CN104968164A - Manufacturing method of rigid-flex PCB - Google Patents

Manufacturing method of rigid-flex PCB Download PDF

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Publication number
CN104968164A
CN104968164A CN201510383829.9A CN201510383829A CN104968164A CN 104968164 A CN104968164 A CN 104968164A CN 201510383829 A CN201510383829 A CN 201510383829A CN 104968164 A CN104968164 A CN 104968164A
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CN
China
Prior art keywords
rigid
acid
flexible
glue
conjunction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510383829.9A
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Chinese (zh)
Other versions
CN104968164B (en
Inventor
王俊
谢伦魁
刘赟
张传超
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Shenzhen Kinwong Electronic Co Ltd
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Shenzhen Kinwong Electronic Co Ltd
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Priority to CN201510383829.9A priority Critical patent/CN104968164B/en
Publication of CN104968164A publication Critical patent/CN104968164A/en
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Publication of CN104968164B publication Critical patent/CN104968164B/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

The invention discloses a manufacturing method of a rigid-flex PCB. The method includes the steps: A, manufacturing a screen print film, the lower oil level area of the screen print film being 1mm smaller than a windowing duct single side; B, performing acid and alkali resistance glue peelable printing, and filling and covering a windowing duct; C, carrying out a baking step, and solidifying acid and alkali resistance peelable glue; and D, performing electroless copper electroplating, and tearing off the acid and alkali resistance peelable glue after electroplating. A screen printing technology is adopted to fill peelable glue in windowing places to replace conventional gluing by hands, so the production efficiency is greatly improved and the labor intensity is reduced. For different dimensions, people can perform printing filling on flexible areas with different shapes without considering whether glue paper matches the flexible areas in shape and dimension. Therefore, the manufacturing method is improved in universality.

