CN110248500A - Rigid Flex and its manufacture craft for telescopic camera - Google Patents
Rigid Flex and its manufacture craft for telescopic camera Download PDFInfo
- Publication number
- CN110248500A CN110248500A CN201910550831.9A CN201910550831A CN110248500A CN 110248500 A CN110248500 A CN 110248500A CN 201910550831 A CN201910550831 A CN 201910550831A CN 110248500 A CN110248500 A CN 110248500A
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- China
- Prior art keywords
- hardboard
- layer
- copper foil
- flexible board
- cover film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
The present invention provides a kind of Rigid Flex and its manufacture craft for telescopic camera, comprising the following steps: Step 1: the production of core material；Internal layer circuit is made in the interior upper copper of internal substrate and interior lower copper foil respectively；First retain positioned at the copper sheet of the interior upper copper of flexible board area and do not etch, epiphragma is pasted on internal substrate；Step 2: hardboard makes；By upper layer hardboard and the position windowing corresponding with flexible board area of lower layer's hardboard；Step 3: outer copper foil makes；Step 4: pressing production；It according to the sequence of outer copper foil, upper layer hardboard, core material, lower layer's hardboard, outer copper foil, is pressed, forms Rigid Flex copper sheet；Step 5: outer-layer circuit makes；It etches outer copper foil and makes outer-layer circuit, the outer layer of flexible board area is all etched away without the outer copper foil of protection；Interior copper sheet of the upper copper flexible board area without protection is also all etched away.The present invention realizes the sliding service life for improving Rigid Flex to 100,000 times or more.
Description
Technical field
The present invention relates to the processing technique field of the wiring board of the digital products such as mobile phone, plate, computer, more particularly, to
A kind of Rigid Flex and its manufacture craft for telescopic camera.
Background technique
IPhone system X has driven the fast development of comprehensive screen mobile phone, but whether be apple X series or its
Its water droplet screen, pearl screen, Liu Haiping, punching screen etc. are not real screen comprehensively on stricti jurise.Because of functional requirement,
The electronic equipments such as mobile phone, plate are designed with front camera, and front camera can also occupy the portion of display screen, thus
Making to shield comprehensively can not get both with front camera.In the prior art, it realizes the technical solution shielded comprehensively there are mainly two types of: one is
Telescopic camera scheme, one is sliding cover type schemes, wherein because the mechanical structure of sliding cover type is more complex, higher cost, and
Mobile phone thickness can also thicken, therefore simpler, the frivolous comprehensive screen mobile phone with telescopic camera of structure more has market potential.
The support plate of telescopic camera is Rigid Flex, and in camera telescopic process, Rigid Flex is as camera shooting
The support plate of head, will synchronize sliding with the flexible of camera, in order to meet the requirement of camera, Rigid Flex
The sliding service life of flexible board area, which will meet, to be reached 100,000 times or more, so, the support plate Rigid Flex of telescopic camera is solution
The key certainly shielded comprehensively at present.As shown in Figure 1-3, and the hardboard region (i.e. connector area and chip area) of Rigid Flex
It is all that assembling is fixed, sliding bending is by flexible board area.After tested, the sliding longevity of existing conventional Rigid Flex flexible board area
Life is much not achieved 100,000 requirements, cannot act as the support plate of telescopic camera mostly at 50~100 times.
Summary of the invention
The present invention provides a kind of Rigid Flex and its manufacture craft for telescopic camera, and the technology to be solved is asked
Topic is to improve the sliding service life of Rigid Flex to 100,000 times or more.
In order to solve the above technical problem, the present invention provides a kind of production of Rigid Flex for telescopic camera
Technique includes the following steps,
Step 1: the production of core material；
1.1 preparing internal substrate, internal substrate includes interior upper copper, PI film, interior lower copper foil；Respectively in interior upper copper
Internal layer circuit is made in foil and interior lower copper foil；Wherein, the copper sheet positioned at the interior upper copper of flexible board area, which first retains, does not etch, with
Increase the intensity of internal substrate flexible board area；
The cover film of 1.2 production internal substrate routes；
The flexible board area of upper cover film is first opened a window, is attached to the upper surface of internal substrate；Lower cover film and internal substrate etc.
