conventional reasoning draw and each falls within guarantor of the present invention
Shield scope.
Reference
Internal layer cover layer 1, PP prepregs 2, at finger windowing or 3 at earth point, washing oil ink diaphragm 4 can be moved back, copper is covered
Film 5.
A kind of uncovering method of novel soft-hard board as shown in the figure, its step is：
(1) after the internal layer cover layer 1 of Rigid Flex is fitted and covers one layer of PP prepreg 2, at finger windowing or
3 at earth point, one layer is printed by screen printing mode and can move back washing oil ink, dried 30min and formed and can be moved back at a temperature of 150 DEG C
Washing oil ink diaphragm 4, purchased from Asahi Kasei Corporation, which does not dissolve in acid solution to the washing oil ink that moves back, and dissolves in alkalescence
Solution, the thickness H1 of the PP prepregs are 18 25 μm, it is described move back between washing oil ink diaphragm and PP prepregs between
Stand-off distance is 0.8mm from L1；
(2) pressing of 5 lamination of copper membrane, presses 3h at a temperature of 180 DEG C；
(3) carry out drilling after pressing and forming, electroplate, it is patch dry film, exposed and developed；
(4) processs is etched using acid etching liquid medicine after developing, the acid etching liquid medicine is hydrochloric acid solution, hydrochloric acid
The acid equivalent of solution is 2.0N, and temperature is 45 55 DEG C, and after the acid etching liquid medicine etching, the content of copper ion is 180
220g/L；
(5) striping is carried out using alkaline medicinal liquid after the completion of etching, dissolving can move back washing oil ink diaphragm, and the alkaline medicinal liquid is
Sodium hydroxide solution, the weight percent concentration of NaOH is 5%, and temperature is 50 60 DEG C.
Claims (7)
1. a kind of uncovering method of novel soft-hard board, it is characterized by, its step is：
(1) after the internal layer cover layer of Rigid Flex is fitted and covers one layer of PP prepreg, at finger windowing or earth point
Place, prints one layer by screen printing mode and can move back washing oil ink, dries 30min formation and can move back washing oil ink at a temperature of 150 DEG C
Diaphragm；
(2) pressing of copper membrane lamination, presses 3h at a temperature of 180 DEG C；
(3) carry out drilling after pressing and forming, electroplate, it is patch dry film, exposed and developed；
(4) process is etched using acid etching liquid medicine after developing；
(5) striping is carried out using alkaline medicinal liquid after the completion of etching, dissolving can move back washing oil ink diaphragm.
2. a kind of uncovering method of novel soft-hard board as claimed in claim 1, it is characterized by, the acid etching liquid medicine
For hydrochloric acid solution, the acid equivalent of hydrochloric acid solution is 2.0N, and temperature is 45 55 DEG C.
3. a kind of uncovering method of novel soft-hard board as claimed in claim 1, it is characterized by, the alkaline medicinal liquid is hydrogen
Sodium hydroxide solution, the weight percent concentration of NaOH is 5%, and temperature is 50 60 DEG C.
4. a kind of uncovering method of novel soft-hard board as claimed in claim 1, it is characterized by, the acid etching liquid medicine
After etching, the content of copper ion is 180 220g/L.
5. a kind of uncovering method of novel soft-hard board as claimed in claim 1, it is characterized by, it is described to move back washing oil ink purchase
From in Asahi Kasei Corporation, which does not dissolve in acid solution, dissolves in alkaline solution.
6. a kind of uncovering method of novel soft-hard board as claimed in claim 1, it is characterized by, the PP prepregs
Thickness H1 is 18 25 μm.