Description

A kind of rigid-flexible in conjunction with PCB plate production method
Technical field
The present invention relates to circuit board making technical field, particularly relate to a kind of rigid-flexible in conjunction with PCB plate production method.
Background technology
The rigid-flexible structure in conjunction with PCB is divided into two kinds usually, one be flexible region at outermost layer, another kind of for flexible region be centre.
In PCB manufacturing process, rigid plate and flex plate need be made respectively, and then be pressed together by adhesive sheet by rigid-flex board, in order to allow the flexure region needed expose, the following two kinds of modes of general employing make (for flex plate at skin):
Fenestration: adopt Digit Control Machine Tool, controlled by computer program, is cut away the region that rigid plate correspondence need expose flex plate with gong cutter, then rigid plate and flex plate is pressed together.
Take off lid method: adopt Digit Control Machine Tool, controlled by computer program, first by rigid-flexible in conjunction with position, boundary, rigid plate is cut the groove of certain depth in advance, then rigid plate and flex plate are pressed together, PCB rigid plate flow process is fabricated into molding procedure routinely, then position rigid plate correspondence need being exposed flex plate utilizes gong cutter to be taken off by lid on Digit Control Machine Tool by computer program.
The shortcoming of prior art is:
1, fenestration is generally adopt when having pad to expose for soft board region, but due to flexure region expose time, in PCB wet process electroless copper plating, electro-coppering process, flexible region is vulnerable to the attack of liquid medicine, and flexible region also can be deposited electric plated with copper, affects PCB soft board quality;
2, fenestration is produced, attacked and electric plated with copper by liquid medicine in order to avoid flexible region when electroplating, the method that industry is commonly used is: stick red gummed paper in flexure region before plating, protection flexible region, but the defect of the method is: (1) efficiency is low, need artificial one piece one piece subsides, and manual rubberizing must be carried out in each flexible region, production efficiency and hand labor intensity very big; (2) each machine structure is different, and the not of uniform size of flexible region causes, and therefore each item number must tailor the red gummed paper mated with flexible region by hand.
3, lid mode is taken off in employing, generally can only be used for soft board position landless type plates, flexure region be protected in PCB manufacturing process, be taken off by over cap again, expose flexible region after flow process completes.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of rigid-flexible in conjunction with PCB plate production method, be intended to solve the problem that existing rigid-flexible, quality low in conjunction with PCB plate production method efficiency haves much room for improvement.
Technical scheme of the present invention is as follows:
A kind of rigid-flexible in conjunction with PCB plate production method, wherein, comprise step:
A, make the silk screen film, under silk screen, the region ratio of oil level is windowed the monolateral little 1mm of groove;
B, carry out the printing of acid and alkali-resistance peelable glue, groove of windowing is filled and is covered;
C, carry out baking process, acid and alkali-resistance peelable glue is solidified;
D, carry out heavy copper plating, after having electroplated, acid and alkali-resistance peelable glue is torn.
Described is rigid-flexible in conjunction with PCB plate production method, and wherein, the raw material in acid and alkali-resistance peelable glue is epoxy resin and vinyl chloride copolymer.
Described is rigid-flexible in conjunction with PCB plate production method, and wherein, in described step C, curing temperature is 150 DEG C.
Described is rigid-flexible in conjunction with PCB plate production method, and wherein, in described step C, curing time is 30 minutes.
Beneficial effect: the present invention carries out peelable glue filling to position of windowing, the manual rubberizing before replacement owing to have employed screen printing technique, improves production efficiency so very big, reduces labour intensity; For different size, difform flexible region all can be carried out printing and be filled, and need not consider the match condition of gummed paper and flexible region geomery, so improve versatility.
Accompanying drawing explanation
Fig. 1 adopts manufacture method of the present invention to make rigid-flexible in conjunction with structural representation during pcb board state.
Fig. 2 adopts manufacture method of the present invention to make rigid-flexible in conjunction with structural representation during another state of pcb board.
Embodiment
The invention provides a kind of rigid-flexible in conjunction with PCB plate production method, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
One provided by the present invention is rigid-flexible in conjunction with PCB plate production method, and it comprises step:
S101, make the silk screen film, under silk screen, the region ratio of oil level is windowed the monolateral little 1mm of groove;
S102, carry out the printing of acid and alkali-resistance peelable glue, groove of windowing is filled and is covered;
S103, carry out baking process, acid and alkali-resistance peelable glue is solidified;
S104, carry out heavy copper plating, after having electroplated, acid and alkali-resistance peelable glue is torn.
Wherein in step S101, groove of windowing refers to the rigid-flexible flexible region in conjunction with pcb board, the region of oil level then little 1mm more monolateral than this groove of windowing under silk screen.
In step s 102, utilize acid and alkali-resistance peelable glue will window groove fill cover.Raw material in acid and alkali-resistance peelable glue is wherein epoxy resin and vinyl chloride copolymer.Wherein, by mass percentage, epoxy resin accounts for 30%, and vinyl chloride copolymer accounts for 70%.
Further, in described step S103, curing temperature is 150 DEG C.
Further, in described step S103, curing time is 30 minutes.Under above-mentioned condition, solidification effect is better, and acid and alkali-resistance peelable glue can fit tightly rigid-flexible in conjunction with on pcb board, can conveniently tear again after carrying out subsequent treatment simultaneously.
Finally carry out heavy copper electroplating processes: can be specifically carry out heavy copper, plate electricity, outer-layer circuit, graphic plating, etching, welding resistance etc. successively.
Heavy copper refers to and carries out heavy Copper treatment by rigid-flexible in conjunction with pcb board, deposition one deck thin copper layer; Heavy copper thickness can be 0.3 ~ 0.7 μm, such as 0.5 μm.
Plate electricity refers to that the thin copper layer heavy copper being got on by electric plating of whole board method thickeies;
Then carrying out contraposition exposure at the rigid-flexible of plate electricity in conjunction with pcb board sticking one deck light-sensitive surface, re-using sodium carbonate liquid medicine and unexposed light-sensitive surface development is fallen to form line pattern; This step specifically comprises: the coating of nog plate, pad pasting, wet film, contraposition exposure, development.
After nog plate drying, sticking dry film, with ultraviolet exposure, the dry film limit after exposure is hard, and meeting weak base can not dissolve, and meeting highly basic can dissolve, and unexposed portion chance weak base just can dissolve, so just can by Graphic transitions on copper face.
Nog plate speed is that 2.5 ~ 3.2mm/min(is as 3 mm/min), wear scar width is that 8 ~ 14mm(is as 12 mm/min), nog plate post-baking temperature is 80 ~ 90 DEG C (as 85 DEG C).
Pad pasting speed is 1.5m/min, and pad pasting pressure is 5kg/cm 2, pad pasting temperature is 110 DEG C, and die temperature is 40 ~ 60 DEG C (as 50 DEG C).
Wet film is coated with: major control ink viscosity, coating speed, coating thickness etc., coating duration is first surface is 5 ~ 10 minutes, the second 10 ~ 20 minutes, face.
Exposure: major control aligning accuracy, exposure energy, exposure light chi (6 ~ 8 grades of epiphragmas), the time of staying etc.
Development: developing powder is 1.5 ~ 2.2m/min, and development temperature is 30 DEG C, and developer pressure is 1.4 ~ 2kg/cm 2, developer solution is sodium carbonate liquid medicine (sodium carbonate mass percent is 0.85 ~ 1.3%, as 1%).
In sum, the present invention fills row peelable glue when to window owing to have employed screen printing technique, and the manual rubberizing before replacement, has the following advantages: 1, very big improve production efficiency, reduces labour intensity; 2, for different size, difform flexible region all can be carried out printing and be filled, and need not consider the matching of gummed paper and flexible region geomery again, so improve versatility.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.

