CN110248500B - Rigid-flex board for telescopic camera and manufacturing process thereof - Google Patents
Rigid-flex board for telescopic camera and manufacturing process thereof Download PDFInfo
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- CN110248500B CN110248500B CN201910550831.9A CN201910550831A CN110248500B CN 110248500 B CN110248500 B CN 110248500B CN 201910550831 A CN201910550831 A CN 201910550831A CN 110248500 B CN110248500 B CN 110248500B
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- board
- copper foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
The invention provides a rigid-flex board for a telescopic camera and a manufacturing process thereof, wherein the rigid-flex board comprises the following steps: step one, manufacturing an inner core plate; respectively manufacturing inner layer circuits on an inner upper layer copper foil and an inner lower layer copper foil of the inner layer substrate; the copper sheet of the inner upper layer copper foil in the soft board area is reserved and not etched, and a covering film is pasted on the inner layer substrate; step two, manufacturing a hard board; windowing the positions of the upper hard board and the lower hard board corresponding to the soft board area; step three, manufacturing an outer layer copper foil; step four, pressing and manufacturing; pressing the outer copper foil, the upper hard board, the inner core board, the lower hard board and the outer copper foil in sequence to form a soft-hard combined board copper plate; step five, manufacturing an outer layer circuit; etching the outer copper foil to manufacture an outer circuit, and etching all the unprotected outer copper foil in the soft board area; the unprotected copper skin of the inner upper copper foil flexible board area is also completely etched. The invention can prolong the sliding life of the rigid-flex board to more than 10 ten thousand times.
Description
Technical Field
The invention relates to the technical field of processing of circuit boards for digital products such as mobile phones, tablets and computers, in particular to a rigid-flex board for a telescopic camera and a manufacturing process thereof.
Background
The apple mobile phone X system drives the rapid development of a full-screen mobile phone, but the apple X system and other water drop screens, pearl screens, bang screens, punching screens and the like are not real full-screen strictly. Because of the functional requirements, electronic equipment such as mobile phones and flat panels are provided with the front-facing camera, and the front-facing camera can also occupy part of the position of the display screen, so that the full-face screen and the front-facing camera cannot be compatible. In the prior art, the technical scheme for realizing the full-screen mainly comprises two types: the one is a telescopic camera scheme, and the other is a sliding cover scheme, wherein the sliding cover mechanical structure is complex, the cost is high, and the thickness of the mobile phone is increased, so that the comprehensive screen mobile phone with the telescopic camera, which is simple in structure, light and thin, has more market potential.
The carrier plate of telescopic camera is the rigid-flex board, and at the flexible in-process of camera, rigid-flex board is as the carrier plate of camera, will slide in step along with the flexible of camera, and in order to satisfy the operation requirement of camera, the slip life-span in the flexible board district of rigid-flex board will satisfy and reach more than 10 ten thousand, so, what the carrier plate rigid-flex board of telescopic camera was solved the key of present full screen. As shown in fig. 1-3, the rigid board regions (i.e., the connector region and the chip region) of the rigid-flex board are assembled and fixed, and the sliding bending is performed by the flexible board region. Through tests, the sliding life of the soft board area of the conventional rigid-flex board is more than 50-100 times, which is far from the requirement of 10 ten thousand times, and the flexible-flex board cannot be used as a carrier board of a telescopic camera.
Disclosure of Invention
The invention provides a rigid-flex board for a telescopic camera and a manufacturing process thereof, and aims to solve the technical problem of prolonging the sliding life of the rigid-flex board to more than 10 ten thousand times.