Size, the lower surface for being attached to internal substrate, are pressed, and form core material, for use；
Step 2: hardboard makes；
By upper layer hardboard and the position windowing corresponding with flexible board area of lower layer's hardboard, for use；
Step 3: outer copper foil makes；
The outer copper foil with core material equidimension is selected, for use；
Step 4: pressing production；
It according to the sequence of outer copper foil, upper layer hardboard, core material, lower layer's hardboard, outer copper foil, is pressed, is formed
Rigid Flex copper sheet；
Step 5: outer-layer circuit makes；
It etches outer copper foil and makes outer-layer circuit, the outer layer of flexible board area is all etched away without the outer copper foil of protection；Together
When, interior copper sheet of the upper copper flexible board area without protection is also all etched away, to increase the flexible of internal substrate flexible board area
Property.
Step 6: producing by required process, production is completed.
It is preferred that the step 1, in the production of core material, in circuit etching, while etching away on interior
Apart from the copper sheet of both ends hardboard area 2~4mm width on floor copper foil flexible board area.
It is preferred that the step 1, in the cover film that makes internal substrate route, the window size of upper cover film
It is 0~0.05mm bigger than soft board bending region.
It is preferred that the step 2, in hardboard production, the window size of upper layer hardboard and lower layer's hardboard compares soft board
Small 0.00~the 0.05mm of area's size.
It is preferred that the upper layer hardboard and lower layer's hardboard are made of PP prepreg.
The present invention also provides a kind of Rigid Flexs for telescopic camera, including are located in the middle PI film, firmly
The top surface of the PI film in plate area is equipped with interior upper copper, and the top surface of interior upper copper is equipped with upper cover film；Positioned at both ends hardboard area and
The bottom surface of the PI film of flexible board area is equipped with interior lower copper foil, and the bottom surface of interior lower copper foil is equipped with lower cover film；The top surface of upper cover film
It is respectively equipped in advance with the bottom surface of lower cover film in the upper layer hardboard and lower layer's hardboard of flexible board area windowing；The top surface of upper layer hardboard and
The bottom surface of lower layer's hardboard is equipped with outer copper foil.
It is preferred that the PI film with a thickness of 12~25 μm；The interior upper copper, interior lower copper foil, outer layer
Copper foil with a thickness of 8~18 μm；The interior upper cover film and lower cover film with a thickness of 20~30 μm；The upper layer hardboard is under
Layer hardboard with a thickness of 30~120 μm；The thickness of adhesive layer is 12 μm on upper cover film and lower cover film.
It is preferred that the window size of the upper cover film is 0~0.05mm bigger than flexible board area size.
It is preferred that the window size of the upper layer hardboard and lower layer's hardboard it is smaller than flexible board area size by 0.00~
0.05mm。
It is preferred that the upper cover film and lower cover film use Young's modulus for the PI material of 3.8~7.8GPa
It is made.
The present invention is compared with existing design, the advantage is that: the lower cover film of core material uses the material of low elastic modulus
Material, to improve the flex life of flexible board area；When production, when etching core material route, for interior upper copper, position is only etched away
In the copper sheet on flexible board area apart from hardboard area 2~4mm width, the copper sheet of remaining position, which first retains, not to be etched, can be prevented as a result,
Excessive glue is generated in subsequent cover film, hardboard fitting and leads to phase in the interior upper copper for being located at flexible board area and hardboard area intersection
The copper sheet answered can not etch away, and can increase the intensity of internal substrate flexible board area, thus reduce it is subsequent paste epiphragma, etching,
It moves back the fold easily caused in membrane operations process or handling process and scraps phenomenon, to guarantee the sliding number of flexible board area at 100,000 times
More than, product yield can promote 10% or more according to statistics.
Detailed description of the invention
Fig. 1 is the front schematic view of Rigid Flex of the present invention.
Fig. 2 is the side schematic view of Rigid Flex of the present invention.
Fig. 3 is the side schematic view after Rigid Flex of the present invention bending.
Fig. 4 is the vertical section schematic diagram of the core material of Rigid Flex of the present invention.
Fig. 5 is the longitudinal profile before the outer-layer circuit etching of Rigid Flex of the present invention.