7. a kind of uncovering method of novel soft-hard board as claimed in claim 1, it is characterized by, the washing oil ink that moves back is protected
Clearance distance L1 between cuticula and PP prepregs is 0.8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610945574.5A CN106535507A (en) | 2016-11-02 | 2016-11-02 | Novel de-cap method of rigid-flex board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610945574.5A CN106535507A (en) | 2016-11-02 | 2016-11-02 | Novel de-cap method of rigid-flex board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535507A true CN106535507A (en) | 2017-03-22 |
Family
ID=58292431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610945574.5A Pending CN106535507A (en) | 2016-11-02 | 2016-11-02 | Novel de-cap method of rigid-flex board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535507A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635357A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of pcb board golden finger guard method of easy to clean |
| CN108093565A (en) * | 2017-12-28 | 2018-05-29 | 广德鼎星电子科技有限公司 | The removal technique of copper foil bubble and fold at a kind of windowing of Rigid Flex bent area |
| CN109104824A (en) * | 2018-08-31 | 2018-12-28 | 广东成德电子科技股份有限公司 | A kind of production method of rigid-flexible combined circuit plate |
| CN109429443A (en) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | The production method of rigid-flexible circuit board |
| CN110177434A (en) * | 2019-02-20 | 2019-08-27 | 淳华科技(昆山)有限公司 | Flexible circuit board takes off lid equipment |
| CN110248500A (en) * | 2019-06-24 | 2019-09-17 | 深圳华麟电路技术有限公司 | Rigid Flex and its manufacture craft for telescopic camera |
| CN111163597A (en) * | 2019-12-31 | 2020-05-15 | 昆山沪利微电有限公司 | Manufacturing process of PCB cavity structure |
| CN111642086A (en) * | 2020-04-22 | 2020-09-08 | 红板（江西）有限公司 | Novel protective oil-resistant glue-resistant process for rigid-flex board |
| CN112040670A (en) * | 2020-11-09 | 2020-12-04 | 广东科翔电子科技股份有限公司 | Uncovering method of ultrathin rigid-flex printed circuit board |
| CN113438819A (en) * | 2021-06-23 | 2021-09-24 | 金禄电子科技股份有限公司 | Processing method of circuit board and radio frequency rigid-flex board |
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| JP2008112879A (en) * | 2006-10-31 | 2008-05-15 | Cmk Corp | Rigid flexible printed wiring board and its manufacturing method |
| CN102724813A (en) * | 2012-07-06 | 2012-10-10 | 广州美维电子有限公司 | Cover opening method of rigid and flexible plate |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN104968164A (en) * | 2015-07-03 | 2015-10-07 | 深圳市景旺电子股份有限公司 | Manufacturing method of rigid-flex PCB |
-
2016
- 2016-11-02 CN CN201610945574.5A patent/CN106535507A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008112879A (en) * | 2006-10-31 | 2008-05-15 | Cmk Corp | Rigid flexible printed wiring board and its manufacturing method |
| CN102724813A (en) * | 2012-07-06 | 2012-10-10 | 广州美维电子有限公司 | Cover opening method of rigid and flexible plate |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN104968164A (en) * | 2015-07-03 | 2015-10-07 | 深圳市景旺电子股份有限公司 | Manufacturing method of rigid-flex PCB |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429443A (en) * | 2017-08-31 | 2019-03-05 | 鹏鼎控股(深圳)股份有限公司 | The production method of rigid-flexible circuit board |
| CN109429443B (en) * | 2017-08-31 | 2020-08-21 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of rigid-flexible circuit board |
| CN107635357A (en) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | A kind of pcb board golden finger guard method of easy to clean |
| CN108093565A (en) * | 2017-12-28 | 2018-05-29 | 广德鼎星电子科技有限公司 | The removal technique of copper foil bubble and fold at a kind of windowing of Rigid Flex bent area |
| CN109104824A (en) * | 2018-08-31 | 2018-12-28 | 广东成德电子科技股份有限公司 | A kind of production method of rigid-flexible combined circuit plate |
| CN110177434A (en) * | 2019-02-20 | 2019-08-27 | 淳华科技(昆山)有限公司 | Flexible circuit board takes off lid equipment |
| CN110177434B (en) * | 2019-02-20 | 2021-11-23 | 淳华科技(昆山)有限公司 | Soft circuit board cover-removing equipment |
| CN110248500B (en) * | 2019-06-24 | 2021-05-04 | 深圳华麟电路技术有限公司 | Rigid-flex board for telescopic camera and manufacturing process thereof |
| CN110248500A (en) * | 2019-06-24 | 2019-09-17 | 深圳华麟电路技术有限公司 | Rigid Flex and its manufacture craft for telescopic camera |
| CN111163597A (en) * | 2019-12-31 | 2020-05-15 | 昆山沪利微电有限公司 | Manufacturing process of PCB cavity structure |
| CN111642086A (en) * | 2020-04-22 | 2020-09-08 | 红板（江西）有限公司 | Novel protective oil-resistant glue-resistant process for rigid-flex board |
| CN112040670A (en) * | 2020-11-09 | 2020-12-04 | 广东科翔电子科技股份有限公司 | Uncovering method of ultrathin rigid-flex printed circuit board |
| CN113438819A (en) * | 2021-06-23 | 2021-09-24 | 金禄电子科技股份有限公司 | Processing method of circuit board and radio frequency rigid-flex board |
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |
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| RJ01 | Rejection of invention patent application after publication |