In order to solve the above technical problems, the present invention provides a manufacturing process of a rigid-flex board for a retractable camera, comprising the following steps,
step one, manufacturing an inner core plate;
1.1 preparing an inner-layer substrate, wherein the inner-layer substrate comprises an inner upper-layer copper foil, a PI film and an inner lower-layer copper foil; respectively manufacturing inner layer circuits on the inner upper layer copper foil and the inner lower layer copper foil; wherein, the copper sheet of the inner upper copper foil in the soft board area is firstly reserved and not etched, so as to increase the strength of the inner substrate soft board area;
1.2, manufacturing a covering film of the inner layer substrate circuit;
firstly, windowing a soft board area covered with a film and attaching the soft board area to the upper surface of the inner layer substrate; the lower covering film and the inner layer substrate are of equal size and attached to the lower surface of the inner layer substrate, and pressing is carried out to form an inner layer core board for later use;
step two, manufacturing a hard board;
windowing the positions of the upper hard board and the lower hard board corresponding to the soft board area for later use;
step three, manufacturing an outer layer copper foil;
selecting an outer copper foil with the same size as the inner core plate for standby;
step four, pressing and manufacturing;
pressing the outer copper foil, the upper hard board, the inner core board, the lower hard board and the outer copper foil in sequence to form a soft-hard combined board copper plate;
step five, manufacturing an outer layer circuit;
etching the outer copper foil to manufacture an outer circuit, and etching all the unprotected outer copper foil in the soft board area; meanwhile, the unprotected copper sheet of the inner upper layer copper foil flexible board area is also completely etched, so that the flexibility of the inner layer substrate flexible board area is increased.
And step six, producing according to the required flow to finish the production of the product.
Preferably, in the first step, in the manufacture of the inner core board, when the circuit is etched, copper sheets with a width of 2-4 mm from the hard board areas at two ends on the inner upper copper foil soft board area are etched simultaneously.
Preferably, in the first step, in the step of manufacturing the cover film of the inner layer substrate circuit, the window size of the upper cover film is 0-0.05 mm larger than the bending area of the flexible printed circuit board.
Preferably, in the second step, in the hard board manufacturing, the window sizes of the upper hard board and the lower hard board are smaller than the size of the soft board area by 0.00-0.05 mm.
Preferably, the upper hard board and the lower hard board are made of PP prepregs.
The invention also provides a soft and hard combined board for the telescopic camera, which comprises a PI film positioned in the middle, wherein the top surface of the PI film in the hard board area is provided with an inner upper copper foil, and the top surface of the inner upper copper foil is provided with an upper covering film; the bottom surfaces of the PI films positioned in the hard board area and the soft board area at two ends are provided with inner lower layer copper foils, and the bottom surfaces of the inner lower layer copper foils are provided with lower covering films; the top surface of the upper covering film and the bottom surface of the lower covering film are respectively provided with an upper hard plate and a lower hard plate which are pre-windowed in the soft plate area; the top surface of upper hard board and the bottom surface of lower floor's hard board all are equipped with outer copper foil.
Preferably, the thickness of the PI film is 12-25 μm; the thicknesses of the inner upper layer copper foil, the inner lower layer copper foil and the outer layer copper foil are 8-18 mu m; the thickness of the inner upper covering film and the thickness of the inner lower covering film are 20-30 mu m; the thickness of the upper hard plate and the lower hard plate is 30-120 mu m; the thickness of the adhesive layer on the upper and lower coverlay films was 12 μm.
Preferably, the size of the window of the upper covering film is 0-0.05 mm larger than the size of the soft board area.
Preferably, the window size of the upper hard board and the lower hard board is 0.00-0.05 mm smaller than the size of the soft board area.
Preferably, the upper covering film and the lower covering film are made of PI materials with Young modulus of 3.8-7.8 GPa.
Compared with the prior design, the invention has the advantages that: the lower covering film of the inner core plate is made of a material with low elastic modulus so as to prolong the bending life of the soft plate area; during production, when the circuit of the inner core board is etched, only copper sheets which are 2-4 mm wide away from the hard board area on the soft board area are etched with respect to the inner upper copper foil, and the copper sheets at other positions are reserved without etching, so that the situation that the corresponding copper sheets on the inner upper copper foil at the junction of the soft board area and the hard board area cannot be etched due to glue overflow generated during the subsequent lamination of the covering film and the hard board can be prevented, the strength of the inner base board soft board area can be increased, the phenomenon of corrugation scrapping easily caused in the subsequent covering film pasting, etching and film removing operation process or the carrying process can be reduced, the sliding frequency of the soft board area is ensured to be more than 10 ten thousand, and the yield of products can be improved by more than 10% according to statistics.
Drawings
Fig. 1 is a schematic front view of the rigid-flex board of the present invention.
Fig. 2 is a schematic side view of the rigid-flex board of the present invention.
Fig. 3 is a schematic side view of the rigid-flex printed circuit board of the present invention after bending.
Fig. 4 is a schematic longitudinal sectional view of an inner core board of the rigid-flex printed circuit board according to the present invention.
FIG. 5 is a schematic longitudinal sectional view of the rigid-flex printed circuit board according to the present invention before etching the outer layer circuit.