Fig. 6 is the vertical section schematic diagram of Rigid Flex of the present invention.
Appended drawing reference is as follows:
The flexible board area A1-, A2- hardboard area, 1-PI film, upper copper in 21-, lower copper foil in 22-, the upper cover film of 31-,
Cover film, the upper layer 41- hardboard, 42- lower layer hardboard, 5- outer copper foil under 32-.
Specific embodiment
It is of the present invention soft the present invention relates to a kind of Rigid Flex and its manufacture craft for telescopic camera
Scleroma plywood includes the intermediate flexible board area A1 for sliding and be connected to its both ends be used to be arranged the hard of connector and chip
Plate area A2.Below in conjunction with Figure of description 1-6 and specific embodiment, the present invention is described in detail.
The present invention relates to a kind of Rigid Flexs for telescopic camera, as shown in fig. 6, including being located in the middle PI
The top surface of film 1, the PI film 1 of hardboard area A2 is equipped with interior upper copper 21, and the top surface of interior upper copper 21 is pasted with by adhesive
Upper cover film 31；Bottom surface positioned at the PI film 1 of both ends hardboard area A2 and flexible board area A1 is equipped with interior lower copper foil 22, interior lower copper foil
22 underrun adhesive is pasted with lower cover film 32；The top surface of upper cover film 31 and the bottom surface of lower cover film 32 are respectively equipped with
In advance in the upper layer hardboard 41 and lower layer's hardboard 42 of flexible board area A1 windowing；The top surface of upper layer hardboard 41 and the bottom surface of lower layer's hardboard 42
It is equipped with outer copper foil 5.Wherein, route is equipped on interior upper copper 21, interior lower copper foil 22 and outer copper foil 5.
The PI film 1 with a thickness of 12~25 μm；The interior upper copper 21 and interior lower copper foil 22 with a thickness of 8~18
μm；The interior upper cover film 31 and lower cover film 32 with a thickness of 20~30 μm；The upper layer hardboard 41 and lower layer's hardboard 42
With a thickness of 30~120 μm；The outer copper foil 5 with a thickness of 8~18 μm；Adhesive layer on upper cover film 31 and lower cover film 32
Thickness be 12 μm (deducting flow adhesives).
It is additionally provided between upper cover film 31 and upper layer hardboard 41 or between lower cover film 32 and lower layer's hardboard 42 as electricity
The silver foil of magnetic shield film, thickness range are 8~16 μm.The main function of EMI silver foil first is that reference layer as impedance line.
Specifically, PI film 1 selects NSCC G/Q series；Interior upper copper 21, interior lower copper foil 22, outer copper foil 5 are to want
The rolled copper foil of ductility selects NIKKO HRA series；Upper cover film 31 and lower cover film 32 are using the PI compared with low elastic modulus
Material, Young's modulus are 3.8~7.8GPa, to improve the service life of bending, select platform rainbow or the Kapton of Du Pont series；Upper layer
Hardboard 41 and lower layer's hardboard 42 select FR4 or PP prepreg, select DOOSAN DF series；EMI silver foil selects Japan
PC5900 or the PC6000 series of TATSUTA company.
The invention further relates to a kind of manufacture crafts of Rigid Flex for telescopic camera, comprising the following steps:
Step 1: the production of core material；
1.1 first cut an internal substrate by the layout size designed and produced, and internal substrate includes PI film and is layed in PI
The interior upper copper of film upper surface and the interior lower copper foil of lower surface, internal substrate using the prior art routine method including on
Internal layer circuit is made in layer copper foil and interior lower copper foil.
Wherein, the copper sheet positioned at the interior upper copper of flexible board area, which first retains, does not etch, to increase internal substrate flexible board area
Intensity, thus reduce it is subsequent paste epiphragma, etch, move back the fold easily caused in membrane operations process or handling process scrap it is existing
As to guarantee the sliding number of flexible board area at 100,000 times or more, yield can also promote 10% or more according to statistics.
Excessive glue is generated in subsequent cover film, the fitting of PP prepreg in order to prevent again and causes to be located at flexible board area and hardboard
Corresponding copper sheet can not etch away in the interior upper copper of area's intersection, in circuit etching, while etch away interior upper copper
Apart from the copper sheet in both ends hardboard area 2~4mm width (i.e. the portion B in Fig. 4-5) on flexible board area, it is preferable that the width in the portion B is 3mm.