Claims (4)

1. rigid-flexible in conjunction with a PCB plate production method, it is characterized in that, comprise step:
A, make the silk screen film, under silk screen, the region ratio of oil level is windowed the monolateral little 1mm of groove;
B, carry out the printing of acid and alkali-resistance peelable glue, groove of windowing is filled and is covered;
C, carry out baking process, acid and alkali-resistance peelable glue is solidified;
D, carry out heavy copper plating, after having electroplated, acid and alkali-resistance peelable glue is torn.
2. according to claim 1 rigid-flexible in conjunction with PCB plate production method, it is characterized in that, the raw material in acid and alkali-resistance peelable glue is epoxy resin and vinyl chloride copolymer.
3. according to claim 1 rigid-flexible in conjunction with PCB plate production method, it is characterized in that, in described step C, curing temperature is 150 DEG C.
4. according to claim 1 rigid-flexible in conjunction with PCB plate production method, it is characterized in that, in described step C, curing time is 30 minutes.
CN201510383829.9A 2015-07-03 2015-07-03 A kind of rigid-flexible combination PCB plate production method Active CN104968164B (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106535507A (en) * 2016-11-02 2017-03-22 江苏弘信华印电路科技有限公司 Novel de-cap method of rigid-flex board
CN106659002A (en) * 2017-01-07 2017-05-10 江西凯强实业有限公司 Manufacturing process for rigid-flexible combined board for mobile phone camera
CN107072060A (en) * 2017-05-25 2017-08-18 江门崇达电路技术有限公司 A kind of method for solving thin plate circuit dog tooth
CN107708339A (en) * 2017-09-26 2018-02-16 深圳明阳电路科技股份有限公司 A kind of rigid-flex combined board window of flex preparation method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750455A (en) * 1993-08-06 1995-02-21 Mitsui Toatsu Chem Inc Rigid/flexible printed wiring board and its manufacture
US20070272654A1 (en) * 2006-05-25 2007-11-29 Advanced Semiconductor Engineering Inc. Method for Manufacturing Circuit Board
CN102970828A (en) * 2012-11-30 2013-03-13 成都航天通信设备有限责任公司 Method for manufacturing rigidity-flexibility combined printing circuit board
CN103369852A (en) * 2013-05-08 2013-10-23 无锡江南计算技术研究所 Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern
CN103384444A (en) * 2013-07-30 2013-11-06 博敏电子股份有限公司 Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750455A (en) * 1993-08-06 1995-02-21 Mitsui Toatsu Chem Inc Rigid/flexible printed wiring board and its manufacture
US20070272654A1 (en) * 2006-05-25 2007-11-29 Advanced Semiconductor Engineering Inc. Method for Manufacturing Circuit Board
CN102970828A (en) * 2012-11-30 2013-03-13 成都航天通信设备有限责任公司 Method for manufacturing rigidity-flexibility combined printing circuit board
CN103369852A (en) * 2013-05-08 2013-10-23 无锡江南计算技术研究所 Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern
CN103384444A (en) * 2013-07-30 2013-11-06 博敏电子股份有限公司 Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106535507A (en) * 2016-11-02 2017-03-22 江苏弘信华印电路科技有限公司 Novel de-cap method of rigid-flex board
CN106659002A (en) * 2017-01-07 2017-05-10 江西凯强实业有限公司 Manufacturing process for rigid-flexible combined board for mobile phone camera
CN107072060A (en) * 2017-05-25 2017-08-18 江门崇达电路技术有限公司 A kind of method for solving thin plate circuit dog tooth
CN107708339A (en) * 2017-09-26 2018-02-16 深圳明阳电路科技股份有限公司 A kind of rigid-flex combined board window of flex preparation method

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Inventor after: Wang Jun

Inventor after: Fu Fengqi

Inventor after: Xie Lunkui

Inventor after: Liu Bin

Inventor after: Zhang Chuanchao

Inventor before: Wang Jun

Inventor before: Xie Lunkui

Inventor before: Liu Bin

Inventor before: Zhang Chuanchao

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