Fig. 6 is a schematic longitudinal sectional view of the rigid-flex board according to the present invention.
The reference numbers are as follows:
a1-soft board area, A2-hard board area, 1-PI film, 21-inner upper copper foil, 22-inner lower copper foil, 31-upper covering film, 32-lower covering film, 41-upper hard board, 42-lower hard board and 5-outer copper foil.
Detailed Description
The invention relates to a rigid-flex board for a telescopic camera and a manufacturing process thereof, wherein the rigid-flex board comprises a middle flexible board area A1 used for sliding and rigid board areas A2 connected with the two ends of the middle flexible board area A1 used for arranging a connector and a chip. The invention is described in detail below with reference to the accompanying figures 1-6 and the specific embodiments.
The invention relates to a rigid-flex board for a telescopic camera, which comprises a PI film 1 positioned in the middle, wherein the top surface of the PI film 1 in a hard board area A2 is provided with an inner upper copper foil 21, and the top surface of the inner upper copper foil 21 is adhered with an upper covering film 31 through an adhesive; the bottom surfaces of the PI films 1 in the hard board area A2 and the soft board area A1 at two ends are provided with inner lower layer copper foils 22, and the bottom surfaces of the inner lower layer copper foils 22 are adhered with lower covering films 32 through adhesives; the top surface of the upper covering film 31 and the bottom surface of the lower covering film 32 are respectively provided with an upper hard plate 41 and a lower hard plate 42 which are pre-windowed in the soft plate area A1; the top surface of the upper hard board 41 and the bottom surface of the lower hard board 42 are both provided with outer copper foils 5. Wherein, the inner upper layer copper foil 21, the inner lower layer copper foil 22 and the outer layer copper foil 5 are all provided with circuits.
The thickness of the PI film 1 is 12-25 mu m; the thickness of the inner upper layer copper foil 21 and the inner lower layer copper foil 22 is 8-18 mu m; the thickness of the inner upper covering film 31 and the thickness of the inner lower covering film 32 are 20-30 micrometers; the thickness of the upper hard board 41 and the lower hard board 42 is 30-120 μm; the thickness of the outer layer copper foil 5 is 8-18 mu m; the thickness of the adhesive layer on the upper and lower coverlay films 31 and 32 was 12 μm (flow rate of the clip-off adhesive).
Silver foil as an electromagnetic shielding film is further provided between the upper cover film 31 and the upper hard sheet 41 or between the lower cover film 32 and the lower hard sheet 42, and the thickness range is 8 to 16 μm. One of the main functions of the EMI silver foil is to act as a reference layer for the impedance lines.
Specifically, the PI membrane 1 adopts NSCC G/Q series; the inner upper layer copper foil 21, the inner lower layer copper foil 22 and the outer layer copper foil 5 are rolled copper foils with ductility, and NIKKO HRA series is selected; the upper covering film 31 and the lower covering film 32 are made of PI materials with low elastic modulus, the Young modulus of the PI materials is 3.8-7.8 GPa, so that the service life of bending is prolonged, and the Kapton series of Taihong or Dupont is selected; the upper hard board 41 and the lower hard board 42 are made of FR4 or PP prepreg and DOOSAN DF series; the EMI silver foil is selected from PC5900 or PC6000 series of TATSUTA of Japan.
The invention also relates to a manufacturing process of the rigid-flex board for the telescopic camera, which comprises the following steps:
step one, manufacturing an inner core plate;
1.1 cutting an inner layer substrate according to the designed and manufactured makeup size, wherein the inner layer substrate comprises a PI film, an inner upper layer copper foil laid on the upper surface of the PI film and an inner lower layer copper foil laid on the lower surface of the PI film, and an inner layer circuit is manufactured on the inner upper layer copper foil and the inner lower layer copper foil of the inner layer substrate by adopting a conventional method in the prior art.
The copper sheet of the inner upper layer copper foil in the soft board area is firstly reserved and not etched, so that the strength of the inner layer substrate soft board area is increased, the phenomenon of corrugation scrapping easily caused in the subsequent covering film pasting, etching and film removing operation process or the carrying process is reduced, the sliding frequency of the soft board area is ensured to be more than 10 ten thousand, and the statistical yield can be improved by more than 10%.