The cover film of 1.2 production internal substrate routes；
The flexible board area of upper cover film is first opened a window, is attached to the upper surface of internal substrate, the window size of upper cover film is (i.e.
Along the size of the length direction of Rigid Flex) it is 0~0.05mm bigger than flexible board area, prevent because upper cover film press when gummosis due to shadow
Ring the length of flexible board area；Lower cover film and internal substrate equidimension, the lower surface for being attached to internal substrate；By upper cover film, interior
Laminar substrate, lower cover film are pressed, and core material are formed, as shown in figure 4, for use.
Step 2: hardboard makes；
Upper layer hardboard and lower layer's hardboard select PP prepreg, and position corresponding with flexible board area is opened a window according to design requirement
Excision.
The window size (i.e. along the size of the length direction of Rigid Flex) of PP prepreg is smaller than flexible board area size
0.00~0.05mm prevents when PP prepreg presses gummosis due to influences the length of flexible board area, for use.
Step 3: outer copper foil makes；
The outer copper foil with core material equidimension is selected, for use.
Step 4: pressing production；
It according to the sequence of outer copper foil, upper layer hardboard, core material, lower layer's hardboard, outer copper foil, is pressed, is formed
Rigid Flex copper sheet, as shown in Figure 5.
Step 5: outer-layer circuit makes；
According to existing conventional techniques, outer copper foil is etched, makes outer-layer circuit in hardboard area, the outer layer of flexible board area is without protecting
The copper foil of shield all etches away, meanwhile, interior copper sheet of the upper copper flexible board area without protection is also all etched away, to increase
The flexibility of internal substrate flexible board area.As shown in Figure 6.
Step 6: produced according to normal flow, production drilling, copper facing, route, anti-welding, surface treatment, EMI silver foil is bonded, at
Type, test, FQC etc..
Claims (10)
1. a kind of manufacture craft of the Rigid Flex for telescopic camera, it is characterised in that: include the following steps,
Step 1: the production of core material；
1.1 prepare internal substrate, and internal substrate includes interior upper copper, PI film, interior lower copper foil；Respectively in interior upper copper and
Internal layer circuit is made in interior lower copper foil；Wherein, the copper sheet positioned at the interior upper copper of flexible board area, which first retains, does not etch, to increase
The intensity of internal substrate flexible board area；
The cover film of 1.2 production internal substrate routes；
The flexible board area of upper cover film is first opened a window, is attached to the upper surface of internal substrate；Lower cover film and internal substrate equidimension,
It is attached to the lower surface of internal substrate, is pressed, forms core material, for use；
Step 2: hardboard makes；
By upper layer hardboard and the position windowing corresponding with flexible board area of lower layer's hardboard, for use；
Step 3: outer copper foil makes；
The outer copper foil with core material equidimension is selected, for use；
Step 4: pressing production；
It according to the sequence of outer copper foil, upper layer hardboard, core material, lower layer's hardboard, outer copper foil, is pressed, is formed soft or hard
Board copper sheet；
Step 5: outer-layer circuit makes；
It etches outer copper foil and makes outer-layer circuit, the outer layer of flexible board area is all etched away without the outer copper foil of protection；Meanwhile it is interior
Copper sheet of the upper copper flexible board area without protection is also all etched away, to increase the flexibility of internal substrate flexible board area；
Step 6: producing by required process, production is completed.
2. a kind of manufacture craft of Rigid Flex for telescopic camera according to claim 1, feature exist
In the step 1, the production of core material, in circuit etching, while distance on interior upper copper flexible board area is etched away
The copper sheet of both ends hardboard area 2~4mm width.
3. a kind of manufacture craft of Rigid Flex for telescopic camera according to claim 1, feature exist
In the step 1, the cover film for making internal substrate route, the window size of upper cover film is bigger 0 than soft board bending region
~0.05mm.
4. a kind of manufacture craft of Rigid Flex for telescopic camera according to claim 1, feature exist
In the step 2, hardboard production, the window size of upper layer hardboard and lower layer's hardboard is smaller than flexible board area size 0.00~
0.05mm。
5. a kind of manufacture craft of Rigid Flex for telescopic camera according to claim 1, feature exist
In: the upper layer hardboard and lower layer's hardboard are using the production of PP prepreg.