And in order to prevent the phenomenon that the corresponding copper sheet on the inner upper layer copper foil positioned at the junction of the soft board area and the hard board area cannot be etched due to glue overflow generated during the lamination of the subsequent covering film and the PP prepreg, the copper sheet with the width of 2-4 mm (namely part B in figures 4-5) away from the hard board areas at two ends on the inner upper layer copper foil soft board area is etched during the circuit etching, and preferably, the width of the part B is 3 mm.
1.2, manufacturing a covering film of the inner layer substrate circuit;
firstly, windowing a soft board area of an upper covering film, attaching the soft board area to the upper surface of an inner layer substrate, wherein the windowing size (namely the size along the length direction of a rigid-flexible board) of the upper covering film is 0-0.05 mm larger than that of the soft board area, and the influence on the length of the soft board area caused by glue flowing when the upper covering film is pressed is prevented; the lower covering film and the inner layer substrate are equal in size and attached to the lower surface of the inner layer substrate; and pressing the upper covering film, the inner-layer substrate and the lower covering film to form the inner-layer core board, as shown in fig. 4, for standby.
Step two, manufacturing a hard board;
and the upper hard board and the lower hard board adopt PP prepregs, and the position corresponding to the soft board area is windowed and cut off according to the design requirement.
The windowing size (namely the size along the length direction of the rigid-flex board) of the PP prepreg is 0.00-0.05 mm smaller than the size of the soft board area, so that the influence on the length of the soft board area due to glue flowing during the laminating of the PP prepreg is prevented, and the PP prepreg is used for later use.
Step three, manufacturing an outer layer copper foil;
and selecting the outer layer copper foil with the same size as the inner layer core plate for standby.
Step four, pressing and manufacturing;
and pressing the outer copper foil, the upper hard board, the inner core board, the lower hard board and the outer copper foil in sequence to form the soft-hard combined board copper plate, as shown in fig. 5.
Step five, manufacturing an outer layer circuit;
according to the prior art, the outer copper foil is etched, an outer circuit is manufactured in the hard board area, the copper foil which is not protected on the outer layer of the soft board area is completely etched, and meanwhile, the copper sheet which is not protected on the inner upper copper foil soft board area is also completely etched, so that the flexibility of the inner substrate soft board area is improved. As shown in fig. 6.
And sixthly, producing according to a normal flow, and manufacturing drilling holes, copper plating, circuits, solder prevention, surface treatment, EMI silver foil laminating, molding, testing, FQC and the like.
Claims (10)
1. The utility model provides a manufacturing technology that is used for flexible hard board of telescopic camera which characterized in that: comprises the following steps of (a) carrying out,
step one, manufacturing an inner core plate;
1.1 preparing an inner-layer substrate, wherein the inner-layer substrate comprises an inner upper-layer copper foil, a PI film and an inner lower-layer copper foil; respectively manufacturing inner layer circuits on the inner upper layer copper foil and the inner lower layer copper foil; wherein, the copper sheet of the inner upper copper foil in the soft board area is firstly reserved and not etched, so as to increase the strength of the inner substrate soft board area;
1.2, manufacturing a covering film of the inner layer substrate circuit;
firstly, windowing a soft board area covered with a film and attaching the soft board area to the upper surface of the inner layer substrate; the lower covering film and the inner layer substrate are of equal size and attached to the lower surface of the inner layer substrate, and pressing is carried out to form an inner layer core board for later use;
step two, manufacturing a hard board;
windowing the positions of the upper hard board and the lower hard board corresponding to the soft board area for later use;
step three, manufacturing an outer layer copper foil;
selecting an outer copper foil with the same size as the inner core plate for standby;
step four, pressing and manufacturing;
pressing the outer copper foil, the upper hard board, the inner core board, the lower hard board and the outer copper foil in sequence to form a soft-hard combined board copper plate;
step five, manufacturing an outer layer circuit;
etching the outer copper foil to manufacture an outer circuit, and etching all the unprotected outer copper foil in the soft board area; meanwhile, the unprotected copper sheet of the inner upper layer copper foil flexible board area is also completely etched, so that the flexibility of the inner layer substrate flexible board area is improved;
and step six, producing according to the required flow to finish the production of the product.
2. The manufacturing process of the rigid-flex board for the retractable camera according to claim 1, wherein the rigid-flex board comprises: in the first step, in the manufacture of the inner core plate, when a circuit is etched, copper sheets with the width of 2-4 mm away from hard plate areas at two ends on a copper foil soft plate area at the inner upper layer are etched simultaneously.
3. The manufacturing process of the rigid-flex board for the retractable camera according to claim 1, wherein the rigid-flex board comprises: in the first step, in the manufacturing of the covering film of the inner layer substrate circuit, the window size of the covering film is 0-0.05 mm larger than the bending area of the soft board.
4. The manufacturing process of the rigid-flex board for the retractable camera according to claim 1, wherein the rigid-flex board comprises: and step two, in the hard board manufacturing process, the windowing sizes of the upper hard board and the lower hard board are smaller than the size of the soft board area by 0.00-0.05 mm.
5. The manufacturing process of the rigid-flex board for the retractable camera according to claim 1, wherein the rigid-flex board comprises: the upper hard board and the lower hard board are made of PP prepregs.
6. A rigid-flex board for a retractable camera manufactured by the manufacturing process of claim 1, wherein: the PI film (1) is positioned in the middle, the top surface of the PI film (1) in the hardboard area (A2) is provided with an inner upper layer copper foil (21), and the top surface of the inner upper layer copper foil (21) is provided with an upper covering film (31); the bottom surfaces of the PI films (1) positioned in the hard board area (A2) and the soft board area (A1) at two ends are provided with inner lower layer copper foils (22), and the bottom surfaces of the inner lower layer copper foils (22) are provided with lower covering films (32); the top surface of the upper covering film (31) and the bottom surface of the lower covering film (32) are respectively provided with an upper hard plate (41) and a lower hard plate (42) which are pre-windowed in a soft plate area (A1); the top surface of the upper hard board (41) and the bottom surface of the lower hard board (42) are both provided with outer copper foils (5).
7. The flexible-rigid combined board for the telescopic camera head as claimed in claim 6, wherein: the thickness of the PI film (1) is 12-25 mu m; the thicknesses of the inner upper layer copper foil (21), the inner lower layer copper foil (22) and the outer layer copper foil (5) are 8-18 mu m; the thickness of the inner upper covering film (31) and the thickness of the inner lower covering film (32) are 20-30 mu m; the thickness of the upper hard board (41) and the lower hard board (42) is 30-120 mu m; the thickness of the adhesive layer on the upper covering film (31) and the lower covering film (32) is 12 μm.
8. The flexible-rigid combined board for the telescopic camera head as claimed in claim 6, wherein: the window size of the upper covering film (31) is 0-0.05 mm larger than the size of the soft board area (A1).
9. The flexible-rigid combined board for the telescopic camera head as claimed in claim 6, wherein: the window opening size of the upper hard board (41) and the lower hard board (42) is 0.00-0.05 mm smaller than that of the soft board area (A1).
10. The flexible-rigid combined board for the telescopic camera head as claimed in claim 6, wherein: the upper covering film (31) and the lower covering film (32) are made of PI materials with Young modulus of 3.8-7.8 GPa.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910550831.9A CN110248500B (en) | 2019-06-24 | 2019-06-24 | Rigid-flex board for telescopic camera and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910550831.9A CN110248500B (en) | 2019-06-24 | 2019-06-24 | Rigid-flex board for telescopic camera and manufacturing process thereof |
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| CN110248500A CN110248500A (en) | 2019-09-17 |
| CN110248500B true CN110248500B (en) | 2021-05-04 |
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| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
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| CN104302109A (en) * | 2014-10-08 | 2015-01-21 | 台山市精诚达电路有限公司 | Camera soft and hard combination board manufacturing method |
| CN106535507A (en) * | 2016-11-02 | 2017-03-22 | 江苏弘信华印电路科技有限公司 | Novel de-cap method of rigid-flex board |
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2019
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| JPH0637408A (en) * | 1992-07-13 | 1994-02-10 | Sumitomo Electric Ind Ltd | Flex-ridged printed wiring board |
| CN1780532A (en) * | 2004-10-28 | 2006-05-31 | 三星电机株式会社 | Method of fabricating rigid-flexible printed circuit board |
| CN101770959A (en) * | 2009-01-05 | 2010-07-07 | 伊姆贝拉电子有限公司 | Rigid-flex module and manufacturing method |
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| CN104302109A (en) * | 2014-10-08 | 2015-01-21 | 台山市精诚达电路有限公司 | Camera soft and hard combination board manufacturing method |
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