6. a kind of Rigid Flex that telescopic camera is used for made of manufacture craft described in claim 1,
Be characterized in that: including being located in the middle PI film (1), the top surface of the PI film (1) of hardboard area (A2) is equipped with interior upper copper (21), interior
The top surface of upper copper (21) is equipped with upper cover film (31)；Positioned at the PI film (1) of both ends hardboard area (A2) and flexible board area (A1)
Bottom surface is equipped with interior lower copper foil (22), and the bottom surface of interior lower copper foil (22) is equipped with lower cover film (32)；The top of upper cover film (31)
Face and the bottom surface of lower cover film (32) are respectively equipped in advance in the upper layer hardboard (41) and lower layer's hardboard of flexible board area (A1) windowing
(42)；The top surface of upper layer hardboard (41) and the bottom surface of lower layer's hardboard (42) are equipped with outer copper foil (5).
7. a kind of Rigid Flex for telescopic camera according to claim 6, it is characterised in that: the PI film
(1) with a thickness of 12~25 μm；The interior upper copper (21), interior lower copper foil (22), outer copper foil (5) with a thickness of 8~
18μm；The interior upper cover film (31) and lower cover film (32) with a thickness of 20~30 μm；The upper layer hardboard (41) and lower layer
Hardboard (42) with a thickness of 30~120 μm；The thickness of adhesive layer is 12 μm on upper cover film (31) and lower cover film (32).
8. a kind of Rigid Flex for telescopic camera according to claim 6, it is characterised in that: covered on described
The window size of epiphragma (31) is 0~0.05mm bigger than flexible board area (A1) size.
9. a kind of Rigid Flex for telescopic camera according to claim 6, it is characterised in that: the upper layer
The window size of hardboard (41) and lower layer's hardboard (42) is 0.00~0.05mm smaller than flexible board area (A1) size.
10. a kind of Rigid Flex for telescopic camera according to claim 1 or 6, it is characterised in that: described
Upper cover film (31) and lower cover film (32) use Young's modulus to be made of the PI material of 3.8~7.8GPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910550831.9A CN110248500B (en) | 2019-06-24 | 2019-06-24 | Rigid-flex board for telescopic camera and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910550831.9A CN110248500B (en) | 2019-06-24 | 2019-06-24 | Rigid-flex board for telescopic camera and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110248500A true CN110248500A (en) | 2019-09-17 |
| CN110248500B CN110248500B (en) | 2021-05-04 |
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ID=67889150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910550831.9A Active CN110248500B (en) | 2019-06-24 | 2019-06-24 | Rigid-flex board for telescopic camera and manufacturing process thereof |
Country Status (1)
| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
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| CN101770959A (en) * | 2009-01-05 | 2010-07-07 | 伊姆贝拉电子有限公司 | Rigid-flex module and manufacturing method |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN104302109A (en) * | 2014-10-08 | 2015-01-21 | 台山市精诚达电路有限公司 | Camera soft and hard combination board manufacturing method |
| CN106535507A (en) * | 2016-11-02 | 2017-03-22 | 江苏弘信华印电路科技有限公司 | Novel de-cap method of rigid-flex board |
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2019
- 2019-06-24 CN CN201910550831.9A patent/CN110248500B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637408A (en) * | 1992-07-13 | 1994-02-10 | Sumitomo Electric Ind Ltd | Flex-ridged printed wiring board |
| CN1780532A (en) * | 2004-10-28 | 2006-05-31 | 三星电机株式会社 | Method of fabricating rigid-flexible printed circuit board |
| CN101770959A (en) * | 2009-01-05 | 2010-07-07 | 伊姆贝拉电子有限公司 | Rigid-flex module and manufacturing method |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
| CN104302109A (en) * | 2014-10-08 | 2015-01-21 | 台山市精诚达电路有限公司 | Camera soft and hard combination board manufacturing method |
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| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
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|---|---|
| CN110248500B (en) | 2021-05-04 |
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Effective date of registration: 20221118 Granted publication date: 20210504 |